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公开(公告)号：SG11202110275QA
公开(公告)日：2021-10-28
申请号：SG11202110275Q
申请日：2020-06-19
Applicant: IBM
Inventor： JINKA OBLESH , OLIVADESE SALVATORE , HART SEAN , BRONN NICHOLAS , CHOW JERRY , BRINK MARKUS , GUMANN PATRYK , BOGORIN DANIELA
IPC: H01L23/367 , F25D19/00
Abstract: A thermalization structure is formed using a cover configured with a set of pillars, the cover being a part of a cryogenic enclosure of a low temperature device (LTD). A chip including the LTD is configured with a set of cavities, a cavity in the set of cavities having a cavity profile. A pillar from the set of pillars and corresponding to the cavity has a pillar profile such that the pillar profile causes the pillar to couple with the cavity of the cavity profile within a gap tolerance to thermally couple the chip to the cover for heat dissipation in a cryogenic operation of the chip.
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公开(公告)号：SG11202110239YA
公开(公告)日：2021-10-28
申请号：SG11202110239Y
申请日：2020-04-06
Applicant: IBM
Inventor： ADIGA VIVEKANANDA , SANDBERG MARTIN , CHOW JERRY , PAIK HANHEE
Abstract: A qubit includes a substrate, and a first capacitor structure having a lower portion formed on a surface of the substrate and at least one first raised portion extending above the surface of the substrate. The qubit further includes a second capacitor structure having a lower portion formed on the surface of the substrate and at least one second raised portion extending above the surface of the substrate. The first capacitor structure and the second capacitor structure are formed of a superconducting material. The qubit further includes a junction between the first capacitor structure and the second capacitor structure. The junction is disposed at a predetermined distance from the surface of the substrate and has a first end in contact with the first raised portion and a second end in contact with the second raised portion.
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公开(公告)号：AU2020296882A1
公开(公告)日：2021-10-14
申请号：AU2020296882
申请日：2020-06-15
Applicant: IBM
Inventor： CHOW JERRY , ROSENBLATT SAMI
Abstract: A quantum computing device (300) is formed using a first chip (302) and a second chip (306), the first chip having a first substrate (303), a first set of pads (312 A,B), and a set of Josephson junctions (304) disposed on the first substrate. The second chip has a second substrate (307), a second set of pads (308) disposed on the second substrate opposite the first set of pads, and a second layer (310 A, B) formed on a subset of the second set of pads. The second layer is configured to bond the first chip and the second chip. The subset of the second set of pads corresponds to a subset of the set of Josephson junctions selected to avoid frequency collision between qubits in a set of qubits. A qubit is formed using a Josephson junction from the subset of Josephson junctions and another Josephson junction not in the subset being rendered unusable for forming qubits.
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公开(公告)号：DE112014000501T5
公开(公告)日：2016-01-28
申请号：DE112014000501
申请日：2014-01-21
Applicant: IBM
Inventor： MERKEL SETH , STEFFEN MATTHIAS , CHOW JERRY , RIGETTI CHAD TYLER , GAMBETTA JAY
IPC: H01L39/22
Abstract: Eine Einheit schließt ein Gehäuse, mindestens zwei im Gehäuse angeordnete Qubits und einen Resonator ein, der im Gehäuse angeordnet ist und mit den mindestens zwei Qubits gekoppelt ist, wobei die mindestens zwei Qubits bei einer festen Frequenz unterhalten werden und über den Resonator statisch miteinander gekoppelt sind, wobei Energieniveaus |03> und |12> nahe ausgerichtet sind, wobei ein an das Qubit angelegtes eingestelltes Mikrowellensignal eine Zwei-Qubit-Phasenwechselwirkung aktiviert.
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公开(公告)号：AU2021417883B2
公开(公告)日：2025-01-30
申请号：AU2021417883
申请日：2021-12-30
Applicant: IBM
Inventor： GUMANN PATRYK , GRENDANIN VALERIO , HART SEAN , MCKAY DAVID , CHOW JERRY , ZARSKY DAVID , BAUER GILBERT
Abstract: A cryostat (100), comprising: a thermal shield (210) extending between a thermal stage (141) and a base structure (160) coupled to a bottom plate (116) of an outer vacuum chamber (110), the thermal stage (141) coupled to a top plate (114) of the outer vacuum chamber (110), the thermal shield (210) providing access to a sample mounting surface (430) encompassed within the thermal shield (210) from a region external to the outer vacuum chamber (110) via the top and bottom plates (114, 116) of the outer vacuum chamber (110).
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Patent Agency Ranking
公开(公告)号：AU2021343288B2
公开(公告)日：2024-05-02
申请号：AU2021343288
申请日：2021-09-17
Applicant: IBM
Inventor： GAMBETTA JAY , CHOW JERRY , MAGESAN EASWAR , KANDALA ABHINAV , MINEV ZLATKO
Abstract: Devices and/or computer-implemented methods to facilitate a cross-resonance operation in a dispersive regime of a qubit frequency space are provided. According to an embodiment, a device can comprise a first qubit having a first operating frequency and a first anharmonicity. The device can further comprise a second qubit that couples to the first qubit to perform a cross-resonance operation. The second qubit having a second operating frequency and a second anharmonicity. A detuning between the first operating frequency and the second operating frequency is larger than the first anharmonicity and the second anharmonicity.
