公开(公告)号：WO2003073807A1

公开(公告)日：2003-09-04

申请号：PCT/JP2003/001744

申请日：2003-02-19

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. ,  SHIMADA, Mikihiro ,  ISHIDA, Kaoru ,  ASAKURA, Hiroyuki

Inventor： SHIMADA, Mikihiro ,  ISHIDA, Kaoru ,  ASAKURA, Hiroyuki

IPC: H05K1/02

CPC classification number: H01P3/026 ,  H01P3/023 ,  H05K1/0228 ,  H05K1/0237 ,  H05K1/0298 ,  H05K2201/09236 ,  H05K2201/09672

Abstract: A wired transmission path 1 includes first and second differential transmission paths 12 and 13. The first differential transmission path 12 is composed of two strip lines 121 and 122, and the second differential transmission path 13 is composed of two strip lines 131 and 132. Each of the strip lines 121 and 122 is disposed at an equal distance from the strip lines 131 and 132. Thus, there is provided a wired transmission path including a plurality of differential transmission paths in such a manner as to cancel crosstalk.

Abstract translation: 有线传输路径1包括第一和第二差分传输路径12和13.第一差分传输路径12由两条带状线121和122组成，第二差分传输路径13由两条带状线131和132组成。每条 带状线121和122被设置在与带状线131和132相等的距离处。因此，提供一种包括多个差分传输路径的有线传输路径，以消除串扰。

公开(公告)号：WO00051232A1

公开(公告)日：2000-08-31

申请号：PCT/US2000/004858

申请日：2000-02-23

IPC: H03H7/01 ,  H03H7/38 ,  H05K1/02 ,  H05K1/11 ,  H05K1/16 ,  H05K3/34 ,  H05K3/42

CPC classification number: H05K1/025 ,  H01L2224/48091 ,  H01L2924/30107 ,  H01L2924/3011 ,  H03H7/0115 ,  H03H7/38 ,  H03H2001/0085 ,  H05K1/0216 ,  H05K1/0231 ,  H05K1/0233 ,  H05K1/113 ,  H05K1/116 ,  H05K1/162 ,  H05K3/3421 ,  H05K3/429 ,  H05K2201/09263 ,  H05K2201/09454 ,  H05K2201/09672 ,  H05K2201/09727 ,  H05K2201/10689 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method of optimizing the frequency response of an interconnect system of the type which conveys high frequency signals between bond pads of separate integrated circuits (ICs) mounted on a printed circuit board (PCB) through inductive conductors, such as bond wires and package legs, and a trace on the surface of the PCB. To improve the interconnect system, capacitance is added to the trace and inductance is added to the conductors, with the added trace capacitance and conductor inductance being appropriately sized relative to one another and to various other interconnect system impedances to optimize the interconnect system impedance matching frequency response.

Abstract translation: 一种优化在互连系统的频率响应的方法，该互连系统通过诸如键合线和封装腿之类的感应导体在安装在印刷电路板（PCB）上的单独集成电路（IC）的接合焊盘之间传送高频信号， 以及PCB表面的痕迹。 为了改善互连系统，电容被添加到迹线中，并且电感被添加到导体，其中添加的迹线电容和导体电感相对于彼此适当地大小以及各种其它互连系统阻抗以优化互连系统阻抗匹配频率 响应。

公开(公告)号：WO1998013875A1

公开(公告)日：1998-04-02

申请号：PCT/RU1996000277

申请日：1996-09-26

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  IOVDALSKY, Viktor Anatolievich ,  AIZENBERG, Eduard Volfovich ,  BEIL, Vladimir Iliich ,  LOPIN, Mikhail Ivanovich

Inventor： SAMSUNG ELECTRONICS CO., LTD.

IPC: H01L27/01

CPC classification number: H05K1/162 ,  H01L23/66 ,  H01L2924/0002 ,  H05K1/024 ,  H05K3/0061 ,  H05K3/107 ,  H05K2201/0191 ,  H05K2201/09036 ,  H05K2201/09054 ,  H05K2201/09672 ,  H05K2201/09736 ,  H05K2201/09845 ,  H05K2201/09981 ,  H05K2203/171 ,  H05K2203/175 ,  H01L2924/00

Abstract: The present invention relates to a hybrid integrated circuit that comprises a board (1) having a metallised recess (8) formed on its front or rear side. The lower plate (6) of the capacitor (5) is used for the metallisation of the recess, while the remaining part (9) of the board (1) under said recess (8) is used as the capacitor (5) dielectric. The upper plate (7) is located on the front side of the board (1) and represents the region for the metallisation layout pattern (2). The remaining thickness of the board (1) in the recess (8) ranges from 1 to 400 mu m.

