公开(公告)号：US20050237364A1

公开(公告)日：2005-10-27

申请号：US11113459

申请日：2005-04-25

Applicant: Hirosumi Ito

Inventor： Hirosumi Ito

IPC: B41J2/045 ,  B41J2/05 ,  B41J2/055 ,  B41J2/14 ,  B41J29/00 ,  H05K3/00 ,  H05K3/32 ,  H05K3/36 ,  H05K3/40

CPC classification number: H05K3/4007 ,  B41J2/14209 ,  B41J2002/14217 ,  B41J2002/14225 ,  B41J2002/14306 ,  B41J2002/14459 ,  B41J2002/14491 ,  H05K3/0058 ,  H05K3/321 ,  H05K3/361 ,  H05K3/365 ,  H05K2201/0133 ,  H05K2201/0367 ,  H05K2201/091 ,  H05K2201/10977 ,  H05K2203/0195

Abstract: There is disclosed a printed wiring board comprising: an electrically insulating flexible layer which has on one of its opposite sides a protrusion which forms a corresponding recess on the other side of the flexible layer; an electrically conducting layer formed on the protrusion; and a wire formed on the flexible layer, connected to the conducting layer, and extending in a direction. The conducting layer has a shape long in the direction of extension of the wire.

Abstract translation: 公开了一种印刷电路板，包括：电绝缘柔性层，其在其相对侧的一侧上具有在柔性层的另一侧上形成相应凹部的突起; 形成在所述突起上的导电层; 以及形成在柔性层上的导线，连接到导电层并沿一个方向延伸。 导电层具有沿导线延伸方向长的形状。

公开(公告)号：US06929849B2

公开(公告)日：2005-08-16

申请号：US10442396

申请日：2003-05-21

Applicant: David C. Koskenmaki ,  Michael N. Miller ,  Naiyong Jing

Inventor： David C. Koskenmaki ,  Michael N. Miller ,  Naiyong Jing

IPC: B32B7/02 ,  G02F1/1343 ,  G02F1/155 ,  H05B3/28 ,  H05B3/86 ,  H05K3/10 ,  H05K3/12 ,  H05K9/00 ,  B32B3/00 ,  H05K1/00

CPC classification number: H05B3/86 ,  G02F1/13439 ,  G02F1/155 ,  H05B3/286 ,  H05B2203/017 ,  H05K3/102 ,  H05K3/107 ,  H05K3/1258 ,  H05K2201/0133 ,  H05K2201/09036 ,  H05K2201/091 ,  H05K2201/09827 ,  H05K2203/0278 ,  H05K2203/1105 ,  Y10S428/901 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24917

Abstract: A method for making a fine electrically conductive grid embedded in a polymer substrate. The method includes the steps of providing a polymer substrate, forming a pattern of grooves in the substrate, filling the grooves with electrically conductive powder, and then applying heat and/or pressure to the substrate. The application of heat and/or pressure to the substrate causes the grooves to collapse inward against the conductive powder. Collapsing the grooves compacts the conductive powder within the groove, thereby establishing a continuously conductive grid line or circuit. The narrow grid lines that result allow more light to transmit through the substrate. The method allows grid lines to be made with higher aspect ratios (ratio of line depth to line width) than is possible by previous methods.

Abstract translation: 一种制造嵌入聚合物基板中的精细导电栅格的方法。 该方法包括以下步骤：提供聚合物基材，在基材中形成凹槽图案，用导电粉末填充凹槽，然后向基材施加热和/或压力。 向衬底施加热和/或压力导致沟槽相对于导电粉末向内折叠。 折叠凹槽压缩凹槽内的导电粉末，从而建立连续导电的栅格线或电路。 导致的窄栅格线允许更多的光透过基板。 该方法允许以比以前的方法可能的更高的纵横比（线深度与线宽的比率）制成网格线。

公开(公告)号：US06821130B2

公开(公告)日：2004-11-23

申请号：US10222160

申请日：2002-08-16

Applicant: Brooks H Danley

Inventor： Brooks H Danley

IPC: H01R1200

CPC classification number: H01F5/04 ,  H01R12/59 ,  H05K1/189 ,  H05K3/306 ,  H05K2201/091 ,  H05K2201/10568 ,  H05K2201/1059 ,  H05K2201/10598 ,  H05K2203/167

Abstract: Device and method including a generally flat and flexible circuit for electrically inter-connecting components therein are provided. The device includes a post including a recessed section configured to receive the flexible circuit through an opening in said circuit. The structures defining the opening in the flexible circuit may be configured to provide a snap-fit between the circuit and the recessed section of the post, and thus avoid undesirable movement of the flex circuit in the presence of vibration.

