公开(公告)号：KR1020060009401A

公开(公告)日：2006-01-31

申请号：KR1020060002248

申请日：2006-01-09

Applicant: 닛본 덴끼 가부시끼가이샤

Inventor： 모모카와유키

IPC: H05K1/02 ,  H05K1/09 ,  H05K3/34 ,  H05K3/40

CPC classification number: H05K3/3452 ,  H05K3/301 ,  H05K3/306 ,  H05K3/3447 ,  H05K3/3463 ,  H05K2201/099 ,  H05K2201/10568 ,  H05K2201/10575 ,  H05K2201/10901 ,  H05K2201/10909 ,  H05K2201/2036 ,  H05K2201/2081 ,  H05K2203/0182 ,  H05K2203/0577 ,  H05K2203/0588 ,  H05K2203/1189 ,  H05K2203/1394

Abstract: 무연솔더를 이용하여도 낮은 비용으로 랜드박리를 생기지 않게 위하여, 관통홀(12)을 갖는 기판(11), 관통홀(12)의 내면을 덮는 제1도전막(13), 기판(11)의 표면에서의 관통홀(12)의 개구의 주위에 형성되고 아울러 제1도전막(13)에 접속된 제2도전막으로 이루어진 랜드(15), 기판(11)의 표면에 형성되고 아울러 랜드(15)에 접속된 회로배선(16), 이 회로배선(16)을 덮는 보호막(17), 및 랜드(15)의 외주가장자리(15A)의 적어도 일부를 덮는 피복부재(18)를 구비한다.
기판, 랜드박리, 랜드, 피복부재, 무연솔더

Abstract translation: 具有通孔12的基板11，覆盖通孔12的内表面的第一导电膜13和覆盖通孔12的内表面的第一导电膜13， 它是围绕在表面处的通孔12的开口形成，以及形成由第二导电膜15，基板11被连接到第一导电膜13以及土地的土地的表面上（15 覆盖电路布线16的保护膜17和覆盖焊盘15的外周缘15A的至少一部分的覆盖部件18。

公开(公告)号：KR100366747B1

公开(公告)日：2003-01-09

申请号：KR1020007003269

申请日：1995-11-15

Applicant: 폼팩터, 인크.

Inventor： 칸드로스이고르와이. ,  매튜개탄엘. ,  엘드릿지벤자민엔. ,  그루브개리더블류.

IPC: H01L21/66

CPC classification number: H05K7/1069 ,  B23K1/0016 ,  B23K20/004 ,  B23K2201/40 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/0483 ,  G01R31/2863 ,  H01L21/288 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L21/67138 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/05082 ,  H01L2224/05644 ,  H01L2224/1134 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13582 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/16145 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/45644 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/48644 ,  H01L2224/48699 ,  H01L2224/48844 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H05K1/141 ,  H05K3/20 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2224/48744 ,  H01L2924/20751 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/00015 ,  H01L2924/2075 ,  H01L2924/20754

Abstract: 탄성 접촉 구조물(430)은 다이(402a, 402b)들이 반도체 웨이퍼로부터 개별화(분리)되기 전에 하나의 반도체 다이(402a, 402b) 상에 패드(410)들을 결합하도록 직접 장착된다. 이는 복수개의 단자(712)가 배치된 표면을 갖는 회로 기판(710) 등을 갖춘 반도체 다이(702, 704)에 연결함으로써 반도체 다이(402a, 402b)들을 실행(예를 들어, 시험 및/또는 번인 등)시킬 수 있게 해준다. 따라서, 반도체 다이(402a, 402b)들은 반도체 웨이퍼로부터 개별화될 수 있어서, 동일한 탄성 접촉 구조물(430)이 반도체 다이들과 (와이어링 구조, 반도체 패키지 등)의 다른 전자 부품들 사이의 상호 접속을 수행하는 데 사용될 수 있다. 탄성 접촉 구조물로서 본 발명의 모든 금속성 복합 상호 접속 요소(430)를 사용함으로써 번인을 적어도 150 ℃의 온도로 60분 미만 내에서 완료할 수 있다.

Abstract translation: 本发明提供了一种测试半导体器件（702,704）之前从半导体晶片分离的方法。 所述方法包括以下步骤：将多个弹性接触结构（708）直接永久地安装到驻留在半导体晶片上的至少一个半导体器件（702,704）上的多个第一端子，每个所述弹性接触结构 具有尖端并从半导体器件的表面延伸; 将具有多个第二端子（712）的衬底（710）推向半导体器件的表面以实现多个第二端子中的相应一个与弹性接触结构的尖端之间的多个电连接; 以及向衬底的第二端子提供信号以锻炼半导体器件。

公开(公告)号：KR1019930002813B1

公开(公告)日：1993-04-10

申请号：KR1019900006388

申请日：1990-05-07

Applicant: 가부시끼가이샤 히다치 세이사꾸쇼

Inventor： 기따노마꼬또 ,  니시무라아사오 ,  야구찌아끼히로 ,  가와이스에오 ,  호시아끼오 ,  시미즈이찌오

IPC: H01L23/48 ,  H01L23/50

CPC classification number: H01L23/49582 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/181 ,  H05K3/3426 ,  H05K2201/10689 ,  H05K2201/10772 ,  H05K2201/10909 ,  H05K2201/2081 ,  Y02P70/613 ,  H01L2224/45099 ,  H01L2224/29099 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: 내용 없음.

