公开(公告)号：US06774486B2

公开(公告)日：2004-08-10

申请号：US09974947

申请日：2001-10-10

Applicant: Larry D. Kinsman

Inventor： Larry D. Kinsman

IPC: H01L2348

CPC classification number: H05K1/115 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K3/4602 ,  H05K2201/0949 ,  H05K2201/09609 ,  H05K2201/09836 ,  H05K2201/09945 ,  H01L2924/00

Abstract: The present invention is directed to an apparatus and method for connecting integrated circuits placed on opposite sides of a circuit board through utilization of conduction elements embedded in the circuit board and extending from one surface of the board to the other. Conductive traces extend along the surface of the circuit board from the conduction elements to the integrated circuits. The conductive traces may be formed from multiple conductive layers.

公开(公告)号：US06774315B1

公开(公告)日：2004-08-10

申请号：US09577457

申请日：2000-05-24

Applicant: Mark Vincent Pierson ,  Jennifer Rebecca Sweterlitsch ,  Charles Gerard Woychik ,  Thurston Bryce Youngs, Jr.

Inventor： Mark Vincent Pierson ,  Jennifer Rebecca Sweterlitsch ,  Charles Gerard Woychik ,  Thurston Bryce Youngs, Jr.

IPC: H01R1214

CPC classification number: H01R12/52 ,  H01L23/49827 ,  H01L2924/0002 ,  H01R12/57 ,  H01R13/2414 ,  H05K3/3436 ,  H05K3/42 ,  H05K7/1061 ,  H05K13/0465 ,  H05K2201/0133 ,  H05K2201/09836 ,  H05K2201/10378 ,  Y02P70/613 ,  Y10T29/49124 ,  Y10T29/4913 ,  H01L2924/00

Abstract: A flexible, compliant layer of a single low modulus material for connecting a chip die directly to a circuit card without encapsulation. The flexible compliant layer provides stress relief caused by CTE thermal mismatch in chip die and circuit card. An array of copper plated vias are formed in said compliant layer with each via terminating on opposing surfaces of the layer in copper pads. Rather than copper, other metals, such as gold or nickel, may also be used. An array of holes may be positioned between said array of vias to provide additional resiliency. The plated vias may be angled with respect to said opposing surfaces to allow additional vertical and horizontal stress relief. Connection of the pads on one surface to high melt C-4 solder balls or columns on a chip die results in solder filled vias. Low melt solder connection of the pads on the other surface to a circuit card allows non-destructive rework of the cards.

Abstract translation: 用于将芯片裸片直接连接到电路卡而不封装的单个低模量材料的柔性兼容层。 灵活的柔性层提供了芯片和电路卡中CTE热失配引起的应力消除。 在所述顺应层中形成镀铜通孔的阵列，每个通孔终止于铜衬垫的相对表面上。 而不是铜，也可以使用其他金属，例如金或镍。 一组孔可以位于所述通孔阵列之间以提供额外的弹性。 电镀通孔可以相对于所述相对的表面成角度，以允许额外的垂直和水平应力释放。 将一个表面上的焊盘与芯片模具上的高熔点C-4焊球或柱的连接导致焊料填充的通孔。 将另一个表面上的焊盘的低熔点焊接连接到电路卡允许卡的非破坏性返修。

公开(公告)号：US20030146510A1

公开(公告)日：2003-08-07

申请号：US10293564

申请日：2002-11-14

Inventor： Ray Chien

IPC: H01L029/40 ,  H01L023/52 ,  H01L023/48 ,  H01L021/50 ,  H01L021/48 ,  H01L021/44

CPC classification number: H05K3/4038 ,  H01L23/49827 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48237 ,  H01L2224/73265 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K3/3436 ,  H05K2201/0133 ,  H05K2201/09836 ,  H05K2201/10287 ,  H05K2201/10378 ,  H05K2203/0235 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00015 ,  H01L2924/00

Abstract: An elastomer interposer employed between a package and a printed circuit board and the method of manufacturing the same are disclosed. The elastomer interposer includes an elastomer, a plurality of conductive wires, Cu pads, solder resistant blocks and Ni/Au plated pads. The elastomer has two contact surfaces. The conductive wires are arranged inside the elastomer at a certain interval and tilted toward one of the contact surfaces with an inclined angle. The Cu pads are formed on both of the surfaces at a space, and electrically connected to the corresponding conductive wires. Also, the Ni/Au plated pads are formed over the Cu pads.

