中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

1379 records (took 0.033 seconds)

    METHOD OF FORMING FIBROUS LAMINATE CHIP CARRIER STRUCTURES
    261.
    发明申请
    METHOD OF FORMING FIBROUS LAMINATE CHIP CARRIER STRUCTURES 审中-公开
    形成薄片层状载体结构的方法

    公开(公告)号：US20120012553A1

    公开(公告)日：2012-01-19

    申请号：US12837584

    申请日：2010-07-16

    Applicant: Robert M. Japp ,  Kostas I. Papathomas ,  Cheryl Palomaki

    Inventor： Robert M. Japp ,  Kostas I. Papathomas ,  Cheryl Palomaki

    IPC: B32B38/10 ,  C23F1/02

    CPC classification number: H05K1/0366 ,  B32B37/02 ,  B32B2309/105 ,  B32B2457/08 ,  H05K3/42 ,  H05K2201/0293 ,  H05K2201/0358 ,  H05K2203/063 ,  Y10T156/1062

    Abstract: A method for making a leadless chip carrier (LCC) for use in electronic packages having a core layer stripped of copper cladding, containing drilled clearance holes within, a layer of resin coated copper (RCC) placed on the upper surface of the core layer and a second layer of RCC placed on the lower surface of the core layer. The layers are laminated together with the RCC filling the clearance holes during lamination. A pattern is etched on the RCC and vias are drilled through the filled clearance holes and pre-plated with seed copper layers. The seed copper layers in the vias are then covered by a layer of copper plating to meet the requirements of the core buildup layer, and resin inhibiting conductive anodic filament (CAF) growth within the structure.

    Abstract translation: 一种制造用于电子封装的无引线芯片载体（LCC）的方法，所述无引线芯片载体（LCC）具有剥离铜包层的芯层，其中包含钻孔的间隙孔，放置在芯层的上表面上的树脂涂覆铜层（RCC），以及 第二层RCC放置在芯层的下表面上。 层压在一起，RCC在层压期间填充间隙孔。 在RCC上蚀刻图案，并且通过填充的间隙孔钻出通孔并且预镀有种子铜层。 然后通孔中的种子铜层被镀铜层覆盖以满足堆芯层的要求，并且在结构内树脂抑制导电阳极丝（CAF）生长。

    Laminate of liquid crystalline polyester with copper foil
    262.
    发明授权
    Laminate of liquid crystalline polyester with copper foil 失效
    具有铜箔的液晶聚酯层压板

    公开(公告)号：US07883780B2

    公开(公告)日：2011-02-08

    申请号：US11493603

    申请日：2006-07-27

    Applicant: Satoshi Okamoto ,  Toyonari Ito

    Inventor： Satoshi Okamoto ,  Toyonari Ito

    IPC: B32B15/09 ,  B32B15/20 ,  B05D3/02

    CPC classification number: B32B15/08 ,  B32B15/20 ,  B32B27/36 ,  B32B38/0036 ,  B32B2305/55 ,  B32B2307/54 ,  B32B2309/02 ,  H05K1/0326 ,  H05K1/0393 ,  H05K2201/0141 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2203/0759 ,  Y10T428/31678 ,  Y10T428/31681 ,  Y10T428/31786

    Abstract: The present invention provides a laminate comprising a resin layer and a copper foil. The resin layer is made from a liquid crystalline polyester having at least one structural unit selected from a structural unit derived from aromatic diamine and a structural unit derived from aromatic amine with a phenolic hydroxyl group in an amount of 10 to 35% by mole on the basis of the total structural units in the polyester. The copper foil has a tensile modulus of 60 GPa or smaller and a tensile strength at break of 150 MPa or smaller measured after heat treatment at a temperature of 300° C. The copper-foil laminate has good flexibility and high durability with little anisotropy is provided.