公开(公告)号：EP2434859A4

公开(公告)日：2014-10-01

申请号：EP10777921

申请日：2010-05-17

Applicant: DOO SUNG IND CO LTD

Inventor： KIM SEON TAE ,  LEE HYUNG CHUN ,  LEE SANG WON

IPC: H05K9/00 ,  H05K3/30

CPC classification number: H05K3/3421 ,  H01R13/03 ,  H01R13/2414 ,  H05K2201/10909 ,  Y02P70/613

公开(公告)号：EP2609604A1

公开(公告)日：2013-07-03

申请号：EP11773019.2

申请日：2011-08-23

Applicant: Hispano Suiza

Inventor： LHOMMEAU, Tony

IPC: H01G2/06 ,  H05K3/34

CPC classification number: H05K1/181 ,  H01G2/065 ,  H01G4/12 ,  H01G4/228 ,  H05K3/3426 ,  H05K2201/10909 ,  Y02P70/613

Abstract: The invention relates to a printed circuit comprising a substrate (1) onto which at least one ceramic component (2, 3, 4) is attached so as to enable the heat produced by the ceramic component (2, 3, 4) to be discharged and to prevent cracks in the ceramic component (2, 3, 4) and in the substrate (1). To this end, the ceramic component (2, 3, 4) is attached onto the substrate (1) by means of two connectors (5, 6) made of metal matrix composite material. Said two connectors further preferably have incisions so as to enable the mechanical stresses exerted in the substrate to be carried over into the connectors.

公开(公告)号：EP2140963A1

公开(公告)日：2010-01-06

申请号：EP09013006.3

申请日：1998-12-09

Applicant: Renesas Technology Corp.

Inventor： Shimokawa, Hanae ,  Soga, Tasao ,  Okudaira, Hiroaki ,  Ishida, Toshiharu ,  Nakatsuka, Tetsuya ,  Inaba, Yoshiharu ,  Nishimura, Asao

IPC: B23K1/20 ,  B23K35/26 ,  H05K3/34 ,  H01L23/50 ,  C22C13/02

CPC classification number: H05K1/181 ,  B23K1/0016 ,  B23K35/004 ,  B23K35/007 ,  B23K35/262 ,  B23K2201/40 ,  H01L23/488 ,  H01L23/49811 ,  H01L23/532 ,  H01L24/29 ,  H01L2224/83101 ,  H01L2924/01322 ,  H01L2924/15747 ,  H05K3/3426 ,  H05K3/3463 ,  H05K2201/10909 ,  Y02P70/613 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49169 ,  Y10T428/12708 ,  Y10T428/12715 ,  H01L2924/00

Abstract: Provided are a bonded structure by a lead-free solder and an electronic article comprising the bonded structure. The bonded structure has a stable bonding interface with respect to a change in process of time, an enough strength and resistance to occurrence of whiskers while keeping good wettability of the solder. In the bonded structure, a lead-free Sn-Ag-Bi alloy solder is applied to an electrode through an Sn-Bi alloy layer. The Sn-Bi alloy, preferably, comprises 1 to 20 wt% Bi in order to obtain good wettability of the solder. In order to obtain desirable bonding characteristics having higher reliability in the invention, a copper layer is provided under the Sn-Bi alloy layer thereby obtaining an enough bonding strength.

Abstract translation: 提供通过无铅焊料的接合结构和包含接合结构的电子制品。 粘合结构相对于时间的变化具有稳定的结合界面，足够的强度和耐发生晶须同时保持焊料的良好润湿性。 在接合结构中，通过Sn-Bi合金层向电极施加无铅Sn-Ag-Bi合金焊料。 Sn-Bi合金优选含有1〜20重量％的Bi，以获得良好的焊料润湿性。 为了获得本发明中具有较高可靠性的理想的接合特性，在Sn-Bi合金层下方设置有铜层，从而获得足够的接合强度。

公开(公告)号：EP1439397A3

公开(公告)日：2009-09-02

申请号：EP04005888.5

申请日：1995-11-15

Applicant: FormFactor, Inc.

Inventor： Khandros, Igor Y. ,  Mathieu, Gaetan L. ,  Eldridge, Benjamin N. ,  Grube, Gary W.

