公开(公告)号：US11910535B2

公开(公告)日：2024-02-20

申请号：US17685404

申请日：2022-03-03

Applicant: Unimicron Technology Corp.

Inventor： Ming-Hao Wu ,  Shih-Lian Cheng

IPC: H05K1/11 ,  H05K1/14 ,  H05K1/18 ,  H05K3/00 ,  H05K3/42

CPC classification number: H05K3/0094 ,  H05K1/111 ,  H05K1/141 ,  H05K1/144 ,  H05K3/429 ,  H05K1/181 ,  H05K2201/09036 ,  H05K2201/09909

Abstract: A printed circuit board stack structure includes a first printed circuit board, a second printed circuit board, and a filling glue layer. The first printed circuit board has at least one overflow groove, and includes first pads and a retaining wall surrounding the first pads. The second printed circuit board is disposed on the first printed circuit board, and includes second pads and conductive pillars located on some of the second pads. The conductive pillars are respectively connected to some of the first pads to electrically connect the second printed circuit board to the first printed circuit board. The filling glue layer fills between the first and the second printed circuit boards, and covers the first pads, the second pads, and the conductive pillars. The retaining wall blocks the filling glue layer so that a portion of the filling glue layer is accommodated in the overflow groove.

公开(公告)号：US20230328900A1

公开(公告)日：2023-10-12

申请号：US17741499

申请日：2022-05-11

Applicant: UNIMICRON TECHNOLOGY CORP.

Inventor： Shih-Lian Cheng

IPC: H05K3/46 ,  H05K3/00 ,  H05K3/24 ,  H05K3/04 ,  H05K1/02

CPC classification number: H05K3/4697 ,  H05K3/0097 ,  H05K3/0094 ,  H05K3/0044 ,  H05K3/241 ,  H05K3/04 ,  H05K1/0298 ,  H05K2201/09127 ,  H05K2203/025

Abstract: In the manufacture method of the present invention, an inner circuit structure is prepared, and a docking pad is formed on the first surface of the inner circuit structure. A release film is mounted on the first surface to cover the docking pad before mounting a build-up circuit structure upon the first surface. The release film and part of the build-up circuit structure above it are removed. The docking pad is therefore exposed and a docking opening is formed in the build-up circuit structure. The docking opening is for mounting a circuit board to be docked to form a circuit board module of the present invention.

公开(公告)号：US20220232694A1

公开(公告)日：2022-07-21

申请号：US17496791

申请日：2021-10-08

Applicant: Unimicron Technology Corp.

Inventor： Chih-Chiang Lu ,  Heng-Ming Nien ,  Ching-Sheng Chen ,  Ching Chang ,  Ming-Ting Chang ,  Chi-Min Chang ,  Shao-Chien Lee ,  Jun-Rui Huang ,  Shih-Lian Cheng

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/46 ,  H05K3/42

Abstract: Provided is a circuit board, including a first substrate, a second substrate, a third substrate, a fourth substrate, multiple conductive structures, and a conductive via structure. The second substrate is disposed between the first substrate and the third substrate. The third substrate is disposed between the second substrate and the fourth substrate. The third substrate has an opening penetrating the third substrate and includes a first dielectric layer filling the opening. The conductive via structure penetrates the first substrate, the second substrate, the first dielectric layer of the third substrate, and the fourth substrate, and is electrically connected to the first substrate and the fourth substrate to define a signal path. The first substrate, the second substrate, the third substrate and the fourth substrate are electrically connected through the conductive structures to define a ground path, and the ground path surrounds the signal path.

公开(公告)号：US11366381B2

公开(公告)日：2022-06-21

申请号：US16395244

申请日：2019-04-26

Applicant: Unimicron Technology Corp.

Inventor： Pu-Ju Lin ,  Shih-Lian Cheng ,  Yu-Hua Chen ,  Cheng-Ta Ko ,  Jui-Jung Chien ,  Wei-Tse Ho

IPC: B32B37/00 ,  G03F1/50 ,  H05K3/06 ,  H05K3/24 ,  H05K3/00 ,  H05K3/10 ,  H05K3/12 ,  H05K3/18 ,  H05K3/42 ,  G03F7/20 ,  G01K7/24 ,  G01K15/00

Abstract: A mask structure and a manufacturing method of the mask structure are provided. The mask structure includes a transparent substrate, a patterned metal layer, and a plurality of microlens structures. The patterned metal layer is disposed on the transparent substrate and exposing a portion of the transparent substrate. The microlens structures are disposed on the transparent substrate exposed by a portion of the patterned metal layer and being in contact with the portion of the patterned metal layer.

公开(公告)号：US10999935B2

公开(公告)日：2021-05-04

申请号：US16421461

申请日：2019-05-23

Applicant: Unimicron Technology Corp.

Inventor： Shih-Lian Cheng

IPC: H05K3/02 ,  H05K3/06 ,  G03F7/00 ,  H05K3/46 ,  G03F7/16 ,  G03F7/20 ,  H05K1/11 ,  H05K3/00 ,  H05K3/10

Abstract: A manufacturing method of a circuit board including the following steps is provided. A carrier substrate is provided. A patterned photoresist layer is formed on the carrier substrate. An adhesive layer is formed on the top surface of the patterned photoresist layer. A dielectric substrate is provided. A circuit pattern and a dielectric layer covering the circuit pattern are formed on the dielectric substrate, wherein the dielectric layer has an opening exposing a portion of the circuit pattern. The adhesive layer is adhered to the dielectric layer in a direction that the adhesive layer faces of the dielectric layer. The carrier substrate is removed. A patterned metal layer is formed on a region exposed by the patterned photoresist layer. The patterned photoresist layer is removed. The adhesive layer is removed.