Abstract translation: 公开了一种在封装和印刷电路板之间采用的弹性体插入件及其制造方法。 弹性体插入件包括弹性体，多根导线，铜焊盘，阻焊块和Ni / Au电镀垫。 弹性体具有两个接触表面。 导线以一定的间隔配置在弹性体的内侧，以倾斜角朝向其中一个接触面倾斜。 Cu焊盘在空间的两个表面上形成，并且电连接到相应的导线。 此外，Ni / Au电镀焊盘形成在Cu焊盘上。

公开(公告)号：US5513430A

公开(公告)日：1996-05-07

申请号：US293365

申请日：1994-08-19

Applicant: Arnold W. Yanof ,  William Dauksher

Inventor： Arnold W. Yanof ,  William Dauksher

IPC: G01R3/00 ,  H05K3/40 ,  H05K3/02

CPC classification number: H05K3/4007 ,  G01R3/00 ,  H05K2201/0347 ,  H05K2201/0367 ,  H05K2201/09836 ,  H05K2201/09845 ,  H05K2203/0542 ,  H05K2203/0577 ,  Y10T29/49155

Abstract: A probe card (40, 55) having probe card probes (36, 56) and a method for fabricating the probe card probes (36, 56). A layer of resist (23) is formed on a plating base (21). The layer of resist (23) is exposed to radiation (32) and developed to provide angled, tapered openings (33) exposing portions of the plating base (22). An electrically conductive material is electroplated on the exposed portions of the plating base (22) and fills the angled, tapered openings (33). The layer of resist (23) and portions of the plating base (22) between the electroplated conductive material are removed. The electrically conductive material forms the probe card probes (36) which are angled and tapered. In addition, the compliant probe card probes (56) may be stair-step shaped.

Abstract translation: 具有探针卡探针（36,56）的探针卡（40,55）和用于制造探针卡探针（36,56）的方法。 在电镀基体（21）上形成有抗蚀剂层（23）。 抗蚀剂层（23）暴露于辐射（32）并显影以提供倾斜的锥形开口（33），暴露电镀基底（22）的部分。 导电材料电镀在电镀基座（22）的露出部分上并填充有角度的锥形开口（33）。 去除了电镀层（23）和电镀基底（22）在电镀导电材料之间的部分。 导电材料形成了成角度和锥形的探针卡探头（36）。 此外，兼容的探针卡探针（56）可以是台阶形状。

公开(公告)号：US5436062A

公开(公告)日：1995-07-25

申请号：US193191

申请日：1994-02-14

Applicant: Walter Schmidt ,  Marco Martinelli

Inventor： Walter Schmidt ,  Marco Martinelli

IPC: H05K1/00 ,  H05K1/05 ,  H05K1/11 ,  H05K3/00 ,  H05K3/38 ,  H05K3/40 ,  H05K3/42 ,  H05K3/46 ,  B44C1/22 ,  B32B3/00 ,  C23F1/02