Abstract translation: 本发明涉及一种混合集成电路，其包括具有在其前侧和后侧形成的金属化凹部（8）的板（1）。 电容器（5）的下板（6）用于凹陷的金属化，而在所述凹槽（8）下面的板（1）的剩余部分（9）用作电容器（5）电介质。 上板（7）位于板（1）的前侧，并且表示用于金属化布局图案（2）的区域。 凹槽（8）中的板（1）的剩余厚度为1至400μm。

公开(公告)号：WO1996010261A1

公开(公告)日：1996-04-04

申请号：PCT/DE1995001214

申请日：1995-09-06

Applicant: SIEMENS AKTIENGESELLSCHAFT ,  BRAND, Uwe

Inventor： SIEMENS AKTIENGESELLSCHAFT

IPC: H01B11/00

CPC classification number: H05K1/0245 ,  H05K1/0228 ,  H05K2201/0715 ,  H05K2201/09236 ,  H05K2201/09672 ,  H05K2201/09709

Abstract: In the circuit board (5) proposed, two signal layers are disposed between two screening layers (6). The two conductor tracks (1 and 2) of a symmetrical pair of conductors are divided between the two signal levels. Two adjacent conductor pairs are associated with each other in such a way that their connection planes cross.

Abstract translation: 所述电路板（5）的2个屏蔽层（6）之间布置两个信号层。 对称线对的两个导体轨（1和2）被分配到两个信号电平。 两个相邻的线对彼此它们连接平面相交相关联。

公开(公告)号：WO1988008180A1

公开(公告)日：1988-10-20

申请号：PCT/FR1988000186

申请日：1988-04-15

Applicant: BLEYS, Dominique ,  GARIBALDI, Alexandre ,  PETERS, Jean-Marie

IPC: G08B13/24

CPC classification number: G08B13/242 ,  G08B13/2437 ,  G08B13/2442 ,  H05K1/0393 ,  H05K1/095 ,  H05K1/162 ,  H05K1/165 ,  H05K2201/0108 ,  H05K2201/09672

Abstract: Electronic protection circuit with passive elements forming a resonant circuit at a preset frequency. According to the invention, the circuit is formed by printing with the use of a conducting ink on a transparent thin support, so as to be invisible. Applications: improvement of the security against theft of protected objects.

公开(公告)号：WO1988002978A1

公开(公告)日：1988-04-21

申请号：PCT/JP1987000801

申请日：1987-10-19

Applicant: FANUC LTD ,  FUJIOKA, Yoshiki ,  SHINOHARA, Tatsuo

Inventor： FANUC LTD

IPC: H05K03/46

CPC classification number: H05K1/0265 ,  H01R13/5205 ,  H05K1/116 ,  H05K3/429 ,  H05K2201/09672 ,  H05K2201/0979

Abstract: In a multi-layer printed circuit board, a predetermined circuit pattern is formed as a conductive layer (b1) using a copper foil having a standard thickness, the above conductive layer is laminated (11) on the surface of an insulating layer (C1, the conductive layers having the same circuit pattern and the insulating layers are provided alternatingly in a plurality of stages (11, 12, 13), and the conductive layers are connected together in parallel via a through-hole (T), permitting a large-current control element to be connected thereto.

公开(公告)号：NO20014371A

公开(公告)日：2001-09-07

申请号：NO20014371

申请日：2001-09-07

Applicant: ATMEL CORP

Inventor： ZAVREL JR ROBERT J ,  BAUMANN DAN C

IPC: H01L23/12 ,  H01L23/538 ,  H01L23/66 ,  H01L25/00 ,  H01L25/16 ,  H01L27/06 ,  H01L27/08 ,  H05K1/16 ,  H05K3/46 ,  H01L29/00 ,  H01L23/48 ,  H01L23/52