公开(公告)号：US10813223B2

公开(公告)日：2020-10-20

申请号：US16115566

申请日：2018-08-29

Applicant: Unimicron Technology Corp.

Inventor： Shih-Lian Cheng

IPC: B23P19/00 ,  H05K3/06 ,  G03F7/00 ,  H05K3/46 ,  G03F7/16 ,  G03F7/20 ,  H05K1/11 ,  H05K3/00 ,  H05K3/10

Abstract: A piezochromic stamp is provided, wherein when a pressing side of the piezochromic stamp is subjected to a pressure, a light transmittance effect of the pressing side is changed from allowing a light having a specific wavelength to pass through to blocking the light having the specific wavelength, or the light transmittance effect of the pressing side is changed from blocking the light having the specific wavelength to allowing the light having the specific wavelength to pass through.

公开(公告)号：US20190281703A1

公开(公告)日：2019-09-12

申请号：US16421461

申请日：2019-05-23

Applicant: Unimicron Technology Corp.

Inventor： Shih-Lian Cheng

IPC: H05K3/06 ,  H05K3/46 ,  G03F7/00 ,  G03F7/16 ,  G03F7/20 ,  H05K1/11 ,  H05K3/00 ,  H05K3/10

Abstract: A manufacturing method of a circuit board including the following steps is provided. A carrier substrate is provided. A patterned photoresist layer is formed on the carrier substrate. An adhesive layer is formed on the top surface of the patterned photoresist layer. A dielectric substrate is provided. A circuit pattern and a dielectric layer covering the circuit pattern are formed on the dielectric substrate, wherein the dielectric layer has an opening exposing a portion of the circuit pattern. The adhesive layer is adhered to the dielectric layer in a direction that the adhesive layer faces of the dielectric layer. The carrier substrate is removed. A patterned metal layer is formed on a region exposed by the patterned photoresist layer. The patterned photoresist layer is removed. The adhesive layer is removed.

公开(公告)号：US10362682B2

公开(公告)日：2019-07-23

申请号：US15255150

申请日：2016-09-02

Applicant: Unimicron Technology Corp.

Inventor： Shih-Lian Cheng

IPC: H05K3/02 ,  H05K3/10 ,  H05K3/06 ,  G03F7/16 ,  G03F7/20 ,  H05K1/11 ,  H05K3/00 ,  H05K3/46 ,  G03F7/00

Abstract: A manufacturing method of a circuit board including the following steps is provided. A carrier substrate is provided. A patterned photoresist layer is formed on the carrier substrate. An adhesive layer is formed on the top surface of the patterned photoresist layer. A dielectric substrate is provided. A circuit pattern and a dielectric layer covering the circuit pattern are formed on the dielectric substrate, wherein the dielectric layer has an opening exposing a portion of the circuit pattern. The adhesive layer is adhered to the dielectric layer in a direction that the adhesive layer faces of the dielectric layer. The carrier substrate is removed. A patterned metal layer is formed on a region exposed by the patterned photoresist layer. The patterned photoresist layer is removed. The adhesive layer is removed.

公开(公告)号：US20180376599A1

公开(公告)日：2018-12-27

申请号：US16115566

申请日：2018-08-29

Applicant: Unimicron Technology Corp.

Inventor： Shih-Lian Cheng

IPC: H05K3/06 ,  H05K3/46 ,  H05K3/10 ,  H05K3/00 ,  H05K1/11 ,  G03F7/20 ,  G03F7/16 ,  G03F7/00

Abstract: A piezochromic stamp is provided, wherein when a pressing side of the piezochromic stamp is subjected to a pressure, a light transmittance effect of the pressing side is changed from allowing a light having a specific wavelength to pass through to blocking the light having the specific wavelength, or the light transmittance effect of the pressing side is changed from blocking the light having the specific wavelength to allowing the light having the specific wavelength to pass through.

公开(公告)号：US12057381B2

公开(公告)日：2024-08-06

申请号：US17498757

申请日：2021-10-12

Applicant: Unimicron Technology Corp.

Inventor： Chih-Chiang Lu ,  Hsin-Ning Liu ,  Jun-Rui Huang ,  Pei-Wei Wang ,  Ching Sheng Chen ,  Shih-Lian Cheng

IPC: H01L23/498 ,  H01L21/48 ,  H05K1/02 ,  H05K3/00 ,  H05K3/42 ,  H05K3/46 ,  H01L23/00

CPC classification number: H01L23/49827 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/49822 ,  H05K1/0222 ,  H05K3/0094 ,  H05K3/429 ,  H05K3/4614 ,  H05K3/4623 ,  H01L24/16 ,  H01L2224/16227 ,  H05K2201/09509 ,  H05K2201/0959

Abstract: A circuit board includes a first external circuit layer, a first substrate, a second substrate, a third substrate, and a conductive through hole structure. The first substrate includes conductive pillars electrically connecting the first external circuit layer and the second substrate. The second substrate has an opening and includes a first dielectric layer. The opening penetrates the second substrate, and the first dielectric layer fills the opening. The third substrate includes an insulating layer, a second external circuit layer, and conductive holes. A conductive material layer of the conductive through hole structure covers an inner wall of a through hole and electrically connects the first and the second external circuit layers to define a signal path. The first external circuit layer, the conductive pillars, the second substrate, the conductive holes and the second external circuit layer are electrically connected to define a ground path surrounding the signal path.