    Abstract translation: 本发明提供一种包含树脂层和铜箔的层压体。 树脂层由液晶聚酯制成，该液晶聚酯具有至少一种选自芳族二胺衍生的结构单元的结构单元和衍生自酚羟基的芳族胺的结构单元，其量为10〜35摩尔％ 聚酯中总结构单位的基础。 铜箔的拉伸模量为60GPa以下，热处理后在300℃下测定的断裂拉伸强度为150MPa以下。铜箔层叠体具有良好的柔软性，耐久性高，几何异向性小 提供。

    COMPOSITE FOR MULTILAYER CIRCUIT BOARD
    264.
    发明申请
    COMPOSITE FOR MULTILAYER CIRCUIT BOARD 审中-公开
    复合材料多层电路板

    公开(公告)号：US20100252310A1

    公开(公告)日：2010-10-07

    申请号：US12670956

    申请日：2008-07-25

    Applicant: Kiyoshige Kojima ,  Junji Kodemura

    Inventor： Kiyoshige Kojima ,  Junji Kodemura

    IPC: H05K1/00 ,  B32B15/08 ,  B32B37/06 ,  B05D3/02

    CPC classification number: H05K3/4655 ,  H05K3/386 ,  H05K3/4652 ,  H05K2201/0195 ,  H05K2201/0358 ,  H05K2203/1105 ,  H05K2203/1476 ,  Y10T428/2848

    Abstract: A crosslinkable and polymerizable composition containing a monomer and a cross-linking agent is applied onto a metal foil to form a coated film of the composition, and heat is applied to the coated film to firstly bulk polymerize the entire coated film of the crosslinkable and polymerizable composition. Then, by applying heat to the coated film from the metal foil side, cooling a surface far from the metal foil as needed, and subjecting a limited region adjacent to the metal foil in the thickness direction of the coated film to a cross-linking reaction, a composite for multilayer circuit board is obtained, in which the metal foil layer, a hard resin layer containing a hard resin obtained by bulk polymerization reaction and cross-linking reaction, and an adhesive resin layer containing an adhesive resin obtained by bulk polymerization reaction are laminated in this order.

    Abstract translation: 将含有单体和交联剂的交联性和可聚合组合物施加到金属箔上以形成组合物的涂膜，并将热量施加到涂膜上，首先将可交联和可聚合的整个涂膜 组成。 然后，通过从金属箔侧向涂膜施加热量，根据需要冷却远离金属箔的表面，并且将与金属箔相邻的有限区域沿涂布膜的厚度方向进行交联反应 得到金属箔层，含有通过本体聚合反应和交联反应得到的硬质树脂的硬质树脂层和通过本体聚合反应得到的粘合性树脂的粘合性树脂层的多层电路板用复合体 按此顺序层压。

    Multilayer wiring board and manufacturing method thereof
    265.
    发明申请
    Multilayer wiring board and manufacturing method thereof 失效
    多层布线板及其制造方法

    公开(公告)号：US20100243601A1

    公开(公告)日：2010-09-30

    申请号：US12659893

    申请日：2010-03-24

    Applicant: Hiroyuki Uematsu ,  Kenichi Kawabata ,  Kenji Nagase

    Inventor： Hiroyuki Uematsu ,  Kenichi Kawabata ,  Kenji Nagase

    IPC: C23F1/00 ,  H01B13/00

    CPC classification number: H05K3/427 ,  H05K3/002 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/0041 ,  H05K3/0044 ,  H05K3/061 ,  H05K3/064 ,  H05K3/382 ,  H05K3/389 ,  H05K3/421 ,  H05K3/4652 ,  H05K2201/0347 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2201/0394 ,  H05K2203/025 ,  H05K2203/0353 ,  H05K2203/054 ,  H05K2203/0585 ,  H05K2203/0733

    Abstract: Provided is a method for manufacturing a multilayer wiring board, whereby even if the multilayer wiring board suffers warping or irregularities, thin-film patterns with great uniformity that are to be used as a mask for forming a wiring layer can be obtained in a simple way. A primer-coated metal foil 20 composed of a primer resin layer 21 and a metal layer 22 is placed on a surface of a double-face CCL 10, which is prepared by applying metal layers 12 and 13 onto the surfaces of a support base 11, and the primer-coated metal foil 20 and the double-face CCL 10 are bonded and the primer resin layer 21 is cured. A via Vb is thereafter formed from the metal layer 22 side, and a metal-plate layer 30 is formed on the resulting metal layer 22. After that, the etched down metal-plate layer 30 and the metal layer 22 are patterned, and using the patterned layers as a mask, the primer resin layer 21 is patterned. Using the patterned primer resin layer 21 as a mask, the metal layer 12 of the double-face CCL 10 and the metal-plate layer 30 are patterned to form a wiring pattern.

