Abstract:
PROBLEM TO BE SOLVED: To provide an improved method for determining magnification of a projection system which is used with a projection lithography. SOLUTION: The method measures magnification of the projection system of a lithography projection device comprising an image sensor capable of detecting a spatial image projected by the projection system. The method includes a step for projecting the image of one component in a two-component marker which is sensitive to overlay error between prints of two components, and a step for measuring a position of the component of two-component marker of the projected image using an image sensor. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a sensor at a substrate level suitable for use in a system having high sensitivity and NA. SOLUTION: A sensor used at a substrate level in a lithography system having high NA has a transparent plate covering sensing elements, and arrangement for improving coupling between radiation and the sensing elements. The arrangement includes a Fresnel lens, a holographic optical element, a reverse Winston cone, a spherical lens, and surface roughening. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
A method and apparatus make use of data representing changes in wavelength of a radiation source to provide control of focal plane position or to provide correction of senso data. In the first aspect, the wavelength variation data is provided to control systems that control focus by moving apparatus components including, for example, the mask table (MT), the substrate table (WT) or optical elements of the projection optical system (PS). In the second aspect, variation data is used in correcting, e.g., focal plane position data measured by an inboard sensor, such as a transmitted image sensor. The two aspects may be combined in a single apparatus or may be used separately.
Abstract:
The invention relates to an image for detection of an aerial pattern comprising spatial differences in radiation intensity in a cross section of a beam of radiation in a lithographic apparatus for exposing a substrate. The image sensor comprises a lens (5) arranged to form a detection image of the aerial pattern and an image detector (6) arranged to measure radiation intensities in- a plurality, of positions in the detection image.
Abstract:
RADIATION DETECTOR, METHOD OF MANUFACTURING A RADIATION DETECTOR AND LITHOGRAPHIC APPARATUS COMPRISING A RADIATION DETECTOR The invention relates to a radiation detector, a method of manufacturing a radiation detector and a lithographic apparatus comprising a radiation detector. The radiation detector has a radiation-sensitive surface. The radiation-sensitive surface is sensitive for radiation with a wavelength between 10 - 200 nm and/or for charged particles. The radiation detector has a silicon substrate, a dopant layer, a first electrode and a second electrode. The silicon substrate is provided in a surface area at a first surface side with doping profile of a certain conduction type. The dopant layer is provided on the first surface side of the silicon substrate. The dopant layer has a first layer of dopant material and a second layer. The second layer is a diffusion layer which is in contact with the surface area at the first surface side of the silicon substrate. The first electrode is connected to dopant layer. The second electrode is connected to the Silicon substrate.
Abstract:
A sensor for use at substrate level in a high-NA lithographic apparatus has a transparent plate covering a sensing element and arrangements to improve coupling of radiation into the sensing element, including Fresnel lenses, holographic optical elements, inverted Winston Cones, spherical lenses and surface roughening.
Abstract:
A sensor (30) for use at substrate level in a high-NA lithographic apparatus has a transparent plate (22) covering a sensing element (25) and arrangements to improve coupling of radiation into the sensing element, including Fresnel lenses (31), holographic optical elements, inverted Winston Cones, spherical lenses and surface roughening.
Abstract:
Ein Verfahren zum Vorhersagen einer Ablenkung eines Pellikels, die während der Bewegung des Pellikels in einer Lithografie-Vorrichtung auftreten wird, wobei das Verfahren das Empfangen von Parametern bezüglich der Eigenschaften des Pellikels und das Empfangen von Parametern bezüglich der erwarteten Bewegung des Pellikels beinhaltet. Die Parameter werden auf ein Modell angewendet, das die Ablenkung des Pellikels als Funktion dieser Parameter vorhersagt. Das Modell beinhaltet eine Vielzahl von Teilmodellen, die sich auf verschiedene Komponenten der Ablenkung des Pellikels beziehen. Eine Ausgabe des Modells kann verwendet werden, um einen lithografischen Fehler, der mit der vorhergesagten Ablenkung des Pellikels assoziiert ist, vorherzusagen und zu reduzieren.