CPC classification number: H05K3/4655 ,  H05K1/115 ,  H05K3/0041 ,  H05K3/0061 ,  H05K3/0064 ,  H05K3/4084 ,  H05K3/42 ,  H05K3/4635 ,  H05K3/4641 ,  H05K1/0287 ,  H05K1/0289 ,  H05K1/0393 ,  H05K1/05 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/066 ,  H05K2201/0909 ,  H05K2201/09327 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09554 ,  H05K2201/09572 ,  H05K2201/09609 ,  H05K2201/09627 ,  H05K2201/09781 ,  H05K2201/09836 ,  H05K2201/09945 ,  H05K2201/10666 ,  H05K2203/0554 ,  H05K2203/0746 ,  H05K2203/1184 ,  H05K2203/1545 ,  H05K2203/1572 ,  H05K3/0097 ,  H05K3/386 ,  H05K3/427 ,  H05K3/429 ,  H05K3/4652 ,  Y10S428/901 ,  Y10T428/24917

Abstract: In a metal-clad laminate the requirements concerning the mechanical strength are functionally separated from the circuit connection requirement, so as to be able to bring the circuit connection, particularly for signals, "closer" to the electrotechnical characteristics of the chips. For this purpose and without taking account of the mechanical strength of the substrate, the layout miniaturization is optimized. In place of a circuit board (MCM), a laminate which can be built up to a circuit board is produced. The inventive laminate comprises an extremely thin foil with a plurality of extremely small holes simultaneously etched in an etching process. The hole diameter can be reduced by almost an order of magnitude (up to 20 .mu.m), which permits a sub-100 .mu.m technology. Such a laminate is not used as a mechanical support and is only provided for signal guidance. The effect of the miniaturization can be seen in the diameter for the plated-through holes. With a hole diameter reduction there is an increase in the current path density, which gives over 10000 plated-through holes per dm.sup.2. A drawing shows the compression ratio compared with standard technology.

Abstract translation: PCT No.PCT / CH93 / 00145 Sec。 371日期1994年2月14日 102（e）1994年2月14日PCT PCT 1993年6月9日PCT公布。 公开号WO93 / 26143 日期为1993年12月23日。在覆金属层压板中，关于机械强度的要求在功能上与电路连接要求分离，以便能够使电路连接，特别是对于信号，“更接近”电工特性 的芯片。 为此，不考虑基板的机械强度，优化了布局小型化。 代替电路板（MCM），可以生产可构建到电路板的层压板。 本发明的层压板包括在蚀刻工艺中同时蚀刻的具有多个极小孔的极薄箔。 孔径可以减少几乎一个数量级（高达20微米），这允许小于100微米的技术。 这种层压体不用作机械支撑，并且仅用于信号引导。 电镀通孔的直径可以看出小型化的效果。 随着孔径减小，电流通道密度增加，每dm2提供超过10000个电镀通孔。 图表显示了与标准技术相比的压缩比。

公开(公告)号：KR1020110066236A

公开(公告)日：2011-06-16

申请号：KR1020117012456

申请日：2007-02-20

Applicant: 이비덴 가부시키가이샤

Inventor： 이케다도모유키

IPC: H05K3/40 ,  H05K3/18

CPC classification number: H05K3/0026 ,  C25D5/02 ,  H05K1/119 ,  H05K3/0032 ,  H05K3/0094 ,  H05K3/422 ,  H05K3/423 ,  H05K3/427 ,  H05K2201/09827 ,  H05K2201/09836 ,  H05K2201/09854 ,  H05K2203/1572 ,  Y10T29/49124 ,  Y10T29/49126

Abstract: 절연성 수지 기재에 형성한 관통공 내에 도금 충전하여 이루어지는 스루홀을 갖는 프린트 배선판에 있어서, 절연성 수지 기재의 표면 및 이면으로부터 노출되는 각 스루홀의 중심축의 위치를 서로 어긋나게 하여 배치시킴으로써, 보이드 등의 결함이나 크랙의 발생을 저감시켜, 기판의 접속 불량을 저감시키고, 또한 기판의 기계적 강도를 향상시키는 스루홀 구조를 갖는 프린트 배선판을 제공한다.

