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公开(公告)号：KR1020080034853A
公开(公告)日：2008-04-22
申请号：KR1020077030660
申请日：2006-06-22
Applicant: 쓰리엠 이노베이티브 프로퍼티즈 컴파니
CPC classification number: H01R12/714 , H01R12/52 , H01R12/718 , H05K1/184 , H05K3/325 , H05K3/368 , H05K2201/09645 , H05K2201/09836 , H05K2201/10189 , H05K2201/1059
Abstract: An electrical interconnection system includes a printed circuit board having a receiving cavity therein. At least one circuit trace is located on a side wall of the cavity. An electrical connector is configured for insertion into the receiving cavity. The electrical connector has an electrical contact positioned to contact the at least one circuit trace when inserted into the receiving cavity.
Abstract translation: 电互连系统包括其中具有接收腔的印刷电路板。 至少一个电路迹线位于空腔的侧壁上。 电连接器被配置为插入到接收腔中。 电连接器具有定位成当插入接收腔时与至少一个电路迹线接触的电接触。
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公开(公告)号：KR100632554B1
公开(公告)日：2006-10-11
申请号：KR1020040116807
申请日：2004-12-30
Applicant: 삼성전기주식회사
IPC: H05K1/16
CPC classification number: H05K1/162 , H05K3/0047 , H05K3/427 , H05K2201/0187 , H05K2201/09645 , H05K2201/09836 , H05K2201/09981 , H05K2203/1476 , Y10T29/49155 , Y10T29/49156
Abstract: 본 발명은 절연층내에 긴 길이의 내장형 커패시터를 형성함으로써, 고용량의 커패시턴스(capacitance)를 제공하고 커패시턴스의 용량 설계가 자유로운 커패시터 내장형 인쇄회로기판 및 그 제조방법에 관한 것이다.
커패시터 내장형 인쇄회로기판, 내장형 커패시터, 인쇄회로기판, PCB-
公开(公告)号：KR1020050065038A
公开(公告)日：2005-06-29
申请号：KR1020030096784
申请日：2003-12-24
Applicant: 삼성전기주식회사
IPC: H05K1/11
CPC classification number: H05K1/115 , H01L23/49827 , H01L23/49833 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/01068 , H01L2924/01078 , H01L2924/09701 , H01L2924/15311 , H05K3/4602 , H05K2201/09836 , H01L2924/00
Abstract: 본 발명은 비아가 구비된 인쇄회로기판 및 패키지에 관한 것으로서, 특히 고주파에 대한 손실을 최소화할 수 있도록 구비된 비아구조에 관한 것이다.
또한, 본 발명은 다수의 절연층과 회로층을 구비하고 있는 인쇄회로기판 및 패키지의 회로층 평면에 대하여 비수직하고 신호라인에 대하여 둔각을 가지도록 형성된 비수직 비아를 구비하고 있는 것을 특징으로 하는 인쇄회로기판 및 IC패키지에 대한 것이다.-
公开(公告)号：US20240040693A1
公开(公告)日：2024-02-01
申请号：US18269137
申请日：2021-12-10
Applicant: KYOCERA Corporation
Inventor： Atsuo KAWAGOE , Takashi ISHIOKA , Masanori NAITO , Nobuyuki UEDA
CPC classification number: H05K1/0298 , H05K1/115 , H03H1/00 , H05K2201/09609 , H05K2201/09836 , H03H2001/0085
Abstract: A printed wiring board includes a dielectric layer, a first and second conductor layer, and a plurality of via conductors. The dielectric layer has first and second opposing surfaces. The first and second conductor layer lie in the first second surfaces of the dielectric layer, respectively. Each via conductor extends through the dielectric layer and connects the first and second conductor layers to each other. Part of the printed wiring board is surrounded with the via conductors and is an overlap between the first conductor layer and the second conductor layer in a transparent plan view. When viewed in plan, the via conductors each have an aspect ratio greater than 1 and a major axis extending in a first direction and a minor axis extending in a second direction. The via conductors include a via conductor whose major axis extends and connects the via conductors arranged in a line.
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205.发明申请MULTILAYER WIRING SUBSTRATE, MANUFACTURING METHOD THEREFOR, AND SUBSTRATE FOR PROBE CARD 有权多层布线基板及其制造方法及基板用于探针卡公开(公告)号：US20160044782A1
公开(公告)日：2016-02-11
申请号：US14919058
申请日：2015-10-21
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Yoshihito Otsubo , Toru Meguro , Tatsunori Kan
CPC classification number: H05K1/09 , H01L21/4867 , H01L23/49822 , H01L2224/16225 , H01L2924/0002 , H01L2924/19105 , H05K1/0298 , H05K1/112 , H05K1/115 , H05K3/0058 , H05K3/3436 , H05K3/4038 , H05K3/4084 , H05K3/42 , H05K3/4629 , H05K3/4644 , H05K3/4667 , H05K2201/0376 , H05K2201/0382 , H05K2201/09545 , H05K2201/09627 , H05K2201/09836 , H05K2201/09845 , H05K2201/1006 , H05K2203/0278 , H05K2203/063 , H05K2203/068 , H05K2203/1126 , H01L2924/00
Abstract: A multilayer wiring substrate that can realize a higher-density wiring structure is obtained. Provided is a multilayer wiring substrate, where a multilayer body including a first insulating layer and a second insulating layer stacked on the bottom surface of the first insulating layer includes printed wiring electrodes; the printed wiring electrodes are formed by printing with and sintering conductive paste; the printed wiring electrodes respectively include first wiring electrode portions located on the second insulating layer and second wiring electrode portions respectively joined to first wiring electrode portions; and the second wiring electrode portions respectively extend into through holes and, further, are exposed at the top surface of the first insulating layer.
