公开(公告)号：WO00021899A1

公开(公告)日：2000-04-20

申请号：PCT/US1999/021442

申请日：1999-10-08

IPC: C03C25/10 ,  C03C25/42 ,  C08J5/08 ,  D03D15/00 ,  D03D15/12 ,  D04H1/42 ,  D06M13/00 ,  D06M13/513 ,  D06M15/227 ,  D06M15/263 ,  D06M15/333 ,  D06M15/41 ,  D06M15/507 ,  D06M15/564 ,  D06M15/59 ,  D06M101/00 ,  H05K1/03 ,  H05K3/00 ,  C03C25/02

CPC classification number: H05K1/0366 ,  C03C25/47 ,  C08J5/08 ,  H05K3/0047 ,  H05K2201/0166 ,  H05K2201/0175 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0239 ,  H05K2201/0245 ,  H05K2201/0248 ,  H05K2201/0254 ,  H05K2201/029 ,  H05K2203/127

Abstract: The present invention provides a coated fiber strand comprising at least one fiber having a layer of a dried residue of a resin compatible coating composition on at least a portion of a surface of the at least one fiber, the resin compatible coating composition comprising: a) a plurality of discrete, dimensionally stable particles formed from materials selected from the group consisting of organic materials, polymeric materials, composite materials and mixtures thereof that provide an interstitial space between the at least one fiber and at least one adjacent fiber, the particles having an average particle size of about 0.1 to 5 micrometers; b) at least one lubricious material; c) at least one polymeric film former; and d) at least one coupling agent, and a fabric incorporating at least one of the fiber strands.

Abstract translation: 本发明提供了包含至少一种纤维的包衣纤维线，所述纤维在至少一种纤维表面的至少一部分上具有一层具有树脂相容性涂料组合物的干燥残余物的层，所述树脂相容性涂料组合物包含：a） 由选自有机材料，聚合材料，复合材料及其混合物的材料形成的多个离散的尺寸稳定的颗粒，其提供所述至少一种纤维和至少一种相邻纤维之间的间隙空间，所述颗粒具有 平均粒度为约0.1至5微米; b）至少一种润滑材料; c）至少一种聚合物成膜剂; 和d）至少一种偶联剂，以及掺入至少一种纤维束的织物。

公开(公告)号：WO1994017140A1

公开(公告)日：1994-08-04

申请号：PCT/JP1994000113

申请日：1994-01-27

Applicant: OTSUKA KAGAKU KABUSHIKI KAISHA ,  TASAKA, Takio ,  MONDE, Hiroyuki

Inventor： OTSUKA KAGAKU KABUSHIKI KAISHA

IPC: C08L101/00

CPC classification number: C08K7/08 ,  C08K7/10 ,  H05K1/0373 ,  H05K2201/0129 ,  H05K2201/0209 ,  H05K2201/0248 ,  H05K2201/0251

Abstract: The invention aims at providing a resin composition for electronic parts which is in great demand as a circuit board material for electric and electronic equipments, and which has a low dielectric constant, low dielectric dissipation factor and a thermal resistance. This resin consists of a thermoplastic resin or a thermosetting resin, and wollastonite or zonotolite, fibrous material containing CaO.SiO2 as a main component, mixed as reinforcing fiber with the resin at a mixing ratio of 5-60 % based on the total weight of the resin and fiber.

Abstract translation: 本发明的目的在于提供一种作为电气电子设备用电路基板材料的电子部件用树脂组合物，其介电常数低，介电损耗因数低，耐热性高。 该树脂由热塑性树脂或热固性树脂组成，硅灰石或云母石，以CaO.SiO 2为主要成分的纤维材料，以与树脂混合的增强纤维为基准，混合比例为5-60％ 树脂和纤维。

公开(公告)号：US20170086290A1

公开(公告)日：2017-03-23

申请号：US15099212

申请日：2016-04-14

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Keun-Yong LEE ,  Jun-Young KIM ,  Sa-Yong LEE ,  Sang-Hyun SHIN

IPC: H05K1/02 ,  H05K3/00 ,  H05K3/46 ,  H05K1/09 ,  H05K1/03

CPC classification number: H05K1/0366 ,  H05K2201/0248 ,  H05K2201/0251 ,  H05K2201/026

Abstract: A prepreg, a printed circuit board and a method of manufacturing the same are provided. A prepreg includes a core layer including nanofibers having a thickness in a range of 10 to 100 nm, a first insulating layer on a first surface of the core layer, and a second insulating layer on a second surface of the core layer.