    Abstract translation: 提供一种多层布线板的制造方法，即使多层布线板发生翘曲或不均匀，也可以以简单的方式获得用作形成布线层的掩模的具有均匀性的薄膜图案 。 将由底漆树脂层21和金属层22构成的底漆涂布金属箔20放置在双面CCL 10的表面上，该双面CCL 10通过将金属层12和13施加到支撑基底11的表面上而制备 并且底漆涂覆的金属箔20和双面CCL 10被粘合，底漆树脂层21固化。 之后，从金属层22侧形成通孔Vb，在所得到的金属层22上形成金属板层30.之后，对蚀刻后的金属板层30和金属层22进行图案化，使用 作为掩模的图案化层，对底漆树脂层21进行图案化。 使用图案化底漆树脂层21作为掩模，将双面CCL 10的金属层12和金属板层30图案化以形成布线图案。

    PROCESS FOR PRODUCING CIRCUIT BOARD
    266.
    发明申请
    PROCESS FOR PRODUCING CIRCUIT BOARD 有权
    生产电路板的工艺

    公开(公告)号：US20100044078A1

    公开(公告)日：2010-02-25

    申请号：US12551802

    申请日：2009-09-01

    Applicant: Hirohisa Narahashi ,  Shigeo Nakamura ,  Tadahiko Yokota

    Inventor： Hirohisa Narahashi ,  Shigeo Nakamura ,  Tadahiko Yokota

    IPC: H05K1/00 ,  B32B37/00 ,  B32B33/00

    CPC classification number: H05K3/025 ,  B32B37/025 ,  B32B38/10 ,  B32B2038/0076 ,  B32B2311/00 ,  B32B2457/08 ,  H05K3/386 ,  H05K2201/0358 ,  H05K2203/0264 ,  H05K2203/0769 ,  H05K2203/0786 ,  Y10T428/14 ,  Y10T428/1438 ,  Y10T428/1443 ,  Y10T428/1476 ,  Y10T428/26 ,  Y10T428/263 ,  Y10T428/264 ,  Y10T428/265 ,  Y10T428/266 ,  Y10T428/269

    Abstract: Producing a circuit board, by laminating, on a substrate, an adhesive film with a metal film, which comprises a water-soluble polymer release layer, a metal film layer and a curable resin composition layer, which are formed in this order on a support layer, and has a release property enabling detachment of said water-soluble polymer release layer from the support layer after curing of the curable resin composition layer, such that the curable resin composition layer contacts the substrate; curing the curable resin composition layer; detaching the support layer, and removing the water-soluble polymer release layer present on the metal film layer by dissolving the release layer in an aqueous solution, efficiently forms an insulating layer and a metal film layer superior in adhesiveness to the insulating layer and in uniformity. By this method, a metal film layer having high adhesiveness and high property uniformity can be formed on the surface without the need for roughening the surface of an insulating layer with an oxidant such as alkaline potassium permanganate solution and the like. Thus, etching for circuit formation can be performed under milder conditions, which in turn provides a superior effect on micro wiring on circuit boards such as multi-layer printed wiring boards, flexible printed wiring boards, and the like.