IPC: G01R31/28

CPC classification number: H05K7/1069 ,  B23K1/0016 ,  B23K20/004 ,  B23K2201/40 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/0483 ,  G01R31/2863 ,  H01L21/288 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L21/67138 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/05082 ,  H01L2224/05644 ,  H01L2224/1134 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13582 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/16145 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/45644 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/48644 ,  H01L2224/48699 ,  H01L2224/48844 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H05K1/141 ,  H05K3/20 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2224/48744 ,  H01L2924/20751 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/00015 ,  H01L2924/2075 ,  H01L2924/20754

Abstract: A method of burning-in semiconductor devices, comprising permanently mounting a plurality of resilient contact structures on a plurality of unsingulated semiconductor devices on a semiconductor wafer; powering up at least a portion of the unsingulated semiconductor devices by making pressure connections to the resilient contact structures on the portion of the unsingulated semiconductor devices; and heating the semiconductor devices to a temperature of at least 150° C for less than 60 minutes.

公开(公告)号：EP2091078A1

公开(公告)日：2009-08-19

申请号：EP07831416.8

申请日：2007-11-08

Applicant: Nihon Dempa Kogyo Co., Ltd.

Inventor： YAMADA, Hiroaki

IPC: H01L23/12 ,  H03H9/02

CPC classification number: H05K3/3442 ,  B81B7/0051 ,  B81B2207/07 ,  H01L23/49838 ,  H01L2224/16225 ,  H03H9/02102 ,  H03H9/02133 ,  H03H9/1021 ,  H05K1/0243 ,  H05K2201/068 ,  H05K2201/10068 ,  H05K2201/10909 ,  Y02P70/613

Abstract: An electronic component, which is surface-mounted on a wiring board by soldering, and in which the occurrence of cracks in the solder after surface-mounting is suppressed, comprises: a member constituting at least part of a container and made of ceramic; and an external terminal provided on the outer surface of the member and used in surface-mounting the electronic component on the wiring board by solder. The film thickness of a layer constituting the external terminal is designed so that when the thermal expansion coefficient of the ceramic constituting the member is α 1 , combined expansion coefficient α k of the member and the external terminal satisfies a relation of 1.029≤α k /α 1 ≤1.216. The external terminal preferably comprises a nickel layer as an electrode body.

Abstract translation: 通过焊接表面安装在布线板上的电子部件被抑制，表面安装后的焊料的裂纹的发生被抑制，包括：构成容器的至少一部分并由陶瓷制成的部件; 以及设置在构件的外表面上并用于通过焊料将电子部件表面安装在布线板上的外部端子。 构成外部端子的层的膜厚设计成当构成构件的陶瓷的热膨胀系数为±1时，构件和外部端子的组合膨胀系数±k满足1.029‰¤±k /±1‰¤1.216。 外部端子优选地包括作为电极体的镍层。

公开(公告)号：EP1754400A1

公开(公告)日：2007-02-21

申请号：EP05748489.1

申请日：2005-06-03

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： HIDAKA, Akio ,  IKEBE, Shouichi ,  MURANO, Yuuichi ,  KAZITANI, Hirozumi ,  IKEDA, Mika ,  MIZOGUCHI, Yoshitaka

IPC: H05K5/00

CPC classification number: H05K3/3426 ,  H01G2/065 ,  H05K5/0095 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09154 ,  H05K2201/10651 ,  H05K2201/10772 ,  H05K2201/10909 ,  H05K2201/2009 ,  Y02P70/613

Abstract: The present invention aims to supply an electronic component which is manufactured in a manufacturing process at low cost, and realize improvement of shock resistance, endurance, flexure resistance, mounting reliability etc. at the same time, without requiring fine adjustment etc. The invention is an electronic component 1 which has an element 2, a pair of terminal portions 4 which were disposed on the element 2, and an external covering material 5 which covers the a part of the terminal portions 4 and the element 2, and configured in such a manner that inclined portions 10 are disposed on corner portions of a bottom surface 9 and side surfaces of the external covering material 5, and the terminal portions 4 are protruded from corner portions where the inclined portions 10 and the bottom surface 9 of the external covering material intersect.

公开(公告)号：EP1698212A2

公开(公告)日：2006-09-06

申请号：EP04801381.7

申请日：2004-12-15

Applicant: MATSUSHITA ELECTRIC WORKS, LTD.

Inventor： KAMBARA, Yasushi ,  MOTOYAMA, Akira ,  NAKAJIMA, Masayuki

IPC: H05B41/282 ,  H05B41/02 ,  H01G2/06

CPC classification number: H01G4/228 ,  H01G2/06 ,  H01G4/18 ,  H05B41/2827 ,  H05K3/3447 ,  H05K3/3463 ,  H05K2201/062 ,  H05K2201/10909 ,  H05K2203/304

Abstract: A lighting device for a lamp device is provided. The lighting device includes a circuit board and film capacitors packaged on the circuit board by using leadless flow solders. Each film capacitor comprises polypropylene films and lead wires, and a material of the lead wires has a thermal conductivity lower than a thermal conductivity of copper, and terminals and internal materials of the film capacitors are leadless. A diameter of the lead wires is 0.6~ (mm) or less, a cross-sectional area is 35mm2 or less, and a temperature at a terminal end of the lead wires in the film capacitors during a soldering process is 130°C or less.