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公开(公告)号：AU2020296292B2
公开(公告)日：2022-10-13
申请号：AU2020296292
申请日：2020-06-19
Applicant: IBM
Inventor： JINKA OBLESH , OLIVADESE SALVATORE BERNARDO , HART SEAN , BRONN NICHOLAS TORLEIV , CHOW JERRY , BRINK MARKUS , GUMANN PATRYK , BOGORIN DANIELA FLORENTINA
IPC: F25D19/00 , H01L23/367
Abstract: A thermalization structure is formed using a cover configured with a set of pillars, the cover being a part of a cryogenic enclosure of a low temperature device (LTD). A chip including the LTD is configured with a set of cavities, a cavity in the set of cavities having a cavity profile. A pillar from the set of pillars and corresponding to the cavity has a pillar profile such that the pillar profile causes the pillar to couple with the cavity of the cavity profile within a gap tolerance to thermally couple the chip to the cover for heat dissipation in a cryogenic operation of the chip.
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公开(公告)号：IL288977D0
公开(公告)日：2022-02-01
申请号：IL28897721
申请日：2021-12-13
Applicant: IBM , JINKA OBLESH , OLIVADESE SALVATORE BERNARDO , HART SEAN , BRONN NICHOLAS TORLEIV , CHOW JERRY , BRINK MARKUS , GUMANN PATRYK , BOGORIN DANIELA FLORENTINA
Inventor： JINKA OBLESH , OLIVADESE SALVATORE BERNARDO , HART SEAN , BRONN NICHOLAS TORLEIV , CHOW JERRY , BRINK MARKUS , GUMANN PATRYK , BOGORIN DANIELA FLORENTINA
IPC: F25D19/00 , H01L21/265 , H01L23/367 , H01L23/44
Abstract: A thermalization structure is formed using a cover configured with a set of pillars, the cover being a part of a cryogenic enclosure of a low temperature device (LTD). A chip including the LTD is configured with a set of cavities, a cavity in the set of cavities having a cavity profile. A pillar from the set of pillars and corresponding to the cavity has a pillar profile such that the pillar profile causes the pillar to couple with the cavity of the cavity profile within a gap tolerance to thermally couple the chip to the cover for heat dissipation in a cryogenic operation of the chip.
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公开(公告)号：DE112014000501B4
公开(公告)日：2021-12-23
申请号：DE112014000501
申请日：2014-01-21
Applicant: IBM
Inventor： CHOW JERRY , GAMBETTA JAY , MERKEL SETH , RIGETTI CHAD TYLER , STEFFEN MATTHIAS
IPC: G06N10/00 , B82Y10/00 , H01L39/00 , H01L49/00 , H03K19/195
Abstract: Einheit, umfassend:ein Gehäuse;zwei im Gehäuse angeordnete Qubits, wobei es sich bei jedem der zwei Qubits um ein Transmon-Qubit handelt; undeinen im Gehäuse angeordneten und mit den zwei Qubits gekoppelten Resonator,wobei die zwei Qubits bei einer festen Frequenz unterhalten werden und über den Resonator statisch miteinander gekoppelt sind,wobei Energieniveaus |03> und |12> nahe abgestimmt sind,wobei ein an das Qubit angelegtes eingestelltes Mikrowellensignal eine Zwei-Qubit-Phasenwechselwirkung aktiviert,wobei die zwei Qubits über ein mikrowellenaktiviertes Gatter mit gesteuerter Phase (microwave-activated controlled-phase (MAP) gate) interagieren,wobei eine mikrowellenaktivierte Phase erzeugt wird, wenn ein Zwei-Qubit|11> -Zustand sich aufgrund des eingestellten Mikrowellensignals von einer Summe von Zuständen |01> und |10> unterscheidet,wobei sich die Energiedifferenz zwischen |12> und |11> von |02> und |01> unterscheidet, wenn das eingestellte Mikrowellensignal angelegt wird,wobei die Zustände |00>, |01 >, |10> und |11> einen Zwei-Qubit-Rechenteilraum bilden.
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公开(公告)号：SG11202110352VA
公开(公告)日：2021-10-28
申请号：SG11202110352V
申请日：2020-06-15
Applicant: IBM
Inventor： CHOW JERRY , ROSENBLATT SAMI
Abstract: A quantum computing device is formed using a first chip and a second chip, the first chip having a first substrate, a first set of pads, and a set of Josephson junctions disposed on the first substrate. The second chip has a second substrate, a second set of pads disposed on the second substrate opposite the first set of pads, and a second layer formed on a subset of the second set of pads. The second layer is configured to bond the first chip and the second chip. The subset of the second set of pads corresponds to a subset of the set of Josephson junctions selected to avoid frequency collision between qubits in a set of qubits. A qubit is formed using a Josephson junction from the subset of Josephson junctions and another Josephson junction not in the subset being rendered unusable for forming qubits.
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