반도체 레이저를 제작하는 방법
    11.
    发明授权
    반도체 레이저를 제작하는 방법 有权
    制造半导体激光的方法

    公开(公告)号:KR101471670B1

    公开(公告)日:2014-12-10

    申请号:KR1020080068683

    申请日:2008-07-15

    Abstract: 본발명은공공(空孔)의배열을갖는포토닉결정구조를포함하는반도체레이저를제작하는방법으로서, 기판(W2)을성장로(13)에세트하여, 캐리어가스(질소)를흘리면서성장로(13)의온도를성장온도(T)까지상승시킨다. 이승온중에패턴형성된 InGaN층(17a)의개구(17b)가영향을받아, 개구(17b)에서의 AlGaN 성장및 이동이 AlGaN의표면에비해억제된다. 질화갈륨계반도체층(23)(예컨대 GaN층)을 InGaN층(17a) 상에형성한다. 질화갈륨계반도체층(AlGaN)(23)은개구(17b)에대응하는공공(25)을형성하도록성장한다. 이에따라, 이차원포토닉결정의이차원회절격자(26)가형성된다.

    포토닉 결정 레이저 및 포토닉 결정 레이저의 제조방법
    12.
    发明公开
    포토닉 결정 레이저 및 포토닉 결정 레이저의 제조방법 有权
    光子晶体激光器和制造光子晶体激光的方法

    公开(公告)号:KR1020090129461A

    公开(公告)日:2009-12-16

    申请号:KR1020097020953

    申请日:2008-01-29

    Abstract: A photonic crystal laser (100) is provided with an n-type substrate (111), an n-type clad layer (112), an active layer (113), a p-type clad layer (116), a photonic crystal layer (115), a p-type electrode (118), an n-type electrode (119) and a mounting member (120). The n-type clad layer (112) is formed on a first surface (111a) of the n-type substrate (111). The active layer (113) is formed on the n-type clad layer (112). The p-type clad layer (116) is formed on the active layer (113). The photonic crystal layer (115) is formed between the n-type clad layer (112) and the active layer (113) or between the active layer (113) and the p-type clad layer (116), and includes a photonic crystal section (115a). The p-type electrode (118) is formed on the photonic crystal section (115a). The n-type electrode (119) is formed on a second surface (111b), and is composed of a light transmitting section (119a) arranged at a position facing the photonic crystal section (115a), and an outer circumference section (119b) having a light transmittance lower than that of the light transmitting section (119a).

    Abstract translation: 光子晶体激光器(100)设置有n型衬底(111),n型覆盖层(112),有源层(113),p型覆盖层(116),光子晶体层 (115),p型电极(118),n型电极(119)和安装部件(120)。 n型覆盖层(112)形成在n型衬底(111)的第一表面(111a)上。 有源层(113)形成在n型覆层(112)上。 p型覆盖层(116)形成在有源层(113)上。 光子晶体层(115)形成在n型覆盖层(112)和有源层(113)之间或有源层(113)与p型覆盖层(116)之间,并且包括光子晶体 (115a)。 p型电极(118)形成在光子晶体部(115a)上。 n型电极(119)形成在第二面(111b)上,由配置在面向光子晶体部(115a)的位置的透光部(119a)和外周部(119b)构成, 透光率低于透光部(119a)的透光率。

    면발광 레이저 소자 및 그 제조 방법, 및 면발광 레이저 어레이 및 그 제조 방법
    15.
    发明公开
    면발광 레이저 소자 및 그 제조 방법, 및 면발광 레이저 어레이 및 그 제조 방법 无效
    表面发射激光元件及其制造方法和表面发射激光阵列及其制造方法

    公开(公告)号:KR1020090038028A

    公开(公告)日:2009-04-17

    申请号:KR1020097004358

    申请日:2007-05-21

    Abstract: A method for manufacturing a surface emitting laser element (1) comprises a step of preparing conductive GaN composite region substrate including a high-dislocation density high-conductivity region (10a), a low-dislocation density high-conductivity region (10b), and low-dislocation density low-conductivity region (10c) as a conductive GaN substrate (10), a semiconductor layer multilayer-body fabricating step of fabricating III-V group compound semiconductor layer multilayer bodies (20) including a light-emitting layer (200) on the substrate, and an electrode forming step of forming a semiconductor-side electrode (15) and a substrate-side electrode (11). The method is characterized in that the semiconductor layer and the electrodes are so formed that the light-emitting region (200a) which is formed in the light-emitting layer (200) and into which carriers flows is in the upper portion of the low-dislocation density high-conductivity region (10b). Thus, a surface emitting laser element where light emission from the light-emitting region is uniform can be produced with high production yield.

    Abstract translation: 一种制造表面发射激光器元件(1)的方法包括制备包括高位错密度高导电性区域(10a),低位错密度高导电性区域(10b)的导电性GaN复合区域基板的工序,以及 作为导电性GaN衬底(10)的低位错密度低导电区域(10c),制造包括发光层(200)的III-V族化合物半导体层多层体(20)的半导体层多层体制造工序 )和形成半导体侧电极(15)和基板侧电极(11)的电极形成工序。 该方法的特征在于,形成半导体层和电极,使得形成在发光层(200)中并且载流子流入的发光区域(200a)位于低通滤波器的上部, 位错密度高导电区域(10b)。 因此,能够以高的制造成品生产发光区域的发光均匀的表面发射激光元件。

Patent Agency Ranking