公开(公告)号：US20170012013A1

公开(公告)日：2017-01-12

申请号：US15271744

申请日：2016-09-21

Applicant: FUJITSU LIMITED

Inventor： KOZO SHIMIZU ,  Seiki Sakuyama

IPC: H01L23/00 ,  H01L23/498 ,  B23K35/26 ,  H01L23/31 ,  B23K1/00 ,  B23K35/02

CPC classification number: H01L24/17 ,  B23K1/0008 ,  B23K1/0016 ,  B23K3/085 ,  B23K35/0244 ,  B23K35/262 ,  B23K35/264 ,  B23K2101/40 ,  B23K2101/42 ,  H01L23/145 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/3675 ,  H01L23/488 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/13 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/73 ,  H01L24/75 ,  H01L24/81 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05082 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05567 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/11334 ,  H01L2224/1146 ,  H01L2224/13016 ,  H01L2224/13076 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/1601 ,  H01L2224/16145 ,  H01L2224/16157 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2224/16505 ,  H01L2224/16507 ,  H01L2224/24137 ,  H01L2224/24195 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/75253 ,  H01L2224/75501 ,  H01L2224/75502 ,  H01L2224/759 ,  H01L2224/81005 ,  H01L2224/81075 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/8121 ,  H01L2224/81411 ,  H01L2224/81815 ,  H01L2224/81948 ,  H01L2224/81986 ,  H01L2225/06513 ,  H01L2924/014 ,  H01L2924/10252 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10329 ,  H01L2924/10335 ,  H01L2924/13091 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/1579 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2924/1659 ,  H01L2924/16747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3512 ,  H01L2924/35121 ,  H05K1/0203 ,  H05K1/09 ,  H05K1/113 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2201/0248 ,  H05K2201/09972 ,  H05K2201/1056 ,  H05K2203/1121 ,  H05K2203/304 ,  H01L2924/00012 ,  H01L2924/01047 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01028 ,  H01L2924/01079 ,  H01L2924/01046 ,  H01L2924/00

Abstract: An electronic apparatus includes a first electronic part with a first terminal, a second electronic part with a second terminal opposite the first terminal, and a joining portion which joins the first terminal and the second terminal. The joining portion contains a pole-like compound extending in a direction in which the first terminal and the second terminal are opposite to each other. The joining portion contains the pole-like compound, so the strength of the joining portion is improved. When the first terminal and the second terminal are joined, the temperature of one of the first electronic part and the second electronic part is made higher than that of the other. A joining material is cooled and solidified in this state. By doing so, the pole-like compound is formed.

Abstract translation: 电子设备包括具有第一端子的第一电子部件，与第一端子相对的第二端子的第二电子部件和与第一端子和第二端子连接的接合部。 接合部分包含在第一端子和第二端子彼此相对的方向上延伸的极性化合物。 接合部分包含杆状化合物，从而提高接合部分的强度。 当第一端子和第二端子接合时，第一电子部件和第二电子部件之一的温度被制成高于另一端子的温度。 在该状态下将接合材料冷却并固化。 通过这样做，形成极点状化合物。

公开(公告)号：US20160353570A1

公开(公告)日：2016-12-01

申请号：US15136231

申请日：2016-04-22

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sung Chul LEE

IPC: H05K1/03 ,  C08K3/36 ,  H05K3/10 ,  C08K3/26 ,  C08J5/18 ,  C08K7/00 ,  C08K3/40

CPC classification number: H05K1/0373 ,  C08K3/013 ,  C08K3/26 ,  C08K3/36 ,  C08K3/40 ,  C08K7/00 ,  C08K2003/265 ,  C08K2201/016 ,  H05K2201/0209 ,  H05K2201/0248 ,  H05K2201/0376 ,  C08L63/00

Abstract: A resin composition for packaging, an insulating film and a printed circuit board manufactured with the resin composition, and a method of manufacturing a printed circuit board with the resin composition are provided. The resin composition for packaging includes an epoxy resin, and inorganic filler particles dispersed in the epoxy resin, and an aspect ratio of the inorganic filler particles is 1.0 or more and 3.0 or less.