公开(公告)号：US06737741B2

公开(公告)日：2004-05-18

申请号：US10224504

申请日：2002-08-21

Applicant: Satoshi Imasu ,  Ikuo Yoshida ,  Tetsuya Hayashida ,  Akira Yamagiwa ,  Shinobu Takeura

Inventor： Satoshi Imasu ,  Ikuo Yoshida ,  Tetsuya Hayashida ,  Akira Yamagiwa ,  Shinobu Takeura

IPC: H01L2314

CPC classification number: H01L23/13 ,  H01L21/563 ,  H01L23/24 ,  H01L23/49811 ,  H01L23/5383 ,  H01L24/29 ,  H01L24/32 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/05567 ,  H01L2224/05571 ,  H01L2224/05572 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45 ,  H01L2224/45144 ,  H01L2224/48 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48599 ,  H01L2224/49 ,  H01L2224/49109 ,  H01L2224/73103 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81191 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/351 ,  H05K1/0271 ,  H05K1/111 ,  H05K1/112 ,  H05K3/4602 ,  H05K2201/0133 ,  H05K2201/091 ,  H05K2201/09472 ,  H05K2201/0949 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/10674 ,  H05K2203/1581 ,  Y02P70/611 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/13111 ,  H01L2224/05552

Abstract: An electronic device comprising a semiconductor chip which is fixed to the mounting face of a wiring board through an adhesive and in which external terminals are electrically connected with electrode pads of the wiring board through bump electrodes. Recesses are formed in the electrode pads, and in the recesses the electrode pads and the bump electrodes are connected. The electrode pads are formed over the surface of a soft layer, and the recesses are formed by elastic deformation of the electrode pads and the soft layer.

Abstract translation: 一种电子设备，包括通过粘合剂固定到布线板的安装面的半导体芯片，其中外部端子通过凸块电极与布线板的电极焊盘电连接。 在电极焊盘上形成凹部，在凹部中连接有电极焊盘和凸块电极。 电极焊盘形成在软层的表面上，并且通过电极焊盘和软层的弹性变形形成凹部。

公开(公告)号：US06723584B2

公开(公告)日：2004-04-20

申请号：US10255297

申请日：2002-09-26

Applicant: Zlata Kovac ,  Craig Mitchell ,  Thomas Distefano ,  John Smith

Inventor： Zlata Kovac ,  Craig Mitchell ,  Thomas Distefano ,  John Smith

IPC: H01L2148

CPC classification number: H01L24/81 ,  H01L21/56 ,  H01L21/563 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/4985 ,  H01L24/72 ,  H01L24/75 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75301 ,  H01L2224/81801 ,  H01L2224/83136 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K1/118 ,  H05K3/361 ,  H05K3/4084 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2203/063 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49174 ,  H01L2924/00014

Abstract: A method of making a microelectronic assembly including a compliant interface includes providing a first support structure such as a flexible dielectric sheet having a first surface and a porous resilient layer on the first surface of the first support structure, stretching the first support structure and bonding the stretched first support structure to a ring structure. A platen is provided in engagement with a second surface of the first support structure. The first surface of a second support structure, such as a semiconductor wafer, is abutted against the porous layer and, after the abutting step, a first curable liquid is disposed between the first and second support structures and within the porous layer. The first curable liquid may be at least partially cured.

Abstract translation: 制造包括柔性界面的微电子组件的方法包括提供第一支撑结构，例如在第一支撑结构的第一表面上具有第一表面和多孔弹性层的柔性电介质片，拉伸第一支撑结构并将 将第一支撑结构拉伸成环结构。 提供与第一支撑结构的第二表面接合的压板。 第二支撑结构（例如半导体晶片）的第一表面抵靠多孔层，并且在邻接步骤之后，第一可固化液体设置在第一和第二支撑结构之间以及多孔层内。 第一可固化液体可以至少部分固化。

公开(公告)号：US06635553B1

公开(公告)日：2003-10-21

申请号：US09721048

申请日：2000-11-22

Applicant: Thomas H. DiStefano ,  John W. Smith

Inventor： Thomas H. DiStefano ,  John W. Smith

IPC: H01L2130

CPC classification number: H01L23/4985 ,  H01L21/4839 ,  H01L23/22 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/642 ,  H01L24/72 ,  H01L2224/16 ,  H01L2224/45124 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01066 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/3025 ,  H01L2924/351 ,  H05K1/118 ,  H05K3/361 ,  H05K3/4084 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2203/063 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49158 ,  H01L2924/00 ,  H01L2224/48