Abstract translation: 可以获得能够实现更高密度的布线结构的多层布线基板。 提供了一种多层布线基板，其中堆叠在第一绝缘层的底表面上的包括第一绝缘层和第二绝缘层的多层体包括印刷布线电极; 印刷布线电极通过印刷和烧结导电浆料形成; 印刷布线电极分别包括位于第二绝缘层上的第一布线电极部分和分别连接到第一布线电极部分的第二布线电极部分; 并且第二布线电极部分别分别延伸到通孔中，并且还暴露在第一绝缘层的顶表面处。
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Patent Agency Ranking
公开(公告)号：US09155205B2
公开(公告)日：2015-10-06
申请号：US14134096
申请日：2013-12-19
Applicant: National Taipei University of Technology
Inventor： Chien-Yi Huang , Pin-Jou Liao
CPC classification number: H05K3/225 , H05K1/142 , H05K2201/09127 , H05K2201/0919 , H05K2201/09618 , H05K2201/09827 , H05K2201/09836 , H05K2203/175 , H05K2203/176 , Y10T29/4913
Abstract: An electronic device is disclosed. The electronic device includes at least an electronic element; and a circuit board having a base with at least a block, wherein the at least a block is used as a replaceable carrying portion for carrying the electronic element, and the electronic element is electrically connected to the circuit board. As such, when a defect occurs to the replaceable carrying portion, the replaceable carrying portion as well as the defective electronic element can be removed and replaced with good ones.
Abstract translation: 公开了一种电子设备。 电子设备至少包括电子元件; 以及具有至少具有块的基座的电路板，其中所述至少一个块用作用于承载所述电子元件的可替换的承载部分，并且所述电子元件电连接到所述电路板。 因此，当可替换的携带部分发生缺陷时，可以移除可替换的携带部分以及有缺陷的电子元件，并且更换好的。
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公开(公告)号：US09155196B2
公开(公告)日：2015-10-06
申请号：US14290193
申请日：2014-05-29
Applicant: IBIDEN CO., LTD.
Inventor： Haruhiko Morita
CPC classification number: H05K1/165 , H01L2224/16227 , H01L2224/32225 , H01L2224/73204 , H01L2924/15311 , H01L2924/3511 , H05K1/0225 , H05K1/0366 , H05K1/116 , H05K3/244 , H05K3/4602 , H05K2201/0191 , H05K2201/0293 , H05K2201/0347 , H05K2201/0723 , H05K2201/0792 , H05K2201/09136 , H05K2201/09263 , H05K2201/09454 , H05K2201/09527 , H05K2201/096 , H05K2201/09672 , H05K2201/09836
Abstract: A wiring board includes a substrate having a laminated-inductor forming portion and including multiple first insulation layers and a second insulation layer formed on a first side of the first insulation layers such that the first insulation layers have the laminated-inductor forming portion, and a planar conductor formed on the second insulation layer of the substrate and formed to shield electromagnetic force generated from the laminated-inductor forming portion of the substrate. The laminated-inductor forming portion of the substrate has multiple inductor patterns formed on the first insulation layers and multiple via conductors connecting the inductor patterns through the first insulation layers, and the inductor patterns include an uppermost inductor pattern formed between the second insulation layer and the first insulation layers such that the uppermost inductor pattern has a distance of 100 μm or more from the planar conductor.
Abstract translation: 布线基板包括具有层叠电感器形成部分并且包括多个第一绝缘层的基板和形成在第一绝缘层的第一侧上的第二绝缘层，使得第一绝缘层具有层叠电感器形成部分，以及 形成在基板的第二绝缘层上并形成以屏蔽从基板的层叠电感器形成部分产生的电磁力的平面导体。 衬底的层叠电感器形成部分具有形成在第一绝缘层上的多个电感器图案和通过第一绝缘层连接电感器图案的多个通孔导体，并且电感器图案包括形成在第二绝缘层和 第一绝缘层，使得最上层的电感器图案与平面导体的距离为100μm以上。
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公开(公告)号：US20140353022A1
公开(公告)日：2014-12-04
申请号：US14290193
申请日：2014-05-29
Applicant: IBIDEN CO., LTD.