Abstract translation: 提供了一种用于包装的树脂组合物，绝缘膜和用树脂组合物制造的印刷电路板，以及制造具有树脂组合物的印刷电路板的方法。 用于包装的树脂组合物包括环氧树脂和分散在环氧树脂中的无机填料颗粒，无机填料颗粒的纵横比为1.0以上至3.0以下。

公开(公告)号：US09293384B2

公开(公告)日：2016-03-22

申请号：US13522218

申请日：2011-01-13

Applicant: Yuusaku Ishimine ,  Masayuki Moriyama ,  Kenji Komatsubara

Inventor： Yuusaku Ishimine ,  Masayuki Moriyama ,  Kenji Komatsubara

IPC: H01L23/15 ,  H05K7/20 ,  H05K1/00 ,  B32B33/00 ,  H01L23/13 ,  H01L35/32 ,  C04B35/587 ,  C04B37/02 ,  H05K1/03 ,  H05K3/38

CPC classification number: H01L23/13 ,  C04B35/587 ,  C04B37/026 ,  C04B2235/3206 ,  C04B2235/3217 ,  C04B2235/3224 ,  C04B2235/3878 ,  C04B2235/3882 ,  C04B2235/5276 ,  C04B2235/5436 ,  C04B2235/5445 ,  C04B2235/604 ,  C04B2235/6581 ,  C04B2235/6582 ,  C04B2235/6587 ,  C04B2235/721 ,  C04B2235/723 ,  C04B2235/77 ,  C04B2235/786 ,  C04B2235/80 ,  C04B2235/945 ,  C04B2235/9607 ,  C04B2237/125 ,  C04B2237/368 ,  C04B2237/407 ,  C04B2237/74 ,  H01L23/15 ,  H01L23/3731 ,  H01L23/3735 ,  H01L35/32 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K3/38 ,  H05K2201/0248 ,  H05K2201/0266 ,  H05K2201/0269 ,  Y10T428/24413 ,  Y10T428/24421 ,  Y10T428/25 ,  Y10T428/259 ,  H01L2924/00

Abstract: A silicon nitride substrate comprises a substrate comprising a silicon nitride sintered body, and a plurality of granular bodies containing silicon and integrated to a principal surface of the substrate, wherein a plurality of needle crystals or column crystals comprising mainly silicon nitride are extended from a portion of the granular bodies. A brazing material is applied to a principal surface of the substrate, and a circuit member and a heat radiation member are arranged on the applied brazing material, and bonded by heating. Because of a plurality of granular bodies integrated to the principal surface of the substrate, and a plurality of the needle crystals or the column crystals extended from a portion of the granular bodies, a high anchor effect is produced so that the circuit member and the heat radiation member are firmly bonded to the silicon nitride substrate.

Abstract translation: 氮化硅衬底包括含有氮化硅烧结体的衬底和多个含有硅的颗粒体并且与衬底的主表面集成在一起，其中主要包含氮化硅的多个针状晶体或柱状晶体从一部分 的颗粒体。 将钎焊材料施加到基板的主表面，并且将电路构件和散热构件布置在所施加的钎焊材料上，并通过加热粘合。 由于集成到基板的主面的多个粒状体以及从一部分粒状体延伸的多个针状晶体或柱状晶体，产生高的锚定效应，使得电路部件和热量 辐射构件牢固地结合到氮化硅衬底上。

