公开(公告)号：DE69712959T2

公开(公告)日：2003-01-23

申请号：DE69712959

申请日：1997-03-21

Applicant: IBM

Inventor： ANGELOPOULOS MARIE ,  YUN-HSIN LIAO ,  SARAF RAVI F

IPC: C08G61/12 ,  H01B1/12

公开(公告)号：SG77619A1

公开(公告)日：2001-01-16

申请号：SG1997004678

申请日：1995-08-21

Applicant: IBM

Inventor： KANG SUNG K ,  GRAHAM TERESITA O ,  PURUSHOTHAMAN SAMPATH ,  ROLDAN JUDITH MARIE ,  SARAF RAVI F

IPC: C08K9/02 ,  B22F1/00 ,  B22F1/02 ,  B22F7/08 ,  C08L101/00 ,  C09D5/24 ,  C09J9/02 ,  C09J11/00 ,  C09J11/02 ,  C09J11/04 ,  C09J101/02 ,  C09J183/08 ,  C09J191/00 ,  C09J197/00 ,  C09J201/00 ,  C23C24/08 ,  H01B1/00 ,  H01B1/22 ,  H01L21/60 ,  H01L23/498 ,  H01R4/04 ,  H05K1/18 ,  H05K3/32

Abstract: A structure and method of fabrication are described. The structure is a combination of a polymeric material (36) and particles (32), e.g. Cu, having an electrically conductive coating (34), e.g. Sn. Heat is applied to fuse the coating of adjacent particles. The polymeric material (36) is a thermoplastic. The structure is disposed between two electrically conductive surfaces (40,42), e.g. chip and substrate pads, to provide electrical interconnection and adhesion between their pads.

公开(公告)号：SG72751A1

公开(公告)日：2000-05-23

申请号：SG1997002768

申请日：1997-08-02

Applicant: IBM

Inventor： BROUILLETTE GUY PAUL ,  DANOVITCH DAVID HIRSCH ,  LIEHR MICHAEL ,  MOTSIFF WILLIAM THOMAS ,  ROLDAN JUDITH MARIE ,  SAMBUCETTI CARLOS JUAN ,  SARAF RAVI F

IPC: H01L21/60 ,  H01L23/556 ,  H05K1/18 ,  H05K3/24 ,  H05K3/32 ,  H05K3/34 ,  H01L21/44 ,  H01L21/98

Abstract: An interconnect system that has low alpha particle emission characteristics for use in an electronic device includes a semiconductor chip that has an upper surface and spaced apart electrically resistive bumps positioned on conductive regions of the upper surface, the electrically resistive bumps are made of a composite material of a polymer and metal particles, and a substrate that has conductive regions bonded to the electrically resistive bumps in a bonding process wherein the electrically resistive bumps convert to electrically conductive bumps after the bonding process.

公开(公告)号：HK1018999A1

公开(公告)日：2000-01-14

申请号：HK98111592

申请日：1998-10-29

Applicant: IBM

Inventor： BRUSIC VLASTA A ,  DAREKAR VIJAY S ,  GAYNES MICHAEL A ,  SARAF RAVI F

IPC: B05D3/02 ,  B05D7/16 ,  B23K35/00 ,  B23K35/02 ,  B23K35/34 ,  B23K35/36 ,  C23C22/02 ,  C23C22/68 ,  C23C30/00 ,  C23F11/14 ,  H05K3/10 ,  H05K3/24 ,  H05K3/28 ,  H05K3/34 ,  H05K ,  C23F ,  B23K

Abstract: Copper-containing surfaces of substrates such as laminated electronic circuit boards are protected by organometallic coatings comprising organic compounds selected from the group consisting of benzimidazoles, alkylimidazoles, benzotriazozles and alkyltriazoles, substituted or unsubstituted, and metal particles of solder-wettable metals or metal solders. The metal particles can be thermally formed in situ from metallic compounds such as noble metal acetates, acetylacetonates and carbonates.