Abstract: A microelectronic connection component includes a support such as a dielectric sheet having elongated leads extending along a surface. The leads have terminal ends permanently connected to the support and tip ends releasably connected to the support. The support is juxtaposed with a further element such as a semiconductor chip or wafer, and tip ends of the leads are bonded to contacts on the wafer using a bonding tool advanced through holes in the support. After bonding, the support and the further element are moved away from one another so as to deform the leads.

Abstract translation: 微电子连接部件包括诸如具有沿着表面延伸的细长引线的电介质片的支撑件。 引线具有永久地连接到支撑件的端部端部和可释放地连接到支撑件的尖端端部。 支撑件与诸如半导体芯片或晶片的另外的元件并置，并且引线的尖端使用通过支撑件中的孔前进的焊接工具结合到晶片上的触点。 在粘合之后，支撑件和另外的元件彼此远离，以使引线变形。

公开(公告)号：US20020195718A1

公开(公告)日：2002-12-26

申请号：US10224504

申请日：2002-08-21

Applicant: HITACHI, LTD.

Inventor： Satoshi Imasu ,  Ikuo Yoshida ,  Tetsuya Hayashida ,  Akira Yamagiwa ,  Shinobu Takeura

IPC: H01L023/48 ,  H01L023/14

CPC classification number: H01L23/13 ,  H01L21/563 ,  H01L23/24 ,  H01L23/49811 ,  H01L23/5383 ,  H01L24/29 ,  H01L24/32 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/05567 ,  H01L2224/05571 ,  H01L2224/05572 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45 ,  H01L2224/45144 ,  H01L2224/48 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48599 ,  H01L2224/49 ,  H01L2224/49109 ,  H01L2224/73103 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81191 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/351 ,  H05K1/0271 ,  H05K1/111 ,  H05K1/112 ,  H05K3/4602 ,  H05K2201/0133 ,  H05K2201/091 ,  H05K2201/09472 ,  H05K2201/0949 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/10674 ,  H05K2203/1581 ,  Y02P70/611 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/13111 ,  H01L2224/05552

Abstract: An electronic device comprising a semiconductor chip which is fixed to the mounting face of a wiring board through an adhesive and in which external terminals are electrically connected with electrode pads of the wiring board through bump electrodes. Recesses are formed in the electrode pads, and in the recesses the electrode pads and the bump electrodes are connected. The electrode pads are formed over the surface of a soft layer, and the recesses are formed by elastic deformation of the electrode pads and the soft layer.

公开(公告)号：US20020192865A1

公开(公告)日：2002-12-19

申请号：US10224339

申请日：2002-08-21

Applicant: HITACHI, LTD. and HITACHI HOKKAI SEMICONDUCTOR, LTD.

Inventor： Satoshi Imasu ,  Ikuo Yoshida ,  Tetsuya Hayashida ,  Akira Yamagiwa ,  Shinobu Takeura

IPC: H01L023/14

CPC classification number: H05K1/111 ,  H01L21/563 ,  H01L23/13 ,  H01L23/24 ,  H01L23/49811 ,  H01L23/5383 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/105 ,  H01L2224/05567 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/1134 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2224/73103 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81191 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2225/1023 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/351 ,  H05K1/0271 ,  H05K1/114 ,  H05K3/3436 ,  H05K3/4007 ,  H05K3/4602 ,  H05K2201/0133 ,  H05K2201/091 ,  H05K2201/09472 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/10674 ,  H05K2203/1581 ,  Y02P70/611 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00012 ,  H01L2924/01082 ,  H01L2924/00

Abstract: An electronic device comprising a semiconductor chip which is fixed to the mounting face of a wiring board through an adhesive and in which external terminals are electrically connected with electrode pads of the wiring board through bump electrodes. Recesses are formed in the electrode pads, and in the recesses the electrode pads and the bump electrodes are connected. The electrode pads are formed over the surface of a soft layer, and the recesses are formed by elastic deformation of the electrode pads and the soft layer.

