公开(公告)号：US20010020748A1

公开(公告)日：2001-09-13

申请号：US09854269

申请日：2001-05-11

Inventor： Thomas H. DiStefano

IPC: H01L023/52

CPC classification number: H01L24/81 ,  H01L21/561 ,  H01L21/563 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3114 ,  H01L23/49805 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/742 ,  H01L24/94 ,  H01L2224/02319 ,  H01L2224/02333 ,  H01L2224/0401 ,  H01L2224/11003 ,  H01L2224/1184 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/274 ,  H01L2224/29101 ,  H01L2224/29298 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/18301 ,  H05K3/3436 ,  H05K3/363 ,  H05K2201/0215 ,  H05K2201/0248 ,  H05K2201/09427 ,  H05K2201/10977 ,  H05K2203/0465 ,  H05K2203/074 ,  H05K2203/306 ,  Y02P70/613 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

Abstract: A soldered assembly for a microelectronic element includes a microelectronic element, solder columns extending from a surface of the microelectronic element and terminals connected to distal ends of the columns. The assembly can be handled and mounted using conventional surface-mount techniques, but provides thermal fatigue resistance. The solder columns may be inclined relative to the chip surface, and may contain long, columnar inclusions preferentially oriented along the lengthwise axes of the columns.

Abstract translation: 用于微电子元件的焊接组件包括微电子元件，从微电子元件的表面延伸的焊料柱和连接到柱的远端的端子。 组件可以使用传统的表面贴装技术进行处理和安装，但提供耐热疲劳性能。 焊料柱可以相对于芯片表面倾斜，并且可以包含沿着柱的纵向轴线优先取向的长的柱状夹杂物。

公开(公告)号：US5879568A

公开(公告)日：1999-03-09

申请号：US870379

申请日：1997-06-06

Applicant: Naoyuki Urasaki ,  Kouichi Tsuyama ,  Kazuhito Kobayashi ,  Norio Okano ,  Hiroshi Shimizu ,  Nobuyuki Ogawa ,  Akishi Nakaso ,  Toyoki Ito ,  Daisuke Fujimoto ,  Kazuhisa Otsuka ,  Shigeharu Arike ,  Yoshiyuki Tsuru

Inventor： Naoyuki Urasaki ,  Kouichi Tsuyama ,  Kazuhito Kobayashi ,  Norio Okano ,  Hiroshi Shimizu ,  Nobuyuki Ogawa ,  Akishi Nakaso ,  Toyoki Ito ,  Daisuke Fujimoto ,  Kazuhisa Otsuka ,  Shigeharu Arike ,  Yoshiyuki Tsuru

IPC: H05K1/00 ,  H05K3/00 ,  H05K3/02 ,  H05K3/46 ,  B44C1/22

CPC classification number: H05K3/4655 ,  H05K3/0035 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01078 ,  H05K2201/0209 ,  H05K2201/0248 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2203/0554 ,  H05K3/0094 ,  H05K3/025 ,  H05K3/4652 ,  H05K3/4676

Abstract: A multilayer printed circuit board small in interlayer thickness, capable of fine wiring, minimized in IVH and BVH diameters, high in strength and also excellent in wire bonding workability can be produced by a process comprising the steps of coating a thermosetting resin varnish compounded with electrically insulating whiskers on a roughened side of a copper foil, semi-curing the resin by heating to form a thermosetting resin layer, integrally laminating it on an interlayer board in which plated through-holes and conductor circudits have been formed, and roughening the cured thermosetting resin layer on the via hole wall surfaces with a roughening agent.

Abstract translation: 可以通过包括以下步骤的方法制备层间厚度小的能够精细布线，IVH和BVH直径最小化，强度高以及引线键合加工性优异的多层印刷电路板，其中包括以下步骤：涂覆电化学复合的热固性树脂清漆 在铜箔的粗糙面上的绝缘晶须，通过加热半固化以形成热固性树脂层，将其整体地层压在已经形成电镀通孔和导体环形的夹层板上，并使固化的热固性树脂 树脂层在通孔壁表面上用粗糙剂。

公开(公告)号：US5127158A

公开(公告)日：1992-07-07

申请号：US575295

申请日：1990-08-30

Applicant: Akikazu Nakano

Inventor： Akikazu Nakano

IPC: H05K1/03 ,  H05K3/02

CPC classification number: H05K1/0373 ,  H05K1/0366 ,  H05K2201/0129 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0239 ,  H05K2201/0248 ,  H05K2201/0251 ,  H05K2201/09118 ,  H05K3/022 ,  Y10T29/4916