公开(公告)号：US20150208506A1

公开(公告)日：2015-07-23

申请号：US14420681

申请日：2012-08-10

Applicant: Igor Perez-Uria ,  Per Ferm ,  Benny Gustafson

Inventor： Igor Perez-Uria ,  Per Ferm ,  Benny Gustafson

IPC: H05K1/14 ,  H05K3/10 ,  H05K3/42 ,  H05K1/11

CPC classification number: H05K1/144 ,  H05K1/115 ,  H05K1/141 ,  H05K3/10 ,  H05K3/303 ,  H05K3/3436 ,  H05K3/3494 ,  H05K3/4015 ,  H05K3/4046 ,  H05K3/4053 ,  H05K3/42 ,  H05K2201/0248 ,  H05K2201/0305 ,  H05K2201/09563 ,  H05K2201/09572 ,  H05K2201/10234 ,  H05K2201/10734 ,  H05K2201/10878 ,  H05K2201/10916 ,  H05K2203/0338 ,  H05K2203/0455 ,  H05K2203/1105 ,  Y10T29/49124

Abstract: The present invention relates to a printed circuit board arrangement and a method for forming an electrical connection at a printed circuit board. The printed circuit board arrangement comprises a printed circuit board having an electrical connection electrically connecting a first conductive layer on a first side of the printed circuit board and a second conductive layer on a second side of the printed circuit board. The electrical connection comprises a passage extending from an opening in one of the sides of the printed circuit board through the printed circuit board between the first and second layers. Electrically conducting material is formed on the walls of the passage and forms a first path electrically connecting the first conductive layer with the second conductive layer. At least one first ball is enclosed by the passage and forms part of a second electrical path between the first and second conductive layers of the printed circuit board, said second electrical path having a lower resistance than the first path.

Abstract translation: 本发明涉及印刷电路板装置和在印刷电路板上形成电连接的方法。 印刷电路板布置包括印刷电路板，其具有电连接印刷电路板的第一侧上的第一导电层和印刷电路板的第二侧上的第二导电层的电连接。 电连接包括从印刷电路板的一侧的开口延伸穿过第一和第二层之间的印刷电路板的通道。 导电材料形成在通道的壁上，并形成将第一导电层与第二导电层电连接的第一路径。 至少一个第一球被通道包围，并形成印刷电路板的第一和第二导电层之间的第二电路的一部分，所述第二电路具有比第一路径更低的电阻。

公开(公告)号：US09041171B2

公开(公告)日：2015-05-26

申请号：US13340430

申请日：2011-12-29

Applicant: Sam Ziqun Zhao ,  Kevin Kunzhong Hu ,  Sampath K. V. Karikalan ,  Rezaur Rahman Khan ,  Pieter Vorenkamp ,  Xiangdong Chen

Inventor： Sam Ziqun Zhao ,  Kevin Kunzhong Hu ,  Sampath K. V. Karikalan ,  Rezaur Rahman Khan ,  Pieter Vorenkamp ,  Xiangdong Chen

IPC: H01L21/326 ,  H01L23/495 ,  H05K1/11 ,  B82Y99/00 ,  H01L23/498 ,  H05K1/02 ,  H01L21/48 ,  H05K3/40

CPC classification number: H01L23/49827 ,  B82Y10/00 ,  H01L21/485 ,  H01L21/486 ,  H01L23/49822 ,  H01L2224/16225 ,  H05K1/029 ,  H05K3/4038 ,  H05K2201/0248 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2201/10378 ,  H05K2203/104 ,  H05K2203/105

Abstract: An exemplary implementation of the present disclosure includes a programmable interposer having top and bottom interface electrodes and conductive particles interspersed within the programmable interposer. The conductive particles are capable of forming an aligned configuration between the top and bottom interface electrodes in response to application of an energy field to the programmable interposer so as to electrically connect the top and bottom interface electrodes. The conductive particles can have a conductive outer surface. Also, the conductive particles can be spherical. The conductive particles can be within a bulk material in an interface layer in the programmable interposer, and the bulk material can be cured to secure programmed paths between the top and bottom interface electrodes.