    Abstract translation: 通过在基板上层叠具有金属膜的粘合膜来制造电路板，所述金属膜包括依次形成在支撑体上的水溶性聚合物剥离层，金属膜层和固化性树脂组合物层 并且具有能够使固化性树脂组合物层固化后使所述水溶性高分子脱离层从支撑层脱离的脱模性，使得固化性树脂组合物层与基材接触; 固化树脂组合物层; 通过将剥离层溶解在水溶液中，分离保护层，除去存在于金属膜层上的水溶性聚合物释放层，有效地形成绝缘层和与绝缘层的粘合性优异的金属膜层，均匀性 。 通过这种方法，可以在表面上形成具有高粘合性和高性能均匀性的金属膜层，而不需要用氧化剂如碱式高锰酸钾溶液等来粗糙化绝缘层的表面。 因此，可以在更温和的条件下进行电路形成蚀刻，这又对诸如多层印刷线路板，柔性印刷线路板等的电路板上的微接线提供了优异的效果。

    Laminated product and production method therof, and circuit substrate using the same
    267.
    发明申请
    Laminated product and production method therof, and circuit substrate using the same 审中-公开
    层压产品和生产方法，以及电路基板使用相同

    公开(公告)号：US20100028623A1

    公开(公告)日：2010-02-04

    申请号：US12458821

    申请日：2009-07-23

    Applicant: Toyonari Ito ,  Satoshi Okamato

    Inventor： Toyonari Ito ,  Satoshi Okamato

    IPC: B32B15/08 ,  B32B7/02 ,  B32B3/10 ,  B32B37/12

    CPC classification number: H05K3/022 ,  H05K1/056 ,  H05K2201/0141 ,  H05K2201/0358 ,  H05K2203/0759 ,  Y10T428/24802 ,  Y10T428/24942 ,  Y10T428/24967

    Abstract: The present invention provides a method for producing a laminated product, the method comprising the steps of: applying a solution containing a liquid-crystalline polymer and a solvent to a first metal layer, removing the solvent from the solution to form a liquid- crystalline polymer layer on the first metal layer, placing a second metal layer such that the liquid-crystalline polymer layer is placed between the first and second metal layers, and subjecting the liquid-crystalline polymer layer to compression from the direction of the first and second metal layers, wherein the thickness of the second metal layer is larger than that of the first metal layer. In the production method, the first metal layer preferably comprises a different metal from the second metal layer.

    Abstract translation: 本发明提供层压产品的制造方法，该方法包括以下步骤：向第一金属层涂布含有液晶聚合物和溶剂的溶液，从溶液中除去溶剂以形成液晶聚合物 在第一金属层上放置第二金属层，使得液晶聚合物层置于第一和第二金属层之间，并使液晶聚合物层从第一和第二金属层的方向压缩 ，其中所述第二金属层的厚度大于所述第一金属层的厚度。 在制造方法中，第一金属层优选包含与第二金属层不同的金属。

    Method of manufacturing laminated substrate
    269.
    发明授权
    Method of manufacturing laminated substrate 失效
    叠层基板的制造方法

    公开(公告)号：US07563342B2

    公开(公告)日：2009-07-21

    申请号：US11407057

    申请日：2006-04-20

    Applicant: Masashi Gotoh ,  Hajime Kuwajima ,  Kenichi Kawabata

    Inventor： Masashi Gotoh ,  Hajime Kuwajima ,  Kenichi Kawabata

    IPC: B32B37/00

    CPC classification number: H05K3/4611 ,  B32B37/0007 ,  B32B37/0046 ,  B32B2457/08 ,  H05K3/4652 ,  H05K2201/0358 ,  H05K2203/068

    Abstract: In a press process, a buffer member is placed on an RCC with a stainless steel plate between in such a way that the long sides and the short sides of the buffer member are aligned with the long sides and the short sides of the RCC respectively. The length of the long sides and the length of the short sides of the buffer member are designed to be smaller than the lengths of the long sides and the length of the short sides of the RCC respectively. With this feature, it is possible to reduce convexity on the RCC that is created in the peripheral region upon pressing the RCC to a core member.

    Abstract translation: 在压制过程中，将缓冲构件放置在具有不锈钢板的RCC上，使得缓冲构件的长边和短边分别与RCC的长边和短边对齐。 长边的长度和缓冲构件的短边的长度分别设计成小于长边的长度和短边的长度。 利用该特征，可以在将RCC按压到芯构件时减小在外围区域中产生的RCC上的凸度。

Patent Agency Ranking