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    플라즈마 처리 용기 내부재
    23.
    发明公开
    플라즈마 처리 용기 내부재 有权
    具有等离子体处理容器耐腐蚀性的阻挡层涂层的内部构件

    公开(公告)号：KR1020040048343A

    公开(公告)日：2004-06-09

    申请号：KR1020030085691

    申请日：2003-11-28

    Applicant: 도쿄엘렉트론가부시키가이샤

    Inventor： 미츠하시고지 ,  나카야마히로유키 ,  나가야마노부유키 ,  모리야츠요시 ,  나가이케히로시

    IPC: H01L21/3065

    CPC classification number: H05H1/24 ,  C23C16/4404 ,  H01J37/32477 ,  Y10T428/249969 ,  Y10T428/24997 ,  Y10T428/31544 ,  Y10T428/31663 ,  Y10T428/31721

    Abstract: PURPOSE: An inner member of a plasma treatment vessel is provided to restrain the delamination of a sprayed coating layer by preventing a base member from being exposed to process gas or cleaning solutions using a barrier coating layer and resin. CONSTITUTION: An inner member of a plasma treatment vessel includes a base member(71) and a coating layer(72) formed by performing ceramic spraying on the base member. The coating layer includes a main layer(73) and a barrier coating layer(74) between the base member and the main layer. The ceramic of the coating layer contains at least one selected from a group consisting of B, Mg, Al, Si, Ca, Cr, Y, Zr, Ta, Ce, and Nd. The coating layer is partially sealed with resin.

    Abstract translation: 目的：提供等离子体处理容器的内部构件，以通过使用阻挡涂层和树脂防止基底部件暴露于处理气体或清洁溶液来抑制喷涂层的分层。 构成：等离子体处理容器的内部构件包括通过在基底构件上进行陶瓷喷涂而形成的基底构件（71）和涂层（72）。 涂层包括主层和主层之间的主层（73）和阻挡涂层（74）。 涂层的陶瓷含有选自B，Mg，Al，Si，Ca，Cr，Y，Zr，Ta，Ce和Nd中的至少一种。 涂层用树脂部分密封。

    처리 장치 부품의 조립 기구 및 그 조립 방법
    29.
    发明授权
    처리 장치 부품의 조립 기구 및 그 조립 방법 有权
    装配加工装置部分的机构和方法

    公开(公告)号：KR100638917B1

    公开(公告)日：2006-10-25

    申请号：KR1020057005918

    申请日：2001-05-16

    Applicant: 도쿄엘렉트론가부시키가이샤

    Inventor： 센자키시게루 ,  사사키도시키 ,  아오토다다시 ,  나가야마노부유키 ,  미츠하시고우지

    IPC: H01L21/3065

    CPC classification number: H01J37/32458

    Abstract: A processing device in which maintenance can be easily carried out and a burden on a worker can be reduced, and a method of maintaining the device are provided. An upper electrode unit 106 structuring a ceiling portion of a processing chamber 102 of an etching device 100 is structured from a lower assembly 128 at a processing chamber 102 side including an upper electrode 130, and an upper assembly 128 at a power supply side including an electro-body 144. A lock mechanism 156 is released, and after the upper assembly 126 is independently raised and removed by a lift mechanism 164, maintenance of the upper assembly 126 and/or the lower assembly 128 is carried out. The lock mechanism 156 is locked, and after the upper and lower assemblies 126, 128 are integrally raised and removed by the lift mechanism 164, maintenance of an interior of the processing chamber 102 is carried out.

    처리 장치 및 그 유지 보수 방법
    30.
    发明授权
    처리 장치 및 그 유지 보수 방법 有权
    处理装置和维护装置的方法，用于组装加工装置部件的机构和方法以及用于锁定锁定机构的锁定机构和方法

    公开(公告)号：KR100638916B1

    公开(公告)日：2006-10-25

    申请号：KR1020027015433

    申请日：2001-05-16

    Applicant: 도쿄엘렉트론가부시키가이샤

    Inventor： 센자키시게루 ,  사사키도시키 ,  아오토다다시 ,  나가야마노부유키 ,  미츠하시고우지

    IPC: H01L21/3065

    CPC classification number: H01J37/32458

    Abstract: A processing device in which maintenance can be easily carried out and a burden on a worker can be reduced, and a method of maintaining the device are provided. An upper electrode unit 106 structuring a ceiling portion of a processing chamber 102 of an etching device 100 is structured from a lower assembly 128 at a processing chamber 102 side including an upper electrode 130, and an upper assembly 128 at a power supply side including an electro-body 144. A lock mechanism 156 is released, and after the upper assembly 126 is independently raised and removed by a lift mechanism 164, maintenance of the upper assembly 126 and/or the lower assembly 128 is carried out. The lock mechanism 156 is locked, and after the upper and lower assemblies 126, 128 are integrally raised and removed by the lift mechanism 164, maintenance of an interior of the processing chamber 102 is carried out.

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