公开(公告)号：AT535935T

公开(公告)日：2011-12-15

申请号：AT04758931

申请日：2004-03-23

Applicant: LAM RES CORP

Inventor： PARKS JOHN

IPC: H01L21/00 ,  B08B7/00 ,  H01L21/683 ,  H01L21/687

Abstract: A wafer processing chamber is provided for allowing a fluid flow and a fluid pressure within the chamber to be controlled in a variable manner. The chamber utilizes removable plates that can be configured to control the fluid flow and the fluid pressure in an inner volume within the chamber. Also, the removable plates can be used to separate the inner volume within the chamber from an outer volume within the chamber. Additionally, a wafer clamping apparatus is provided for use in the chamber. The wafer clamping apparatus uses a pressure differential between a top surface and a bottom surface of the wafer to pull the wafer toward a wafer support structure in contact with the wafer bottom surface, whereby the wafer is secured and maintained in an immobile state. Furthermore, high-pressure chamber configurations are provided.

公开(公告)号：SG128607A1

公开(公告)日：2007-01-30

申请号：SG200604042

申请日：2006-06-14

Applicant: LAM RES CORP

Inventor： LARIOS DE JOHN M ,  RAVKIN MIKE ,  PARKS JOHN ,  KOROLIK MIKHAIL ,  REDEKER FRED C

Abstract: A method for transporting a substrate is provided. In this method, a non-Newtonian fluid is provided and the substrate is suspended in the non-Newtonian fluid. The non-Newtonian fluid is capable of supporting the substrate. Thereafter, a supply force is applied on the non-Newtonian fluid to cause the non-Newtonian fluid to flow, whereby the flow is capable of moving the substrate along a direction of the flow. Apparatuses and systems for transporting the substrate using the non-Newtonian fluid also are described.

公开(公告)号：MY144397A

公开(公告)日：2011-09-15

申请号：MYPI20045299

申请日：2004-12-22

Applicant: LAM RES CORP

Inventor： DAVIS GLENN W ,  WOODS CARL ,  PARKS JOHN ,  REDEKER FRED C ,  RAVKIN MIKE ,  ORBOCK MICHAEL L

IPC: B08B5/04 ,  H01L21/00 ,  H01L21/687

Abstract: AN APPARATUS FOR DRYING A SUBSTRATE (10) INCLUDES A VACUUM MANIFOLD (120) POSITIONED ADJACENT TO AN EDGE WHEEL (102). THE EDGE WHEEL INCLUDES AN EDGE WHEEL GROOVE (104) FOR RECEIVING A PERIPHERAL EDGE OF A SUBSTRATE, AND THE EDGE WHEEL IS CAPABLE OF ROTATING THE SUBSTRATE AT A DESIRED SET VELOCITY. THE VACUUM MANIFOLD INCLUDES A PROXIMITY END (126) HAVING ONE OR MORE VACUUM PORTS (128) DEFINED THEREIN. THE PROXIMITY END IS POSITIONED AT LEAST PARTIALLY WITHIN THE EDGE WHEEL GROOVE, AND USING SUPPLIED VACUUM REMOVES FLUIDS THAT ACCUMULATE IN THE EDGE WHEEL GROOVE AND PREVENTS RE-DEPOSIT OF TRAPPED FLUIDS AROUND THE PERIPHERAL EDGE OF THE SUBSTRATE.

公开(公告)号：IL176467A

公开(公告)日：2011-06-30

申请号：IL17646706

申请日：2006-06-21

Applicant: LAM RES CORP ,  REDEKER FRED C ,  DAVIS GLENN W ,  WOODS CARL ,  PARKS JOHN ,  RAVKIN MIKE ,  ORBOCK MICHAEL L

Inventor： REDEKER FRED C ,  DAVIS GLENN W ,  WOODS CARL ,  PARKS JOHN ,  RAVKIN MIKE ,  ORBOCK MICHAEL L

IPC: H01L21/00 ,  H01L21/687

Abstract: A apparatus for drying a substrate includes a vacuum manifold positioned adjacent to an edge wheel. The edge wheel includes an edge wheel groove for receiving a peripheral edge of a substrate, and the edge wheel is capable of rotating the substrate at a desired set velocity. The vacuum manifold includes a proximity end having one or more vacuum ports defined therein. The proximity end is positioned at least partially within the edge wheel groove, and using supplied vacuum removes fluids that accumulate in the edge wheel groove and prevents re-deposit of trapped fluids around the peripheral edge of the substrate.