Abstract: A process for producing a printed circuit board includes steps, sequentially conducted of dispersing in water or organic solvent:(A) 95 to 20% by weight of a styrene polymer having a syndiotactic structure, (B) 5 to 80% by weight of a fibrous filler having a fiber length of 1 to 50 mm, and (C) 0.1 to 30 parts by weight of at least one of a binder and a binding fiber in proportion to 100 parts by weight of the total amount of the components (A) and (B), to make a slurry having a concentration of 0.5 to 100 g/l; separating the solids from the slurry and drying and molding them. Thereafter the solids are either subjected to melting with heating and pressure forming into the molded article, or they are impregnated with a thermoplastic resin which is then cured. Finally, a metal layer is provided on the molded article.

公开(公告)号：EP2525398A4

公开(公告)日：2017-03-15

申请号：EP11732925

申请日：2011-01-13

Applicant: KYOCERA CORP

Inventor： ISHIMINE YUUSAKU ,  MORIYAMA MASAYUKI ,  KOMATSUBARA KENJI

IPC: H01L23/15 ,  H01L23/13 ,  H01L23/373 ,  H05K1/02 ,  H05K1/03

CPC classification number: H01L23/13 ,  C04B35/587 ,  C04B37/026 ,  C04B2235/3206 ,  C04B2235/3217 ,  C04B2235/3224 ,  C04B2235/3878 ,  C04B2235/3882 ,  C04B2235/5276 ,  C04B2235/5436 ,  C04B2235/5445 ,  C04B2235/604 ,  C04B2235/6581 ,  C04B2235/6582 ,  C04B2235/6587 ,  C04B2235/721 ,  C04B2235/723 ,  C04B2235/77 ,  C04B2235/786 ,  C04B2235/80 ,  C04B2235/945 ,  C04B2235/9607 ,  C04B2237/125 ,  C04B2237/368 ,  C04B2237/407 ,  C04B2237/74 ,  H01L23/15 ,  H01L23/3731 ,  H01L23/3735 ,  H01L35/32 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K3/38 ,  H05K2201/0248 ,  H05K2201/0266 ,  H05K2201/0269 ,  Y10T428/24413 ,  Y10T428/24421 ,  Y10T428/25 ,  Y10T428/259 ,  H01L2924/00

Abstract: Provided is a silicon nitride substrate capable of enhancing the bond strength when a member made of a metal is bonded to the substrate, and a circuit substrate and an electronic device capable of improving reliability by using the silicon nitride substrate. The silicon nitride substrate 1 comprises a substrate 1a comprising a silicon nitride sintered body, and a plurality of granular bodies 1b containing silicon and integrated to a principal surface of the substrate 1a, wherein a plurality of needle crystals 1c or column crystals 1d comprising mainly silicon nitride are extended from a portion of the granular bodies 1b. A brazing material is applied to a principal surface of the substrate 1a, and a circuit member and a heat radiation member are arranged on the applied brazing material, and bonded by heating. Because of a plurality of granular bodies 1b integrated to the principal surface of the substrate 1a, and a plurality of the needle crystals 1c or the column crystals 1d extended from a portion of the granular bodies 1b, a high anchor effect is produced so that the circuit member and the heat radiation member are firmly bonded to the silicon nitride substrate 1.

Abstract translation: 提供一种当由金属制成的构件结合到基板上时能够提高结合强度的氮化硅衬底，以及能够通过使用氮化硅衬底提高可靠性的电路衬底和电子器件。 氮化硅衬底1包括包括氮化硅烧结体的衬底1a和包含硅的多个粒状体1b，并与衬底1a的主表面一体化，其中主要包含硅的多个针状晶体1c或柱状晶体1d 氮化物从颗粒体1b的一部分延伸。 将钎焊材料施加到基板1a的主表面，并且将电路构件和散热构件布置在所施加的钎焊材料上，并通过加热粘结。 由于在基体1a的主面上形成有多个粒状体1b，并且从粒状体1b的一部分延伸的多个针状结晶体1c或柱状结晶体1d，产生高的锚效应， 电路构件和散热构件牢固地结合到氮化硅衬底1上。

公开(公告)号：EP2883430A1

公开(公告)日：2015-06-17

申请号：EP12882879.5

申请日：2012-08-10

Applicant: Telefonaktiebolaget LM Ericsson (PUBL)

