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    12.
    发明专利
    未知

    公开(公告)号：DE3671861D1

    公开(公告)日：1990-07-19

    申请号：DE3671861

    申请日：1986-10-23

    Applicant: IBM

    Inventor： PENNINGTON KEITH SAMUEL ,  AFZALI-ARDAKANI ALI ,  SACHDEV KRISHNA GANDHI

    IPC: B41J31/00 ,  B41J31/05 ,  B41M5/26 ,  B41M5/382

    Abstract: The present invention relates to a resistive ribbon (10), for use in a resistive ribbon thermal transfer printing process, of the type which comprises a resistive layer (12) which produces localised heating to effect printing when an electric current is passed therethrough, a thermally fusible ink layer (18) capable of being melted when heated by the localised heating in the resistive layer, and a current return layer (16) of an electrically conductive material, located between the resistive layer (12) and the ink layer (18) and through which the electrical current passes. A ribbon in accordance with the invention is characterised in that the resistive layer (12) includes a phase-separated surface region (14) located adjacent the current return layer (16) and imparting enhanced mechanical and thermal properties to the resistive layer (12).

    Solvent-free epoxy based adhesives for semiconductor chip attachment and process
    15.
    发明专利
    Solvent-free epoxy based adhesives for semiconductor chip attachment and process 未知

    公开(公告)号：SG50837A1

    公开(公告)日：1998-07-20

    申请号：SG1997001778

    申请日：1997-05-29

    Applicant: IBM

    Inventor： BERGER MICHAEL ,  CHACE MARK STEPHEN ,  SACHDEV KRISHNA GANDHI

    IPC: C08G59/30 ,  C08G59/62 ,  C09J163/00 ,  H01L21/52 ,  H01L21/58 ,  C09J11/00 ,  H01L23/29

    Abstract: The present invention discloses chip (die) bond adhesive formulations preferably comprising a siloxane containing epoxide preferably a diglycidyl ether derivative, an anhydride curing additive which is soluble in the epoxide without the use of a solvent, and, optionally comprising, an oligomeric/polymeric co-additive of the type poly(alkyl-acrylate or - methacrylate), in conjunction with thermal and electrically conductive fillers and conventional co-catalysts used for curing epoxy systems to provide reworkable epoxy adhesives. Also disclosed are adhesive formulations comprising a siloxane containing epoxide and a hydroxybenzophenone curing additive which is soluble in the epoxide without the use of a solvent. The chips can be bonded to the substrate by conventional heating and curing techniques. With epoxy adhesive compositions comprising polyacrylate additives, the die bonded assembly can be reworked by heating the assembly to about 180 DEG C to 250 DEG C removing the chip, and rebonding a new chip on the same surface without any effect on the shear strength for die bonded on to gold, copper, silver or a ceramic die pad. Die shear strength using the adhesives remains unchanged when exposed to thermal shock involving -65 DEG C to +150 DEG C excursions, and HAST test at 130 DEG C /85 percent RH (Relative Humidity) or 85 DEG C/85% RH. A method is also provided for using the adhesives to make electronic component assemblies.

    16.
    发明专利
    未知

    公开(公告)号：DE68926143T2

    公开(公告)日：1996-10-24

    申请号：DE68926143

    申请日：1989-09-16

    Applicant: IBM

    Inventor： BRUCE JAMES ALLEN ,  KERBAUGH MICHAEL LYNN ,  KWONG RANEE WAI-LING ,  LEE TANYA NINA ,  LINDE HAROLD GEORGE ,  SACHDEV HARBANS SINGH ,  SACHDEV KRISHNA GANDHI

    IPC: H01L21/302 ,  G03F7/09 ,  G03F7/40 ,  H01L21/027 ,  H01L21/3065

    Abstract: The structure comprises a pattern of a cured polymeric material deposited onto a substrate, said polymeric material having at least one fluorine-containing functional group and of an overlying silylated photoresist material. For forming a structure on a substrate utilizing photolithographic techniques a layer of polymeric material containing a fluorine-containing compound is applied over the substrate and cured. A layer of photoresist material is applied over the polymeric material, imagewise exposed and developed to reveal the image on the underlying polymeric material. Thereafter, the photoresist is silylated, and the then present structure is reactive ion etched to transfer the pattern down to the underlying substrate. The fluorine component provides that the structure or the pattern and the underlying substrate respectively are free of residue and cracking.

    18.
    发明专利
    未知

    公开(公告)号：DE3580996D1

    公开(公告)日：1991-02-07

    申请号：DE3580996

    申请日：1985-04-04

    Applicant: IBM

    Inventor： SACHDEV KRISHNA GANDHI ,  SHEAR STEPHEN ANTHONY ,  PENNINGTON KEITH SAMUEL ,  COHEN MITCHELL SIMMONS

    IPC: B41M5/24

    Abstract: Improved electroerosion recording media are described in which ablatable polymers are used in the electroerosion recording medium. This medium includes at least a substrate or support layer, a base layer which protects the substrate, a thin film of conductive material on the base layer and which can be eroded, and a protective overcoat layer. Ablatable polymers are used as binders in either the base layer or the top protective layer, or both, in order to provide advantages during electroerosion. These ablatable polymers undergo thermally induced depolymerization in such a way that the result is the formation of volatile monomeric or low molecular weight species as the predominant products, with little or no adherent residue.

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