公开(公告)号：DE3376913D1

公开(公告)日：1988-07-07

申请号：DE3376913

申请日：1983-08-31

Applicant: IBM

Inventor： CHANCE DUDLEY AUGUSTUS ,  HO CHUNG WEN ,  REILEY TIMOTHY CLARK

IPC: H01G2/06 ,  H01G4/12 ,  H01G4/232 ,  H01G4/30 ,  H05K3/34 ,  H01G1/035 ,  H01G1/147

公开(公告)号：AU7214387A

公开(公告)日：1987-11-05

申请号：AU7214387

申请日：1987-04-28

Applicant: IBM

Inventor： HODGSON RODNEY TREVOR ,  JONES HARRY JORDAN ,  LEDERMANN PETER GERARD ,  REILEY TIMOTHY CLARK ,  MOSKOWITZ PAUL ANDREW

IPC: H01L21/60 ,  H01L23/485 ,  H01L23/538 ,  H05K3/40 ,  H01L23/50 ,  H05K1/11

公开(公告)号：DE68920944T2

公开(公告)日：1995-08-10

申请号：DE68920944

申请日：1989-08-24

Applicant: IBM

Inventor： BICKFORD HARRY RANDALL ,  BREGMAN MARK FIELDING ,  CIPOLLA THOMAS MARIO ,  GOW JOHN ,  LEDERMANN PETER GERARD ,  MIERSCH EKKEHARD FRITZ ,  OLSON LEONARD THEODORE ,  PAGNINI DAVID PETER ,  REILEY TIMOTHY CLARK ,  TSOU UH-PO ERIC ,  VILKELIS WALTER VALERIAN

IPC: H01L21/60 ,  H01L23/495 ,  H01L23/498 ,  H01L23/64

公开(公告)号：DE69011233D1

公开(公告)日：1994-09-08

申请号：DE69011233

申请日：1990-05-22

Applicant: IBM

Inventor： BICKFORD HARRY RANDALL ,  BOLAND WILLIAM LEO ,  MORRIS DANIEL PETER ,  REILEY TIMOTHY CLARK

IPC: G01R31/26 ,  G01R31/28 ,  H01L21/60 ,  H01L21/66 ,  H01L23/498 ,  H01L23/544

Abstract: A TAB package comprises an elongated tape (10) which has a plurality of sets of beam leads emplaced thereon and a plurality of electronic devices (28) connected to the beam leads. At least a first beam (32) lead of each set is connected to a common potential terminal (16) on each device, and at least a second beam lead (30) of each set is connected to a power terminal (18). A common potential bus is oriented along the elongated dimension of the tape and connects to the first beam leads, while a power bus is also oriented along the elongated dimension of the tape and is connected to the second beam leads. The application of power to the power bus and the simultaneous grounding of the common potential bus enables all electronic devices on the tape to be simultaneously energized and to be then subjected to an elevated temperature environment for static burn-in testing. To improve current conduction in the power and common potential buses, a tape comprising a non-conductive carrier (42) and a pair of interposer/conductor tapes (41) may be emplaced over the length of the tape bearing the chips. An additional spacer tape (50) is then emplaced over the interposer tape and forces the interposer conductors into contact with the power and common potential buses.

公开(公告)号：DE3788455T2

公开(公告)日：1994-06-23

申请号：DE3788455

申请日：1987-04-10

Applicant: IBM

Inventor： HODGSON RODNEY TREVOR ,  JONES HARRY JORDAN ,  LEDERMANN PETER GERARD ,  REILEY TIMOTHY CLARK ,  MOSKOWITZ PAUL ANDREW

IPC: H01L21/60 ,  H01L23/485 ,  H01L23/538 ,  H05K3/40 ,  H01L23/498 ,  H01L23/52

公开(公告)号：DE3787772T2

公开(公告)日：1994-05-05

申请号：DE3787772

申请日：1987-07-24

Applicant: IBM

Inventor： BRADY MICHAEL JOHN ,  KANG SUNG KWON ,  MOSKOWITZ PAUL ANDREW ,  RYAN JAMES GARDNER ,  REILEY TIMOTHY CLARK ,  WALTON ERICK GREGORY ,  BICKFORD HARRY RANDALL ,  PALMER MICHAEL JOHN

IPC: H01L21/60 ,  H01L23/485 ,  H01L23/48

公开(公告)号：DE3479618D1

公开(公告)日：1989-10-05

申请号：DE3479618

申请日：1984-10-26

Applicant: IBM

Inventor： CHANCE DUDLEY ANGUSTUS ,  REILEY TIMOTHY CLARK ,  SAMPOGNA MICHAEL

IPC: H05K3/10 ,  B28B1/30 ,  H01L21/48 ,  H05K1/03 ,  H05K3/00 ,  H05K3/02 ,  H05K3/04 ,  H05K3/46