Abstract:
The present invention relates to a manufacturing method of a thin film transistor and, more specifically, to a manufacturing method of a thin film transistor using a self-aligned channel forming method, an in-plane gate forming method, a body metal contact forming technique, and an interlayer forming technique controlling a semiconductor/metal junction.
Abstract:
The present invention relates to a method for manufacturing a heterojunction solar cell, which includes the steps of: providing an N-type silicon substrate; manufacturing a P-type zinc oxide layer on the upper side of the N-type silicon substrate with an in-situ P-type doping method to inject a V group dopant to the zinc oxide layer formed on the N-type silicon substrate while performing a thermal process after the zinc oxide layer is deposited on the upper side of the N-type silicon substrate; and forming a PN junction between the N-type silicon substrate and the P-type zinc oxide layer. [Reference numerals] (1) N-type silicon substrate;(2) P-type zinc oxide layer;(3) Insulator film
Abstract:
PURPOSE: A method for fabricating an aluminum oxide film for passivation of a single C-Si solar cell capable of controlling a negative fixed charge density is provided to improve the conversion efficiency of a solar cell by depositing a zinc oxide film on an interlayer. CONSTITUTION: A lower aluminum oxide film (2) is deposited on a silicon substrate (1). A zinc oxide film (3) is deposited on an interlayer. The thickness of the zinc oxide film is controlled by the nanometer. The zinc oxide film is used as the interlayer between the upper and the lower aluminum oxide film. The zinc oxide film is formed on the upper surface of the lower aluminum oxide film. [Reference numerals] (1) Silicon substrate; (2) Lower aluminum oxide thin film (BL); (3) Zinc oxide thin film (ML); (4) Upper aluminum oxide thin film (TL)