公开(公告)号：AU2003293051A1

公开(公告)日：2004-08-10

申请号：AU2003293051

申请日：2003-11-25

Applicant: IBM

Inventor： HUMENIK JAMES N ,  KNICKERBOCKER JOHN U ,  VALLABHANENI RAO V ,  GOVINDARAJAN NATARAJAN ,  AHMAD UMAR ,  BEZAMA RASHID J

IPC: B01L3/00 ,  B29C65/00 ,  B32B18/00 ,  C03B29/00 ,  C04B33/34 ,  C04B37/00

Abstract: A plate for use in mixing and testing materials in the pharmaceutical industry is formed by a method in which apertures in a set of greensheets are formed by a material removal process, at least some of the apertures being filled with a fugitive material that escapes during sintering.

公开(公告)号：DE3936579A1

公开(公告)日：1990-10-11

申请号：DE3936579

申请日：1989-11-03

Applicant: AVX CORP ,  IBM

Inventor： GALVAGNI JOHN ,  OBERSCHMIDT JAMES M ,  HUMENIK JAMES N

IPC: H01G4/12 ,  B24B1/00 ,  H01G20060101 ,  H01G4/228 ,  H01G4/232 ,  H01G4/30

Abstract: An improved method for forming shorting bars on ceramic capacitors of the tab type includes the step of effecting a final polishing of the tab exposed surface utilizing grit or abrasives of a critical size, namely of average particle size in the range of about 2 to about 10 microns. The method further employs thin film metallurgy namely the vacuum deposition or sputtering of one or more layers within specified thickness ranges. There is further disclosed an improved capacitor fabricated in accordance with the method described.

公开(公告)号：FR2645337A1

公开(公告)日：1990-10-05

申请号：FR8914864

申请日：1989-11-13

Applicant: AVX CORP ,  IBM

Inventor： GALVAGNI JOHN ,  OBERSCHMIDT JAMES M ,  HUMENIK JAMES N

IPC: H01G4/12 ,  B24B1/00 ,  H01G20060101 ,  H01G4/228 ,  H01G4/232 ,  H01G4/30

Abstract: An improved method for forming shorting bars on ceramic capacitors of the tab type includes the step of effecting a final polishing of the tab exposed surface utilizing grit or abrasives of a critical size, namely of average particle size in the range of about 2 to about 10 microns. The method further employs thin film metallurgy namely the vacuum deposition or sputtering of one or more layers within specified thickness ranges. There is further disclosed an improved capacitor fabricated in accordance with the method described.

公开(公告)号：CA1100150A

公开(公告)日：1981-04-28

申请号：CA303002

申请日：1978-05-10

Applicant: IBM

Inventor： HUMENIK JAMES N ,  POWELL JIMMIE L ,  TUMMALA RAO R

IPC: B41J2/135 ,  B41J2/16 ,  C03C3/076 ,  C03C3/087 ,  C03C3/089 ,  C03C3/091 ,  C03C4/20 ,  C03C3/04

Abstract: The lifetime of multiiple capillary nozzle assemblles embeddcd in a glass mass, of a multiple nozzle ink-jet printer, can be increased and the thermal and mechanical compatibility of thc resulting package enhanccd by fabrication of thc nozzles from glass compositions comprised o and MgO. Inclusion of ZrO2 as well as minor amounts of BaO, MgO, CaO, and Al2O3 enhances the alkali resistance of the glass nozzles. Also, the high SiO, contcnt of the glasses combined with thc presence of ZrO2, MgO, CaO, and Al2O3 imparts an acid resistance to the nozzles.

公开(公告)号：FR2399981A1

公开(公告)日：1979-03-09

申请号：FR7820728

申请日：1978-07-05

Applicant: IBM

Inventor： HUMENIK JAMES N ,  POWELL JIMMIE L ,  TUMMALA RAO R

IPC: B41J2/135 ,  B41J2/16 ,  C03C3/076 ,  C03C3/087 ,  C03C3/089 ,  C03C3/091 ,  C03C4/20 ,  C03C3/04 ,  B05B1/22 ,  B41J3/04

Abstract: The lifetime of multiple capillary nozzle assemblies embedded in a glass mass, of a multiple nozzle ink-jet printer, can be increased and the thermal and mechanical compatibility of the resulting package enhanced by fabrication of the nozzles from glass compositions comprised of SiO2, ZrO2, Na2O, K2O and MgO. Inclusion of ZrO2 as well as minor amounts of BaO, MgO, CaO, and Al2O3 enhances the alkali resistance of the glass nozzles. Also, the high SiO2 content of the glasses combined with the presence of ZrO2, MgO, CaO, and Al2O3 imparts an acid resistance to the nozzles.