Abstract translation: 本公开的示例性实现包括具有顶部和底部接口电极和散布在可编程插值器内的导电粒子的可编程插值器。 响应于将能量场施加到可编程内插器，导电颗粒能够在顶部和底部界面电极之间形成对准的构造，以便电连接顶部和底部界面电极。 导电颗粒可具有导电外表面。 此外，导电粒子可以是球形的。 导电颗粒可以在可编程插入器中的界面层中的体积材料内，并且可以固化块状材料以确保顶部和底部界面电极之间的编程路径。

公开(公告)号：US20150136219A1

公开(公告)日：2015-05-21

申请号：US14402006

申请日：2013-05-08

Applicant: Material Concept, Inc.

Inventor： Junichi Koike ,  Hoang Tri Hai

IPC: H01L31/02 ,  H01B1/02 ,  H01B1/22 ,  H05K3/12

CPC classification number: H01L31/02013 ,  B22F1/0011 ,  B22F1/0059 ,  C22C1/0425 ,  C22C9/00 ,  H01B1/026 ,  H01B1/22 ,  H01L31/022425 ,  H05K1/092 ,  H05K3/1291 ,  H05K2201/0245 ,  H05K2201/0248 ,  H05K2201/0266 ,  H05K2203/1131 ,  Y02E10/50 ,  Y10T428/2982

Abstract: This conductive paste is such that the printing properties and sintering properties are superior and is formed such that resistance of wiring after sintering is lowered. This conductive paste is characterized by being formed from copper-based metal particles and by an aspect ratio (dmax/dmin), which is defined as the ratio of the maximum diameter (dmax) and minimum diameter (dmin) for the metal particles, being greater than or equal to 1.0 and smaller than 2.2.

Abstract translation: 该导电性糊料使得印刷性能和烧结性能优异，并且形成为使得烧结后的布线的电阻降低。 该导电性糊剂的特征在于由铜基金属粒子形成，长宽比（dmax / dmin）定义为金属粒子的最大直径（dmax）与最小直径（dmin）的比例，为 大于或等于1.0且小于2.2。

公开(公告)号：US08760606B2

公开(公告)日：2014-06-24

申请号：US12905664

申请日：2010-10-15

Applicant: Pierre-Marc Allemand ,  Haixia Dai ,  Shuo Na ,  Hash Pakbaz ,  Florian Pschenitzka ,  Xina Quan ,  Jelena Sepa ,  Michael A. Spaid

Inventor： Pierre-Marc Allemand ,  Haixia Dai ,  Shuo Na ,  Hash Pakbaz ,  Florian Pschenitzka ,  Xina Quan ,  Jelena Sepa ,  Michael A. Spaid

IPC: G02F1/1333

CPC classification number: H01L31/022425 ,  B82Y10/00 ,  B82Y20/00 ,  B82Y30/00 ,  G02F1/13439 ,  H01B1/02 ,  H01L27/1421 ,  H01L29/0669 ,  H01L29/413 ,  H01L31/022466 ,  H01L31/068 ,  H01L31/0687 ,  H01L31/1884 ,  H01L33/38 ,  H01L33/40 ,  H01L51/0021 ,  H01L51/0048 ,  H01L51/102 ,  H01L51/5206 ,  H01L51/5212 ,  H05K1/095 ,  H05K1/097 ,  H05K3/06 ,  H05K3/245 ,  H05K3/249 ,  H05K9/009 ,  H05K9/0092 ,  H05K2201/0108 ,  H05K2201/0248 ,  H05K2201/0257 ,  H05K2201/026 ,  Y02E10/549 ,  Y02P70/521 ,  Y10S977/95 ,  Y10T29/49155

Abstract: A transparent conductor including a conductive layer coated on a substrate is described. More specifically, the conductive layer comprises a network of nanowires that may be embedded in a matrix. The conductive layer is optically clear, patternable and is suitable as a transparent electrode in visual display devices such as touch screens, liquid crystal displays, plasma display panels and the like.

Abstract translation: 描述了包括涂覆在基板上的导电层的透明导体。 更具体地，导电层包括可嵌入矩阵中的纳米线网络。 导电层是透明的，可图案化的，并且适合作为诸如触摸屏，液晶显示器，等离子显示面板等的视觉显示装置中的透明电极。