公开(公告)号：CA2159234A1

公开(公告)日：1996-04-21

申请号：CA2159234

申请日：1995-09-27

Applicant: IBM

Inventor： GRAHAM TERESITA O ,  KANG SUNG K ,  PURUSHOTHAMAN SAMPATH ,  ROLDAN JUDITH M ,  SARAF RAVI F

IPC: C08K9/02 ,  B22F1/00 ,  B22F1/02 ,  B22F7/08 ,  C08L101/00 ,  C09D5/24 ,  C09J9/02 ,  C09J11/00 ,  C09J11/02 ,  C09J11/04 ,  C09J101/02 ,  C09J183/08 ,  C09J191/00 ,  C09J197/00 ,  C09J201/00 ,  C23C24/08 ,  H01B1/00 ,  H01B1/22 ,  H01L21/60 ,  H01L23/498 ,  H01R4/04 ,  H05K1/18 ,  H05K3/32 ,  B23K35/26 ,  H01B5/00 ,  B23K1/00

Abstract: A structure and method of fabrication are described. The structure is a combination of a polymeric material and particles, e.g. Cu, having an electrically conductive coating, e.g. Sn. Heat is applied to fuse the coating of adjacent particles. The polymeric material is a thermoplastic. The structure is disposed between two electrically conductive surfaces, e.g. chip and substrate pads, to provide electrical interconnection and adhesion between their pads.

公开(公告)号：MY125463A

公开(公告)日：2006-08-30

申请号：MYPI9703540

申请日：1997-08-04

Applicant: IBM

Inventor： BROUILLETTE GUY PAUL ,  DANOVITCH DAVID HIRSCH ,  LIEHR MICHAEL ,  MOTSIFF WILLIAM THOMAS ,  ROLDAN JUDITH MARIE ,  SAMBUCETTI CARLOS JUAN ,  SARAF RAVI F

IPC: H01L21/44 ,  H01L21/60 ,  H01L23/556 ,  H05K1/18 ,  H05K3/24 ,  H05K3/32 ,  H05K3/34

Abstract: AN INTERCONNECT SYSTEM THAT HAS LOW ALPHA PARTICLE EMISSION CHARACTERISTICS FOR USE IN AN ELECTRONIC DEVICE INCLUDES A SEMICONDUCTOR CHIP (12) THAT HAS AN UPPER SURFACE AND SPACED APART ELECTRICALLY RESISTIVE BUMPS (26,36) POSITIONED ON CONDUCTIVE REGIONS OF THE UPPER SURFACE, THE ELECTRICALLY RESISTIVE BUMPS ARE MADE OF A COMPOSITE MATERIAL OF A POLYMER AND METAL PARTICLES, AND A SUBSTRATE (10) THAT HAS CONDUCTIVE REGIONS BONDED TO THE ELECTRICALLY RESISTIVE BUMPS IN A BONDING PROCESS WHEREIN THE ELECTRICALLY RESISTIVE BUMPS CONVERT TO ELECTRICALLY CONDUCTIVE BUMPS AFTER THE BONDING PROCESS.(FIG.3)

公开(公告)号：SG49985A1

公开(公告)日：1998-06-15

申请号：SG1996011044

申请日：1996-11-04

Applicant: IBM

Inventor： SARAF RAVI F ,  ROLDAN JUDITH MARIE ,  GAYNES MICHAEL ANTHONY ,  BOOTH RICHARD BENTON ,  OSTRANDER STEPHEN PAUL ,  COOPER EMANUEL I ,  SAMBUCETTI CARLOS J

IPC: B23K35/24 ,  B23K35/30 ,  H01B1/22 ,  H01L23/488 ,  H01L23/50 ,  H01R43/02 ,  H05K3/10

公开(公告)号：SG33468A1

公开(公告)日：1996-10-18

申请号：SG1995001167

申请日：1995-08-21

Applicant: IBM

Inventor： KANG SUNG K ,  GRAHAM TERESITA O ,  PURUSHOTHAMAN SAMPATH ,  ROLDAN JUDITH MARIE ,  SARAF RAVI F

IPC: H01R4/02 ,  H05K3/34 ,  H05K3/42