CPC classification number: H01L23/5383 ,  H01L23/5386 ,  H01L23/66 ,  H01L25/16 ,  H01L27/0641 ,  H01L27/08 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/3011 ,  H05K1/162 ,  H05K1/165 ,  H05K1/167 ,  H05K3/4611 ,  H05K3/4644 ,  H05K2201/09263 ,  H05K2201/09672 ,  H05K2201/097 ,  H05K2201/10674

公开(公告)号：NO820913A

公开(公告)日：1982-09-21

申请号：NO820913

申请日：1982-03-19

Applicant: JUNKOSHA CO LTD

Inventor： HANNO HIROSUKE SUZUKI

IPC: H01B7/08 ,  H01P3/08 ,  H05K1/00 ,  H05K1/02 ,  H01B

CPC classification number: H01P3/085 ,  H01B7/0838 ,  H05K1/0219 ,  H05K1/0393 ,  H05K2201/0116 ,  H05K2201/015 ,  H05K2201/09236 ,  H05K2201/09672 ,  H05K2201/09736

公开(公告)号：WO2019122592A1

公开(公告)日：2019-06-27

申请号：PCT/FR2018/053188

申请日：2018-12-11

Applicant: CONTINENTAL AUTOMOTIVE FRANCE ,  CONTINENTAL AUTOMOTIVE GMBH

Inventor： PERON, Christopher ,  PASQUALETTO, Angelo ,  SANCHEZ, Sébastien

IPC: H05K1/02 ,  G01R1/20 ,  H05K1/16 ,  G01R15/14

CPC classification number: H05K1/0268 ,  G01R1/203 ,  H05K1/0228 ,  H05K1/0265 ,  H05K1/165 ,  H05K1/167 ,  H05K2201/0792 ,  H05K2201/09263 ,  H05K2201/09672 ,  H05K2201/0979

Abstract: La présente invention a pour objet un dispositif de mesure de l'intensité d'un courant adapté pour mesurer l'intensité d'un courant traversant une capacité d'alimentation d'une unité de contrôle électronique d'un véhicule automobile. Le dispositif comprend au moins un circuit imprimé (10), ledit circuit imprimé (10) comprenant au moins une couche conductrice (11) et au moins un premier ensemble de pistes (13) imprimées sur ladite au moins une couche conductrice (11), ledit premier ensemble de pistes (13) comprenant au moins une première partie (13A) présentant une première inductance et au moins une deuxième partie (13B) présentant une deuxième inductance, la première partie (13A) et la deuxième partie (13B) étant agencées de sorte que l'inductance totale du dispositif soit inférieure à chacune de la première inductance et de la deuxième inductance.

公开(公告)号：WO2017212451A1

公开(公告)日：2017-12-14

申请号：PCT/IB2017/053423

申请日：2017-06-09

Applicant: TE CONNECTIVITY CORPORATION

Inventor： SMITH, JR., Graham Harry ,  WALTON, Scott Eric ,  CINA, Michael Frank

IPC: H05K1/11 ,  H01R12/72 ,  H01P5/02 ,  H05K1/02

CPC classification number: H01R12/721 ,  H01P5/028 ,  H01R13/112 ,  H05K1/025 ,  H05K1/0251 ,  H05K1/115 ,  H05K1/117 ,  H05K2201/0776 ,  H05K2201/09381 ,  H05K2201/09481 ,  H05K2201/09618 ,  H05K2201/09672 ,  H05K2201/09727 ,  H05K2201/0979

Abstract: An electrical contact pad (300) for electrically contacting a connector includes first (302), second (305) and third regions (310). The first region (302) is connected to a trace (325). The second region (305) is adjacent to the first region (302) and has a width (W2) less than the first region (W1). The third region (310) is adjacent to the second region (305) and has a width (W3) that is greater than the second region (W2). The third region (310) is sized to make contact with a connector. Having the width of the second region (W2) be smaller than the width of the first (W1) and third regions (W3) increases an impedance of the electrical contact pad (300).

Abstract translation: 用于电连接连接器的电接触垫（300）包括第一（302），第二（305）和第三区域（310）。 第一区域（302）连接到迹线（325）。 第二区域（305）与第一区域（302）相邻并且具有小于第一区域（W1）的宽度（W2）。 第三区域（310）与第二区域（305）相邻并且具有比第二区域（W2）大的宽度（W3）。 第三区域（310）的尺寸被确定为与连接器接触。 使第二区域（W2）的宽度小于第一区域（W1）和第三区域（W3）的宽度增加了电接触垫（300）的阻抗。