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公开(公告)号：DE69630555T2
公开(公告)日：2004-08-19
申请号：DE69630555
申请日：1996-03-21
Applicant: MACDERMID INC
Inventor： KUKANSKIS PETER , GABRIELE PETER , LETIZE RAYMOND , ADAMS WILLIAM
IPC: G03F7/027 , B32B15/08 , C08F290/00 , C08K3/34 , C08K3/36 , C08L9/02 , C08L21/00 , C08L63/00 , C08L101/00 , C08L101/08 , G03F7/00 , G03F7/032 , G03F7/033 , H05K1/00 , H05K3/00 , H05K3/18 , H05K3/46
Abstract: A composition and process useful in fabricating circuitry packages with permanent resists is proposed. The proposed composition comprises a carboxy functional resin, an acrylate oligomer, an epoxy functional resin, a butadiene nitrile resin, and a photoinitiator.
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公开(公告)号：AU2003265371A8
公开(公告)日：2004-05-04
申请号：AU2003265371
申请日：2003-08-06
Applicant: MACDERMID INC
Inventor： SAWOSKA DAVID , DURSO FRANK , KUKANSKIS PETER
IPC: C23C18/16 , C23C18/32 , C23C18/42 , H01C17/06 , H05K1/16 , H05K3/18 , H05K3/24 , H05K3/28 , H05K3/00 , H05K3/10
Abstract: The present invention is a process for manufacturing resistors integral with the printed circuit board by plating the resistors onto the insulative substrate. The invention uses a mask during the activation step so as to selectively activate only selected portions of the surface thus enabling smaller areas to be plated on the printed circuit board because no plating mask is used. The process of the instant invention produced printed circuit boards having greater uniformity and reliability as compared to the prior art.
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公开(公告)号：DE60043912D1
公开(公告)日：2010-04-15
申请号：DE60043912
申请日：2000-01-12
Applicant: MACDERMID INC
Inventor： REDLINE RONALD , SAWOSKA DAVID , KUKANSKIS PETER
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公开(公告)号：DE69730288T2
公开(公告)日：2004-12-30
申请号：DE69730288
申请日：1997-10-09
Applicant: MACDERMID INC
Inventor： KUKANSKIS PETER , LARSON GARY B , BENGSTON JON , SCHWEIKHER WILLIAM
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公开(公告)号：AU2002235402A1
公开(公告)日：2002-09-04
申请号：AU2002235402
申请日：2002-01-15
Applicant: MACDERMID INC
Inventor： DURSO FRANK , SAWOSKA DAVID , CASTALDI STEVEN , FRITZ DENNIS , KUKANSKIS PETER
IPC: H01C7/00 , H01C17/24 , H01C17/242 , H01L23/12 , H05K1/16 , H05K3/06 , H05K3/18 , H01L23/48 , C23F1/00 , B44C1/22
Abstract: A process is revealed whereby resistors can be manufactured integral with a printed circuit board by plating the resistors onto the insulative substrate. Uniformization of the insulative substrate through etching and oxidation of the plated resistor are discussed as techniques for improving the uniformity and consistency of the plated resistors. Trimming and baking are also disclosed as methods for adjusting and stabilizing the resistance of the plated resistors.
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Patent Agency Ranking
公开(公告)号：CA2434161A1
公开(公告)日：2002-08-29
申请号：CA2434161
申请日：2002-01-15
Applicant: MACDERMID INC
Inventor： SAWOSKA DAVID , FRITZ DENNIS , CASTALDI STEVEN , DURSO FRANK , KUKANSKIS PETER
Abstract: A process is revealed whereby resistors can be manufactured integral with a printed circuit board by plating the resistors onto the insulative substrate . Uniformization of the insulative substrate through etching and oxidation of the plated resistor are discussed as techniques for improving the uniformity and consistency of the plated resistors. Trimming and baking are also disclosed as methods for adjusting and stabilizing the resistance of the plated resistors.
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公开(公告)号：DE68926622T2
公开(公告)日：1996-11-28
申请号：DE68926622
申请日：1989-11-20
Applicant: MACDERMID INC
Inventor： KUKANSKIS PETER , WHITMORE BRYAN
Abstract: A composition for stripping tin, lead or solder, as well as any underlying copper-tin alloy, from copper surfaces, containing an alkane sulfonic acid, preferably methane sulfonic acid, an inorganic nitrate, preferably ferric nitrate, and an inhibitor component. The composition effects rapid stripping without any appreciable formation of sludge or precipitate or suspended particles, and without any substantial attack on the underlying copper surface.
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公开(公告)号：DE3474971D1
公开(公告)日：1988-12-08
申请号：DE3474971
申请日：1984-05-21
Applicant: MACDERMID INC
Inventor： KUKANSKIS PETER , GRUNWALD JOHN , SAWOSKA DAVID
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公开(公告)号：CH647264A5
公开(公告)日：1985-01-15
申请号：CH478679
申请日：1979-05-22
Applicant: MACDERMID INC
Inventor： KUKANSKIS PETER , GRUNWALD JOHN , FERRIER DONALD , SAWOSKA DAVID
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20.发明申请POLYIMIDE SUBSTRATE AND METHOD OF MANUFACTURING PRINTED WIRING BOARD USING THE SAME 审中-公开聚酰亚胺基板和使用其制造印刷线路板的方法
公开(公告)号：WO2007111671A8
公开(公告)日：2007-11-22
申请号：PCT/US2006049016
申请日：2006-12-21
Applicant: MACDERMID INC
Inventor： WOJTASZEK MARK , WATKOWSKI JAMES , LARSON GARY B , KUKANSKIS PETER
CPC classification number: H05K3/181 , C08J7/12 , C08J7/123 , C08J2379/08 , C23C18/1651 , C23C18/1653 , C23C18/2006 , C23C18/2086 , C23C18/22 , C23C18/30 , C23C18/32 , H05K1/0346 , H05K3/381 , H05K2201/0344 , H05K2203/0793 , H05K2203/095 , H05K2203/097
Abstract: The present invention is directed to an improved method for metallizing polymer substrates, such as polyimides. The present invention comprises the steps of surface treating the polymer substrate with a plasma jet or corona discharge surface treatment, conditioning and etching the polymer substrate with an etching solution comprising a hydroxide and ionic palladium, activating the polymer substrate with ionic palladium, reducing the palladium on the polymer substrate, plating an electroless nickel layer onto the prepared polymer substrate, arid plating an electroless copper layer over the electroless nickel layer. The process of the invention provides an improved method for preparing the polymer substrate for subsequent electrolytic plating thereon.
Abstract translation: 本发明涉及用于金属化聚合物基材例如聚酰亚胺的改进方法。 本发明包括以下步骤：用等离子体喷射或电晕放电表面处理对聚合物基材进行表面处理，用包含氢氧化物和离子钯的蚀刻溶液调节和蚀刻聚合物基材，用离子钯活化聚合物底物，还原钯 在聚合物基材上，将无电镍层电镀到制备的聚合物基材上，并在无电镍层上镀覆无电解铜层。 本发明的方法提供了一种改进的制备聚合物基质的方法，用于其后的电解电镀。
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