Abstract translation: 缺陷通过布置与具有印刷布线板的通孔通过电镀填充在形成于绝缘性树脂基材的贯通孔，移位的中心轴线的位置由每个通孔从绝缘性树脂基材的前表面和后表面暴露于彼此，空隙等，或 提供一种具有通孔结构的印刷线路板，其减少裂纹的发生，减少基板的连接故障并且提高基板的机械强度。

公开(公告)号：KR1020100031781A

公开(公告)日：2010-03-24

申请号：KR1020107004245

申请日：2007-02-20

Applicant: 이비덴 가부시키가이샤

Inventor： 이케다도모유키

IPC: H05K3/40

CPC classification number: H05K3/0026 ,  C25D5/02 ,  H05K1/119 ,  H05K3/0032 ,  H05K3/0094 ,  H05K3/422 ,  H05K3/423 ,  H05K3/427 ,  H05K2201/09827 ,  H05K2201/09836 ,  H05K2201/09854 ,  H05K2203/1572 ,  Y10T29/49124 ,  Y10T29/49126

Abstract: A printed wiring board with through-holes having an insulating resin substratum provided with through-holes whose interior is filled with plating, wherein the positions of center-of-gravity axes of respective through-holes exposed from the front surface and rear surface of the insulating resin substratum are arranged so as to be shifted from each other. Thus, there is provided a printed wiring board with through-hole structure that realizes reducing of defects, such as void, and cracking, reducing of board connection failure and increasing of the mechanical strength of the board.

Abstract translation: 一种具有通孔的印刷电路板，其具有绝缘树脂基底，该绝缘树脂基底设置有内部填充有电镀的通孔，其中从该表面的前表面和后表面露出的相应通孔的重心轴线的位置 绝缘树脂基底被布置成彼此偏移。 因此，提供了一种具有通孔结构的印刷电路板，其实现了诸如空隙和开裂的缺陷的减少，板连接故障的减少和板的机械强度的增加。

公开(公告)号：KR1020060105033A

公开(公告)日：2006-10-09

申请号：KR1020067012836

申请日：2004-11-22

Applicant: 폼팩터, 인코포레이티드

Inventor： 마티유가에탕엘 ,  한드로스이고르케이 ,  레이놀즈칼브이

IPC: H05K3/42

CPC classification number: H05K3/42 ,  G01R1/06711 ,  G01R1/07307 ,  G01R3/00 ,  H05K3/308 ,  H05K2201/09836 ,  H05K2203/0338

Abstract: Methods are provided for making vertical feed through electrical connection structures in a substrate or tile. The vertical feed throughs can be configured to make plated through holes usable for inserting and attaching connector probes.. Probes may be attached to the plated through holes or attachment wells to create resilient spring contacts to form a wafer probe card assembly. A twisted tube plated through hole structure is formed by supporting twisted sacrificial wires coated with the plating material in a substrate, and later etching away the wires. Vertical feed throughs can also be configured to make tiles attachable and detachable as a layer between other substrates. The vertical feed through paths are formed with one end of each feed through hole permanently encapsulating a first electrical contact, and a second end supporting another pluggable and unpluggable electrical probe contact. Decoupling capacitors can be further plugged into holes formed in close proximity to the vertical feed through holes to increase performance of the decoupling capacitor.

Abstract translation: 提供了用于通过基底或瓦片中的电连接结构进行垂直馈送的方法。 垂直进料通道可以被配置成制造可用于插入和连接连接器探针的电镀通孔。探针可以附着到电镀通孔或连接孔上，以形成弹性弹簧触点以形成晶片探针卡组件。 通过将涂覆有电镀材料的扭转牺牲线支撑在基板中，并且随后蚀刻掉线来形成扭曲管镀通孔结构。 垂直进料通道也可以被配置成使得瓦片可附着和分离成其它基底之间的层。 垂直进料通道形成有每个进料通孔的一端，其永久地密封第一电接触，第二端支撑另一可插拔和可拔出的电探针接触。 去耦电容器可以进一步插入靠近垂直馈通孔形成的孔中，以提高去耦电容的性能。