Inventor： PEREZ-URIA, Igor ,  FERM, Per ,  GUSTAFSON, Benny

IPC: H05K3/40

CPC classification number: H05K1/144 ,  H05K1/115 ,  H05K1/141 ,  H05K3/10 ,  H05K3/303 ,  H05K3/3436 ,  H05K3/3494 ,  H05K3/4015 ,  H05K3/4046 ,  H05K3/4053 ,  H05K3/42 ,  H05K2201/0248 ,  H05K2201/0305 ,  H05K2201/09563 ,  H05K2201/09572 ,  H05K2201/10234 ,  H05K2201/10734 ,  H05K2201/10878 ,  H05K2201/10916 ,  H05K2203/0338 ,  H05K2203/0455 ,  H05K2203/1105 ,  Y10T29/49124

Abstract: The present invention relates to a printed circuit board arrangement (400) and a method for forming an electrical connection at a printed circuit board. The printed circuit board arrangement comprises a printed circuit board (410) having a first side (411), a second side (412) and an electrical connection (413) electrically connecting a first conductive layer and a second conductive layer (417) of the printed circuit board. The electrical connection (413) comprises a passage (416) extending from an opening in one of the sides of the printed circuit board through the printed circuit board between the first and second layers. Electrically conducting material (414) is formed on the walls (415) of the passage. The electrically conducting material forms a first path electrically connecting the first conductive layer (417) with the second conductive layer (417). At least one first ball 420 is enclosed by the passage. The at least one firstball is electrically conducting and has a diameter which is equal to or smaller than the length and diameter of the passage, wherein the at least one first ball (420) form part of a second electrical path between the first and second conductive layers of the printed circuit board, said second electrical path having a lower resistance than the first path.

公开(公告)号：EP2437582A4

公开(公告)日：2014-10-22

申请号：EP10780370

申请日：2010-04-13

Applicant: SUMITOMO ELECTRIC INDUSTRIES ,  SUMITOMO ELEC PRINTED CIRCUITS

Inventor： YAMAMOTO MASAMICHI ,  NAKATSUGI KYOUICHIROU ,  YAMAGUCHI TAKASHI ,  KAWAKAMI SHIGEKI ,  KIMURA MICHIHIRO

IPC: H05K1/14 ,  H05K3/34 ,  H05K3/36

CPC classification number: H05K3/282 ,  H01L2924/0002 ,  H05K1/148 ,  H05K3/305 ,  H05K3/323 ,  H05K3/361 ,  H05K3/363 ,  H05K2201/0248 ,  H05K2201/0373 ,  H05K2201/083 ,  H05K2201/10977 ,  H05K2203/104 ,  Y10T29/49213 ,  H01L2924/00

公开(公告)号：EP2445322B1

公开(公告)日：2013-07-10

申请号：EP11192444.5

申请日：2010-05-18

Applicant: Sumitomo Electric Industries, Ltd. ,  Sumitomo Electric Printed Circuits, Inc.

Inventor： Yamamoto, Masamichi ,  Nakatsugi, Kyouichirou ,  Yamaguchi, Takashi ,  Kawakami, Shigeki ,  Kimura, Michihiro

IPC: H05K3/32 ,  H05K3/36 ,  H05K3/34 ,  H05K3/28

CPC classification number: H05K3/361 ,  C23F11/149 ,  H01L2924/0002 ,  H05K3/282 ,  H05K3/305 ,  H05K3/323 ,  H05K3/3431 ,  H05K3/4007 ,  H05K2201/0248 ,  H05K2201/0373 ,  H05K2201/094 ,  H05K2201/10977 ,  H05K2201/10992 ,  H05K2203/308 ,  Y10T156/10 ,  H01L2924/00

公开(公告)号：EP1946626B1

公开(公告)日：2013-03-06

申请号：EP06832782.4

申请日：2006-11-10

Applicant: Panasonic Corporation

Inventor： SAKAI, Tadahiko c/o Matsushita Electric Industrial Co., Ltd. ,  MAEDA, Tadashi c/o Matsushita Electric Industrial Co., Ltd. ,  OZONO, Mitsuru c/o Matsushita Electric Industrial Co., Ltd.

IPC: H05K3/34 ,  B23K35/02

CPC classification number: H05K3/3484 ,  H01L2224/05573 ,  H01L2224/16225 ,  H05K3/3436 ,  H05K3/3489 ,  H05K2201/0215 ,  H05K2201/0218 ,  H05K2201/0245 ,  H05K2201/0248 ,  H05K2201/10977 ,  H05K2203/0435 ,  Y10T428/12049

公开(公告)号：EP2437582A1

公开(公告)日：2012-04-04

申请号：EP10780370.2

申请日：2010-04-13

Applicant: Sumitomo Electric Industries, Ltd. ,  Sumitomo Electric Printed Circuits, Inc.