公开(公告)号：MY137975A

公开(公告)日：2009-04-30

申请号：MYPI20051477

申请日：2005-04-01

Applicant: LAM RES CORP

Inventor： WOODS CARL ,  SMITH MICHAEL G R ,  PARKS JOHN ,  GARCIA JAMES P ,  LARIOS JOHN M DE

IPC: B05C9/02 ,  B05D1/00 ,  B05D3/12 ,  H01L21/00 ,  H01L21/02 ,  H01L21/027 ,  H01L21/304 ,  H01L21/306

Abstract: AN APPARATUS FOR PROCESSING A SUBSTRATE (108) IS PROVIDED WHICH INCLUDES A FIRST MANIFOLD MODULE (106) TO GENERATE A FLUID MENISCUS (140) ON A SUBSTRATE SURFACE. THE APPARATUS ALSO INCLUDES A SECOND MANIFOLD MODULE (102) TO CONNECT WITH THE FIRST MANIFOLD MODULE (106) AND ALSO TO MOVE THE FIRST MANIFOLD MODULE (106) INTO CLOSE PROXIMITY TO THE SUBSTRATE SURFACE TO GENERATE THE FLUID MENISCUS (140).

公开(公告)号：MY152543A

公开(公告)日：2014-10-31

申请号：MYPI20064619

申请日：2006-12-04

Applicant: LAM RES CORP

Inventor： FREER ERIK M ,  LARIOS JOHN M DE ,  MIKHAYLICHENKO KATRINA ,  RAVKIN MICHAEL ,  KOROLIK MIKHAIL ,  REDEKER FRED C ,  THOMAS CLINT ,  PARKS JOHN

IPC: B08B3/00

Abstract: METHODS FOR CLEANING USING A TRI-STATE BODY (110) ARE DISCLOSED. A SUBSTRATE (112) HAVING A PARTICLE (102) DEPOSITED THEREON IS PROVIDED. A TRI-STATE BODY THAT HAS A SOLID PORTION (108), LIQUID PORTION (106) AND A GAS PORTION (104) IS GENERATED. A FORCE IS APPLIED OVER THE TRI-STATE BODY TO PROMULGATE AN INTERACTION BETWEEN THE SOLID PORTION AND THE PARTICLE. THE TRI-STATE BODY IS REMOVED ALONG WITH THE PARTICLE FROM THE SURFACE OF THE SUBSTRATE. THE INTERACTION BETWEEN THE SOLID PORTION AND THE PARTICLE CAUSING THE PARTICLE TO BE REMOVED ALONG WITH THE TRI-STATE BODY.

公开(公告)号：MY142184A

公开(公告)日：2010-10-15

申请号：MYPI20062783

申请日：2006-06-13

Applicant: LAM RES CORP

Inventor： LARIOS JOHN M DE ,  RAVKIN MIKE ,  PARKS JOHN ,  KOROLIK MIKHAIL ,  REDEKER FRED C

IPC: B65G51/16

Abstract: A METHOD FOR TRANSPORTING A SUBSTRATE IS PROVIDED. IN THIS METHOD, A NON-NEWTONIAN FLUID (210) IS PROVIDED AND THE SUBSTRATE (212) IS SUSPENDED IN THE NON-NEWTONIAN FLUID. THE NON-NEWTONIAN FLUID IS CAPABLE OF SUPPORTING THE SUBSTRATE. THEREAFTER, A SUPPLY FORCE IS APPLIED ON THE NON-NEWTONIAN FLUID TO CAUSE THE NON-NEWTONIAN FLUID TO FLOW, WHEREBY THE FLOW IS CAPABLE OF MOVING THE SUBSTRATE ALONG A DIRECTION OF THE FLOW. APPARATUSES AND SYSTEMS FOR TRANSPORTING THE SUBSTRATE USING THE NON-NEWTONIAN FLUID ALSO ARE DESCRIBED.

