Abstract:
PROBLEM TO BE SOLVED: To provide a cleaning apparatus and a method thereof which can remove particulate contamination substance of a sufficiently small size, even if the substance has a shape of a high aspect ratio. SOLUTION: The apparatus for cleaning a substrate 116 is disclosed. The apparatus is provided with a first head unit 110 and a second head unit 112. The first head unit 110 is arranged proximate to the surface of the substrate and is provided with a first row of channels configured to supply a foam to the surface of the substrate. The second head unit 112 is arranged substantially adjacent to the first head unit and proximate to the surface of the substrate. The second head unit is provided with a second and a third row of channels. The second row of channels 112 is configured to supply a fluid to the surface of the substrate. The third row of channels 114 is configured to cause a vacuum to work on the surface of the substrate. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a technique for removing contaminants from the surface of a wafer. SOLUTION: A cleaning compound is provided with about 0.5 wt.% to about 10 wt.% of a fatty acid dispersed in water, and an amount of a base capable of making a pH of the fatty acid water solution higher than a level where about 50% of the dispersed fatty acid is ionized. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a technique for removing contaminants from a substrate. SOLUTION: A substrate cleaning method is provided with a process of supplying a cleaning solution having a dispersion phase, a continuous phase and particles dispersed in the continuous phase, onto the surface of a substrate; a process of engaging the particles with surface contaminants by pressing one of the particles dispersed in the continuous phase near one of the surface contaminants; and a process of removing the engaged particles and the surface contaminants from the surface of the substrate. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
1 8 METHOD AND SYSTEM FOR USING A TWO-PHASES SUBSTRATE CLEANING COMPOUND ABSTRACT OF THE DISCLOSURE 1511 CLEANING COMPOUNDS, APPARATUS, AND METHODS TO REMOVE CONTAMINANTS FROM A 5 SUBSTRATE SURFACE ARE PROVIDED. AN EXEMPLARY CLEANING COMPOUND TO REMOVE PARTICULATE CONTAMINANTS FROM A SEMICONDUCTOR SUBSTRATE SURFACE IS PROVIDED. THE CLEANING COMPOUND INCLUDES A VISCOUS LIQUID WITH A VISCOSITY BETWEEN ABOUT I CP TO ABOUT 10,000 O. THE CLEANING COMPOUND ALSO INCLUDES A PLURALITY OF SOLID COMPONENTS DISPERSED IN THE VISCOUS LIQUID, THE PLURALITY OF SOLID COMPONENTS INTERACT WITH THE PARTICULATE CONTAMINANTS ON THE SUBSTRATE SURFACE TO REMOVE THE PARTICULATE CONTAMINANTS FROM THE SUBSTRATE SURFACE,
Abstract:
A method for making a solution for use in preparing a surface of a substrate is provided. The method includes providing a continuous medium that adds a polymer material to the continuous medium. A fatty acid is adding to the continuous medium having the polymer material, and the polymer material defines a physical network that exerts forces in the solution that overcome buoyancy forces experienced by the fatty acid, thus preventing the fatty acids from moving within the solution until a yield stress of the polymer material is exceeded by an applied agitation. The applied agitation is from transporting the solution from a container to a preparation station that applies the solution to the surface of the substrate.
Abstract:
METHODS FOR CLEANING USING A TRI-STATE BODY (110) ARE DISCLOSED. A SUBSTRATE (112) HAVING A PARTICLE (102) DEPOSITED THEREON IS PROVIDED. A TRI-STATE BODY THAT HAS A SOLID PORTION (108), LIQUID PORTION (106) AND A GAS PORTION (104) IS GENERATED. A FORCE IS APPLIED OVER THE TRI-STATE BODY TO PROMULGATE AN INTERACTION BETWEEN THE SOLID PORTION AND THE PARTICLE. THE TRI-STATE BODY IS REMOVED ALONG WITH THE PARTICLE FROM THE SURFACE OF THE SUBSTRATE. THE INTERACTION BETWEEN THE SOLID PORTION AND THE PARTICLE CAUSING THE PARTICLE TO BE REMOVED ALONG WITH THE TRI-STATE BODY.