Abstract translation: 一种电子设备，包括通过粘合剂固定到布线板的安装面的半导体芯片，其中外部端子通过凸块电极与布线板的电极焊盘电连接。 在电极焊盘上形成凹部，在凹部中连接有电极焊盘和凸块电极。 电极焊盘形成在软层的表面上，并且通过电极焊盘和软层的弹性变形形成凹部。

公开(公告)号：US20020042994A1

公开(公告)日：2002-04-18

申请号：US09977956

申请日：2001-10-17

Applicant: Brother Kogyo Kabushiki Kaisha

Inventor： Atsushi Ito ,  Masaaki Deguchi ,  Hisaki Sakurai

IPC: H05K003/36 ,  B23Q003/00

CPC classification number: B41J2/1632 ,  B41J2/1609 ,  B41J2/1623 ,  B41J2/1626 ,  B41J2002/14217 ,  B41J2002/14225 ,  B41J2002/14362 ,  H05K3/4638 ,  H05K2201/091 ,  H05K2203/167 ,  Y10T29/49121 ,  Y10T29/49126 ,  Y10T29/49401 ,  Y10T29/49895 ,  Y10T156/1026 ,  Y10T156/1056 ,  Y10T156/1064 ,  Y10T156/108 ,  Y10T156/1304

Abstract: Plates having a predetermined pattern are provided in each frame, side by side, at certain intervals along the longitudinal direction of the frame. A plurality of positioning holes, into which pins are inserted, are formed in each frame. A retainer portion is provided so as to extend from the inner periphery of each positioning hole and is plastically deformed when a pin is inserted thereinto. By inserting a pin into each positioning hole while a plurality of frames are stacked, the outer periphery of the pin contacts the retainer portion of each positioning hole. The retainer portion is deformed to correct misalignment among a plurality of plates.

Abstract translation: 沿着框架的纵向以一定间隔并排设置在每个框架中，具有预定图案的板。 在每个框架中形成有多个插入销的定位孔。 保持部设置成从每个定位孔的内周延伸，并且当销插入其中时塑性变形。 通过在堆叠多个框架的同时将销插入每个定位孔中，销的外周与每个定位孔的保持器部分相接触。 保持器部分变形以校正多个板之间的未对准。

公开(公告)号：US20010012736A1

公开(公告)日：2001-08-09

申请号：US09818521

申请日：2001-03-28

Applicant: THE FURUKAWA ELECTRIC CO., LTD.,

Inventor： Kazuo Miyajima ,  Shin Hasegawa ,  Yoshiaki Sawaki

IPC: H05K001/00 ,  H01R012/00 ,  H01R009/22

CPC classification number: H02G3/16 ,  H02G3/081 ,  H02G5/005 ,  H05K3/202 ,  H05K3/326 ,  H05K2201/091 ,  H05K2201/10946 ,  H05K2201/2072 ,  Y10S439/949 ,  Y10T29/49117 ,  Y10T29/49121 ,  Y10T29/49128 ,  Y10T29/49151 ,  Y10T29/49153 ,  Y10T29/49833 ,  Y10T29/49845 ,  Y10T29/49908

Abstract: A bus-bar wiring board of the present invention comprises a bus-bar pattern for electric wiring formed to a predetermined shape and a bus-bar piece formed as a separate piece from the bus-bar pattern and electrically connected and secured to the bus-bar pattern. Further, a method of producing a bus-bar wiring board of the present invention comprises a bus-bar pattern punching step for punching out a bus-bar pattern for electric wiring laid out to a predetermined shape from a conductive metal sheet, a bus-bar piece punching step for punching out a bus-bar piece laid out to a predetermined shape at the remaining space of the conductive metal sheet, and a connecting step for electrically connecting and securing the bus-bar pattern punched out in the bus-bar pattern punching step and the bus-bar piece punched out in the bus-bar piece punching step. Due to this, it is possible to reduce scrap of a conductive metal sheet from which the bus-bar pattern is punched and reduce the production cost or product cost.

Abstract translation: 本发明的汇流条配线基板包括形成为预定形状的电线的汇流条图案和形成为与汇流条图案分开的部件的母线条，并且电连接并固定到总线 - 酒吧模式 此外，本发明的汇流条配线基板的制造方法具有：汇流条图形冲孔工序，从导电性金属板上冲出布置成规定形状的电线的母线图案， 在导电性金属板的剩余空间处冲压布置成规定形状的汇流条件的条形件冲压步骤，以及用于电连接和固定在母线图案中冲压的母线图案的连接步骤 冲压步骤和母线冲压在母线冲压步骤中。 由此，可以减少冲压母线图形的导电金属板的废料，降低生产成本或产品成本。