公开(公告)号：MY141406A

公开(公告)日：2010-04-30

申请号：MYPI20071693

申请日：2004-03-31

Applicant: LAM RES CORP

Inventor： PARKS JOHN

IPC: B08B3/04 ,  B08B7/00 ,  H01L21/00 ,  H01L21/683 ,  H01L21/687

Abstract: A WAFER PROCESSING CHAMBER (1001) IS PROVIDED FOR ALLOWING A FLUID FLOW AND A FLUID PRESSURE WITHIN THE CHAMBER TO BE CONTROLLED IN A VARIABLE MANNER. THE CHAMBER UTILIZES REMOVABLE PLATES (1091, 6011) THAT CAN BE CONFIGURED TO CONTROL THE FLUID FLOW AND THE FLUID PRESSURE IN AN INNER VOLUME (1191) WITHIN THE CHAMBER. ALSO, THE REMOVABLE PLATES CAN BE USED TO SEPARATE THA INNER VOLUME WITHIN THE CHAMBER FROM AN OUTER VOLUME (1131, 6051) WITHIN THE CHAMBER. ADDITIONALLY, A WAFER CLAMPING APPARATUS IS PROVIDED FOR USE IN THE CHAMBER (53). THE WAFER CLAMPING APPARATUS USES A PRESSURE DIFFERENTIAL BETWEEN A TOP SURFACE AND A BOTTOM SURFACE OF THE WATER TO PULL THE WAFER TOWARD SUPPORT STRUCTURE (403) IN CONTACT WITH THE WAFER BOTTOM SURFACE, WHEREBY THE WAFER IS SECURED AND MAINTAINED IN AN IMMOBILE STATE. FURTHERMORE, HIGH-PRESSURECHAMBER CONFIGURATION (2002, 3002) ARE PROVIDED.

公开(公告)号：DE602004023878D1

公开(公告)日：2009-12-10

申请号：DE602004023878

申请日：2004-12-20

Applicant: LAM RES CORP

Inventor： DAVIS GLENN W ,  WOODS CARL ,  PARKS JOHN ,  REDEKER FRED C ,  RAVKIN MIKE ,  ORBOCK MICHAEL L

IPC: H01L21/00 ,  H01L21/687

Abstract: A apparatus for drying a substrate includes a vacuum manifold positioned adjacent to an edge wheel. The edge wheel includes an edge wheel groove for receiving a peripheral edge of a substrate, and the edge wheel is capable of rotating the substrate at a desired set velocity. The vacuum manifold includes a proximity end having one or more vacuum ports defined therein. The proximity end is positioned at least partially within the edge wheel groove, and using supplied vacuum removes fluids that accumulate in the edge wheel groove and prevents re-deposit of trapped fluids around the peripheral edge of the substrate.

公开(公告)号：AT447238T

公开(公告)日：2009-11-15

申请号：AT04815000

申请日：2004-12-20

Applicant: LAM RES CORP

Inventor： DAVIS GLENN ,  WOODS CARL ,  PARKS JOHN ,  REDEKER FRED ,  RAVKIN MIKE ,  ORBOCK MICHAEL

IPC: H01L21/00 ,  H01L21/687

Abstract: A apparatus for drying a substrate includes a vacuum manifold positioned adjacent to an edge wheel. The edge wheel includes an edge wheel groove for receiving a peripheral edge of a substrate, and the edge wheel is capable of rotating the substrate at a desired set velocity. The vacuum manifold includes a proximity end having one or more vacuum ports defined therein. The proximity end is positioned at least partially within the edge wheel groove, and using supplied vacuum removes fluids that accumulate in the edge wheel groove and prevents re-deposit of trapped fluids around the peripheral edge of the substrate.