公开(公告)号：KR1020000016676A

公开(公告)日：2000-03-25

申请号：KR1019980710276

申请日：1998-04-16

Applicant: 신코 덴키 고교(주)

Inventor： 호리우치미치오 ,  스야마도시아키 ,  도키타마사쿠니

IPC: H05K3/46

CPC classification number: H01L23/49827 ,  H01L2223/6622 ,  H01L2924/0002 ,  H01L2924/15174 ,  H05K1/112 ,  H05K1/115 ,  H05K3/4038 ,  H05K2201/09836 ,  H05K2201/10287 ,  H05K2201/10977 ,  H05K2203/0235 ,  H01L2924/00

Abstract: PURPOSE: A wiring board is provided which is kept free from a short circuit even if vias provided in one side of the wiring board are very narrow in space between them, wherein the vias are provided in the wiring board penetrating through it in a radial manner so as to set the vias provided in one side of the wiring board penetrating through it from its one side to other narrower in space between them than those provided in the other side. CONSTITUTION: A wiring board in which vias radially extending through the wiring board from one side to the other side in such a way that the interval between the vias on one side of the wiring board is smaller than those between the vias on the other side, characterized in that a plurality of vias are radially arranged from one side of the wiring board to the other side in such a way that the interval (Wa) between the vias on one side is smaller than the interval (Wa) between the vias on the other side in order to prevent electrical short-circuit even if the interval between the vias on one side of the wiring board is very small, and that a conductor forming a core portion (14) of each of the vias is covered with a sheath portion (16) made of an insulator.

Abstract translation: 目的：即使设置在布线板的一侧的通孔在它们之间的空间非常窄的空间中，也提供了不会发生短路的布线板，其中通孔设置在布线板中，以径向方式贯穿其中 从而将布线板的一侧的通孔从其一侧贯穿其中，而在另一侧之间设置为比另一侧更靠狭窄的通孔。 构成：布线板，其中通孔沿着布线板从一侧向另一侧径向延伸，使得布线板一侧的通孔之间的间隔小于另一侧的通孔之间的间隔， 其特征在于，多个通孔从布线板的一侧向另一侧径向布置，使得一侧的通孔之间的间隔（Wa）小于在一侧上的通孔之间的间隔（Wa） 另一侧为了防止电气短路，即使布线板一侧的通路之间的间隔非常小，并且形成每个通路的芯部（14）的导体被护套部分覆盖 （16）由绝缘体制成。

公开(公告)号：KR1020080037096A

公开(公告)日：2008-04-29

申请号：KR1020087006576

申请日：2007-02-20

Applicant: 이비덴 가부시키가이샤

Inventor： 이케다도모유키

IPC: H05K3/40 ,  H05K3/46

CPC classification number: H05K3/0026 ,  C25D5/02 ,  H05K1/119 ,  H05K3/0032 ,  H05K3/0094 ,  H05K3/422 ,  H05K3/423 ,  H05K3/427 ,  H05K2201/09827 ,  H05K2201/09836 ,  H05K2201/09854 ,  H05K2203/1572 ,  Y10T29/49124 ,  Y10T29/49126

Abstract: A printed wiring board with through-holes having an insulating resin substratum provided with through-holes whose interior is filled with plating, wherein the positions of center-of-gravity axes of respective through-holes exposed from the front surface and rear surface of the insulating resin substratum are arranged so as to be shifted from each other. Thus, there is provided a printed wiring board with through-hole structure that realizes reducing of defects, such as void, and cracking, reducing of board connection failure and increasing of the mechanical strength of the board.

Abstract translation: 一种具有通孔的印刷电路板，其具有绝缘树脂基底，该绝缘树脂基底设置有内部填充有电镀的通孔，其中从该表面的前表面和后表面露出的相应通孔的重心轴线的位置 绝缘树脂基底被布置成彼此偏移。 因此，提供了一种具有通孔结构的印刷电路板，其实现了诸如空隙和开裂的缺陷的减少，板连接故障的减少和板的机械强度的增加。