Inventor： Haruhiko MORITA
CPC classification number: H05K1/165 , H01L2224/16227 , H01L2224/32225 , H01L2224/73204 , H01L2924/15311 , H01L2924/3511 , H05K1/0225 , H05K1/0366 , H05K1/116 , H05K3/244 , H05K3/4602 , H05K2201/0191 , H05K2201/0293 , H05K2201/0347 , H05K2201/0723 , H05K2201/0792 , H05K2201/09136 , H05K2201/09263 , H05K2201/09454 , H05K2201/09527 , H05K2201/096 , H05K2201/09672 , H05K2201/09836
Abstract: A wiring board includes a substrate having a laminated-inductor forming portion and including multiple first insulation layers and a second insulation layer formed on a first side of the first insulation layers such that the first insulation layers have the laminated-inductor forming portion, and a planar conductor formed on the second insulation layer of the substrate and formed to shield electromagnetic force generated from the laminated-inductor forming portion of the substrate. The laminated-inductor forming portion of the substrate has multiple inductor patterns formed on the first insulation layers and multiple via conductors connecting the inductor patterns through the first insulation layers, and the inductor patterns include an uppermost inductor pattern formed between the second insulation layer and the first insulation layers such that the uppermost inductor pattern has a distance of 100 μm or more from the planar conductor.
Abstract translation: 布线基板包括具有层叠电感器形成部分并且包括多个第一绝缘层的基板和形成在第一绝缘层的第一侧上的第二绝缘层，使得第一绝缘层具有层叠电感器形成部分，以及 形成在基板的第二绝缘层上并形成以屏蔽从基板的层叠电感器形成部分产生的电磁力的平面导体。 衬底的层叠电感器形成部分具有形成在第一绝缘层上的多个电感器图案和通过第一绝缘层连接电感器图案的多个通孔导体，并且电感器图案包括形成在第二绝缘层和 第一绝缘层，使得最上层的电感器图案与平面导体的距离为100μm以上。
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209.发明申请公开(公告)号：US20140216794A1
公开(公告)日：2014-08-07
申请号：US14169314
申请日：2014-01-31
Applicant: IBIDEN CO., LTD.
Inventor： Toshiaki HIBINO
CPC classification number: H05K3/429 , H05K1/0366 , H05K1/0373 , H05K3/0032 , H05K3/0055 , H05K3/108 , H05K3/4602 , H05K2201/0209 , H05K2201/09536 , H05K2201/09827 , H05K2201/09836 , H05K2201/09854 , H05K2201/09863 , H05K2201/2072 , H05K2203/108 , H05K2203/1476
Abstract: A printed wiring board includes an insulating substrate having a penetrating hole formed through the substrate, a first conductive pattern formed on first surface of the substrate, a second conductive pattern formed on second surface of the substrate on the opposite side of the first surface, and a through-hole conductor formed in the penetrating hole in the substrate such that the conductor is connecting the first conductive pattern on the first surface of the substrate and the second conductive pattern on the second surface of the substrate. The penetrating hole has a first opening portion opening on the first surface of the substrate, a second opening portion opening on the second surface of the substrate and a third opening portion connecting the first and second opening portions, and the third opening portion has the maximum diameter which is greater than the minimum diameters of the first and second opening portions.
Abstract translation: 印刷布线板包括：绝缘基板，具有穿过该基板形成的贯通孔，形成在基板的第一面上的第一导体图案，形成在基板的与第一面相反一侧的第二面上的第二导电图案;以及 形成在所述基板的所述贯通孔中的通孔导体，使得所述导体将所述基板的第一表面上的所述第一导电图案与所述基板的所述第二表面上的所述第二导电图案连接。 所述贯通孔具有在所述基板的第一面上开口的第一开口部，在所述基板的第二面上开口的第二开口部，以及连接所述第一开口部和所述第二开口部的第三开口部， 其直径大于第一和第二开口部分的最小直径。
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公开(公告)号：US20140177177A1
公开(公告)日：2014-06-26
申请号：US14134096
申请日：2013-12-19
Applicant: National Taipei University of Technology
Inventor： Chien-Yi Huang , Pin-Jou Liao
CPC classification number: H05K3/225 , H05K1/142 , H05K2201/09127 , H05K2201/0919 , H05K2201/09618 , H05K2201/09827 , H05K2201/09836 , H05K2203/175 , H05K2203/176 , Y10T29/4913
Abstract: An electronic device is disclosed. The electronic device includes at least an electronic element; and a circuit board having a base with at least a block, wherein the at least a block is used as a replaceable carrying portion for carrying the electronic element, and the electronic element is electrically connected to the circuit board. As such, when a defect occurs to the replaceable carrying portion, the replaceable carrying portion as well as the defective electronic element can be removed and replaced with good ones.
Abstract translation: 公开了一种电子设备。 电子设备至少包括电子元件; 以及具有至少具有块的基座的电路板，其中所述至少一个块用作用于承载所述电子元件的可替换的承载部分，并且所述电子元件电连接到所述电路板。 因此，当可替换的携带部分发生缺陷时，可以移除可替换的携带部分以及有缺陷的电子元件，并且更换好的。
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