Inventor： YAMAMOTO, Masamichi ,  NAKATSUGI, Kyouichirou ,  YAMAGUCHI, Takashi ,  KAWAKAMI, Shigeki ,  KIMURA, Michihiro

IPC: H05K1/14 ,  H05K3/34 ,  H05K3/36

CPC classification number: H05K3/282 ,  H01L2924/0002 ,  H05K1/148 ,  H05K3/305 ,  H05K3/323 ,  H05K3/361 ,  H05K3/363 ,  H05K2201/0248 ,  H05K2201/0373 ,  H05K2201/083 ,  H05K2201/10977 ,  H05K2203/104 ,  Y10T29/49213 ,  H01L2924/00

Abstract: There is provided an electrode structure to be electrically connected to a connection conductor by being bonded thereto with an anisotropic conductive adhesive mainly composed of a thermosetting resin, the electrode structure including an electrode for connection using an adhesive, the electrode being arranged on a base material, and an organic film serving as an oxidation preventing film configured to cover a surface of the electrode for connection using an adhesive, in which the organic film has a higher decomposition temperature than the maximum temperature of heat treatment to be performed. A wiring body and a connecting structure using an adhesive are also provided.

Abstract translation: 有通过被键合到其上的主要成分为热固性树脂的各向异性导电粘接剂设置在电极结构，以电连接到连接导体，包括对电极使用于粘合剂连接的电极结构，所述电极被布置在基体材料 ，并在有机薄膜用作到被配置为覆盖所述电极的表面，使用于粘合剂连接，其中，所述有机膜具有比要进行热处理的最高温度更高的分解温度氧化防止电影。 一种布线体和设置在一连接使用结构粘合剂是如此。

公开(公告)号：EP2159805A1

公开(公告)日：2010-03-03

申请号：EP09173628.0

申请日：2006-08-31

Applicant: BASF SE

Inventor： Schneider, Norbert ,  Lippert, Gerald ,  Lochtman, Rene ,  Maas, Heiko ,  Pfister, Jürgen ,  Sobotka, Bettina ,  Wagner, Norbert

IPC: H01B1/22 ,  C08K3/08 ,  C08K7/06

CPC classification number: H01B1/22 ,  C09D5/24 ,  H05K1/095 ,  H05K3/246 ,  H05K2201/0245 ,  H05K2201/0248 ,  H05K2201/0272 ,  H05K2201/0347 ,  Y10T428/25 ,  Y10T428/256 ,  Y10T428/258

Abstract: Die vorliegende Erfindung betrifft eine Dispersion zum Aufbringen einer Metallschicht auf einem elektrisch nicht leitfähigen Substrat enthaltend eine organischen Bindemittelkomponente, eine Metallkomponente mit unterschiedlichen Metallen und/oder Metallteilchenformen sowie einer Lösemittelkomponente. Weiterhin betrifft die Erfindung Verfahren zur Herstellung der Dispersion, Verfahren zur Herstellung einer gegebenenfalls strukturierten Metallschicht mit Hilfe der Dispersion sowie die erhaltenen Substratoberflächen und deren Verwendung.

Abstract translation: 分散体在上电等非导电基底包括有机粘合剂成分的施加金属层（0.01-30重量％）; （0.01-99.99％（重量）），其包含第一金属具有第一金属粒子和具有第二金属粒子的第二金属的金属组分（30-89.99重量％。）（99.99-0.01重量％）; 和溶剂组分（10-69.99重量％。）; 其中，所述第一金属和 - 粒子和第二金属和 - 粒子是从海誓山盟不同。 独立权利要求中包括了：（1）用于制备分散体，包括有机粘合剂成分的混合的方法中，金属成分包含具有第一金属粒子和具有第二金属粒子的第二金属，溶剂组分的第一种金属，分散剂 ，填料组分和另外的组分，和所获得的混合物分散; （2）金属层的制备上的至少一个电其他非导电基底包括将所述分散体在基板上的一部分，干燥在基材上和该分散体中的应用层OPTIONALLY去激励和/或电气上的干燥的分离金属 分散层; 和（3）的表面的衬底，其包含至少一个部分导电金属层。