Abstract:
A proximity head including a head surface. The head surface including a first flat region and a plurality of first conduits. Each one of the plurality of first conduits being defined by corresponding one of a plurality of first discrete holes. The plurality of first discrete holes residing in the head surface and extending through the first flat region. The head surface also including a second flat region and a plurality of second conduits. The plurality of second conduits being defined by a corresponding plurality of second discrete holes that reside in the head surface and extend through the second flat region. The head surface also including a third flat region disposed between and adjacent to the first flat region and the second flat region and a plurality of third conduits. The plurality of third conduits being defined by a corresponding plurality of third discrete holes that reside in the head surface and extend through the third flat region. The third conduits being formed at a first angle relative to the third flat region. The first angle being between 30 and 60 degrees. A system and method for processing a substrate with a proximity head is also described.(Fig. 2A)
Abstract:
A METHOD IS PROVIDED FOR REMOVING CONTAMINATION FROM A SUBSTRATE. THE METHOD INCLUDES APPLYING A CLEANING SOLUTION HAVING A DISPERSED PHASE, A CONTINUOUS PHASE AND PARTICLES DISPERSED WITHIN THE CONTINUOUS PHASE TO A SURFACE OF THE SUBSTRATE. THE METHOD INCLUDES FORCING ONE OF THE PARTICLES DISPERSED WITHIN THE CONTINUOUS PHASE PROXIMATE TO ONE OF THE SURFACE CONTAMINANTS. THE FORCING IS SUFFICIENT TO OVERCOME ANY REPULSIVE FORCES BETWEEN THE PARTICLES AND THE SURFACE CONTAMINANTS SO THAT THE ONE OF THE PARTICLES AND THE ONE OF THE SURFACE CONTAMINANTS ARE ENGAGED. THE METHOD ALSO INCLUDES REMOVING THE ENGAGED PARTICLE AND SURFACE CONTAMINANT FROM THE SURFACE OF THE SUBSTRATE. A PROCESS TO MANUFACTURE THE CLEANING MATERIAL IS ALSO PROVIDED.
Abstract:
A METHOD FOR MAKING A SOLUTION FOR USE IN PREPARING A SURFACE OF A SUBSTRATE IS PROVIDED. THE METHOD INCLUDES PROVIDING (602) A CONTINUOUS MEDIUM THAT ADDS (604) A POLYMER MATERIAL TO THE CONTINUOUS MEDIUM. A FATTY ACID IS ADDED TO THE CONTINUOUS MEDIUM HAVING THE POLYMER MATERIAL, AND THE POLYMER MATERIAL DEFINES A PHYSICAL NETWORK THAT EXERTS FORCES IN THE SOLUTION THAT OVERCOME BUOYANCY FORCES EXPERIENCED BY THE FATTY ACID, THUS PREVENTING THE FATTY ACIDS FROM MOVING WITHIN THE SOLUTION UNTIL A YIELD STRESS OF THE POLYMER MATERIAL IS EXCEED BY AN APPLIED AGITATION. THE APPLIED AGITATION IS FROM TRANSPORTING THE SOLUTION FROM A CONTAINER TO A PREPARATION STATION THAT APPLIES THE SOLUTION TO THE SURFACE OF THE SUBSTRATE.
Abstract:
A CLEANING COMPOUND IS PROVIDED. THE CLEANING COMPOUND INCLUDES ABOUT 0.1 WEIGHT PERCENT TO ABOUT 10 WEIGHT PERCENT OF A FATTY ACID DISPERSED IN WATER. THE CLEANING COMPOUND INCLUDES AN AMOUNT OF A BASE SUFFICIENT TO BRING A PH OF THE FATTY ACID WATER SOLUTION TO ABOUT A LEVEL WHERE ABOVE ABOUT 50% OF THE DISPERSED FATTY ACID IS IONIZED. A METHOD FOR CLEANING A SUBSTRATE, A SYSTEM FOR CLEANING A SUBSTRATE, AND A CLEANING SOLUTION PREPARED BY A PROCESS ARE ALSO PROVIDED.