公开(公告)号：GB2230140B

公开(公告)日：1994-04-27

申请号：GB8921195

申请日：1989-09-19

Applicant: AVX CORP ,  IBM

Inventor： GALVAGNI JOHN ,  OBERSCHMIDT JAMES M ,  HUMENIK JAMES N

IPC: H01G4/12 ,  B24B1/00 ,  H01G20060101 ,  H01G4/228 ,  H01G4/232 ,  H01G4/30

Abstract: An improved method for forming shorting bars on ceramic capacitors of the tab type includes the step of effecting a final polishing of the tab exposed surface utilizing grit or abrasives of a critical size, namely of average particle size in the range of about 2 to about 10 microns. The method further employs thin film metallurgy namely the vacuum deposition or sputtering of one or more layers within specified thickness ranges. There is further disclosed an improved capacitor fabricated in accordance with the method described.

公开(公告)号：GB2230140A

公开(公告)日：1990-10-10

申请号：GB8921195

申请日：1989-09-19

Applicant: AVX CORP ,  IBM

Inventor： GALVAGNI JOHN ,  OBERSCHMIDT JAMES M ,  HUMENIK JAMES N

IPC: H01G4/12 ,  B24B1/00 ,  H01G20060101 ,  H01G4/228 ,  H01G4/232 ,  H01G4/30

Abstract: An improved method for forming shorting bars on ceramic capacitors of the tab type includes the step of effecting a final polishing of the tab exposed surface utilizing grit or abrasives of a critical size, namely of average particle size in the range of about 2 to about 10 microns. The method further employs thin film metallurgy namely the vacuum deposition or sputtering of one or more layers within specified thickness ranges. There is further disclosed an improved capacitor fabricated in accordance with the method described.

公开(公告)号：CA1236930A

公开(公告)日：1988-05-17

申请号：CA504664

申请日：1986-03-20

Applicant: IBM

Inventor： CHURCHWELL ROBERT W ,  FLAITZ PHILIP L ,  HUMENIK JAMES N

IPC: H01L23/50 ,  H01L21/48 ,  H01R12/04 ,  H05K3/34 ,  H01L27/00 ,  H01L21/70

Abstract: A METHOD FOR USE IN BRAZING AN INTERCONNECT PIN TO A METALLIZATION PATTERN SITUATED ON A BRITTLE DIELECTRIC SUBSTRATE A method for use in brazing an interconnect pin to a portion of metallization pattern (e.g. a pad) existing on a brittle dielectric substrate, such as a multi-layered ceramic (MLC) substrate, is disclosed. A dielectric layer is formed with appropriate annular openings. Each opening provides a closed containment wall, which extends around and above the pad, to hold the brazing alloy. Each circular containment wall is concentrically aligned with its associated pad and exposes an area, of each pad, having a smaller diameter than that of the entire pad. The containment walls serve to prevent the brazing alloy from coming into contact with any edge of the pads.

公开(公告)号：DE3273531D1

公开(公告)日：1986-11-06

申请号：DE3273531

申请日：1982-06-02

Applicant: IBM

Inventor： DOUGHERTY WILLIAM E ,  FEINBERG IRVING ,  HUMENIK JAMES N ,  PLATT ALAN

IPC: H01L27/04 ,  H01G2/06 ,  H01G4/06 ,  H01G4/10 ,  H01G4/12 ,  H01G4/228 ,  H01G4/30 ,  H01L21/822 ,  H01L21/8242 ,  H01L27/10 ,  H01L27/108 ,  H01G1/14 ,  H01G1/035

Abstract: A decoupling thin film capacitor for mounting on an integrate circuit multi-layer ceramic. A bottom layer metallurgy (2) is evaporated or sputtered onto a carrier (1). A high dielectric layer (3) is deposited, followed by a top metallurgy (4) and an isolating layer (5). Via holes are etched to respective electrode layers, ball limiting metallurgy (6) deposited thereon followed by solder balls (7). The capacitor can be mounted onto a ceramic substrate face down in contact with a compatible footprint.

公开(公告)号：MY117336A

公开(公告)日：2004-06-30

申请号：MYPI20012928

申请日：2001-06-21

Applicant: IBM

Inventor： BERGER DANIEL GEORGE ,  FAROOQ SHAJI ,  HERRON LESTER WYNN ,  HUMENIK JAMES N ,  KNICKERBOCKER JOHN ULRICH ,  PASCO ROBERT WILLIAM ,  PERRY CHARLES H ,  SACHDEV KRISHNA G

IPC: B32B5/16 ,  B32B18/00 ,  G02B6/12 ,  G02B6/00 ,  H01L21/48 ,  H01L23/14 ,  H01L23/498 ,  H05K1/03 ,  H05K1/05 ,  H05K3/46

Abstract: A COMPOSITE ELECTRONIC AND/OR OPTICAL SUBSTRATE INCLUDING POLYMERIC AND CERAMIC MATERIAL WHEREIN THE COMPOSITE SUBSTRATE HAS A DIELECTRIC CONSTANT LESS THAN 4 AND A COEFFICIENT OF THERMAL EXPANSION OF 8 TO 14 PPM/°C AT 100°C. THE COMPOSITE SUBSTRATE MAY BE EITHER CERAMIC-FILLED POLYMERIC MATERIAL OR POLYMER-FILLED CERAMIC MATERIAL. (FIGURE 1)