公开(公告)号：EP1351562A3

公开(公告)日：2005-05-11

申请号：EP03075806.4

申请日：2003-03-20

Applicant: Delphi Technologies, Inc.

Inventor： Brandenburg, Scott D. ,  Myers, Bruce A. ,  Tsai, Jeenhuei ,  Chengalva, Suresh K.

IPC: H05K9/00

CPC classification number: H05K5/065 ,  H05K1/0203 ,  H05K3/284 ,  H05K9/0045 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49171 ,  Y10T29/49172

Abstract: An overmolded electronic assembly 20 having an electromagnetic interference shield 50, in the form of a thin metal film or foil, coupled to the top of or within an overmolded body 33. The shield 50 effectively reduces the amount of electromagnetic interference ("EMI") emissions from penetrating within the assembly to the circuit board 22 without substantially increasing the cost of the unit. Thus, an electronic assembly having improved vibration, moisture, and EMI emission resistance is achieved as compared with traditional overmolded or metal assemblies. Further, because the shield 50 can be formed on the electronic assembly in one continuous processing step, a substantial savings in time and cost for the manufacturing process is also realized.

公开(公告)号：EP1508915A2

公开(公告)日：2005-02-23

申请号：EP04077238.6

申请日：2004-08-05

Applicant: Delphi Technologies, Inc.

Inventor： Brandenburg, Scott D. ,  Myers, Bruce A.

IPC: H01L23/373

CPC classification number: H01L25/165 ,  B23K1/0008 ,  B23K35/26 ,  H01L23/3735 ,  H01L23/3736 ,  H01L2224/16227 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H05K7/20436 ,  H05K7/20854

Abstract: A process and electronic assembly (10) for conducting heat from a semiconductor circuit device (12) mounted to a substrate (14). The substrate (14) is supported by a housing member (20) equipped with a heat-conductive member (26). A surface (28) of the device (12) opposite the substrate (14) is bonded to the heat-conductive member (26) with a solder joint (30) formed of indium and optionally one or more alloying constituents that increase the melting temperature of the solder joint (30) above that of indium. The housing member (20), substrate (14), and device (12) are assembled so that an indium-containing solder material is present between the heat-conductive member (26) and the surface (28) of the device (12) opposite the substrate (14). The solder material is then reflowed to form the solder joint (30). The alloying constituent(s) are preferably introduced into the solder joint (30) during reflow.

公开(公告)号：EP1622199B1

公开(公告)日：2018-09-12

申请号：EP05076556.9

申请日：2005-07-07

Applicant: Delphi Technologies, Inc.

Inventor： Myers, Bruce A. ,  Peugh, Darrel E. ,  Wilkinson, Lester ,  Gerbsch, Erich W.

IPC: H01L23/433 ,  H01L23/00 ,  H01L29/06 ,  H05K1/02 ,  H01L23/473

CPC classification number: H05K1/0272 ,  H01L23/4334 ,  H01L23/473 ,  H01L24/48 ,  H01L29/0657 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/181 ,  H05K1/0203 ,  H05K2201/064 ,  H05K2201/10689 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A power semiconductor device package utilizes integral fluid conducting micro-channels (14), one or more inlet ports (38) for supplying liquid coolant to the micro-channels (14), and one or more outlet ports (40) for exhausting coolant that has passed through the micro-channels (14). The semiconductor device (10) is mounted on a single or multi-layer circuit board (44) having electrical and fluid interconnect features that mate with the electrical terminals (12a, 12b) and inlet and outlet ports (38, 40) of the device (10) to define a self-contained and self-sealed micro-channel heat exchanger.

公开(公告)号：EP2765285A1

公开(公告)日：2014-08-13

申请号：EP14152643.4

申请日：2014-01-27

Applicant: Delphi Technologies, Inc.

Inventor： Myers, Bruce A. ,  Ihms, David W.

IPC: F01N3/02 ,  F01N5/02 ,  F01N3/04 ,  B01D53/14

CPC classification number: B01D53/92 ,  B01D53/1493 ,  B01D53/62 ,  B01D2252/2053 ,  B01D2257/504 ,  B01D2258/012 ,  B01D2258/0208 ,  F01N3/0205 ,  F01N3/04 ,  F01N5/025 ,  F01N2240/02 ,  F01N2240/26 ,  F01N2570/10 ,  Y02A50/2342 ,  Y02C10/04 ,  Y02C10/06 ,  Y02T10/16 ,  Y02T10/20

Abstract: An electricity generating heat exchanger (18) for a vehicle (12) equipped with an exhaust gas (16) carbon dioxide (CO2) separator, said heat exchanger (18) comprising:
an exhaust gas chamber (50) configured to guide engine (14) exhaust through the heat exchanger (18);
an absorber fluid chamber (52) configured to guide CO2 absorbent fluid (24) through the heat exchanger (18); and
a first thermal electric generator (TEG (54)) configured to couple thermally the exhaust gas chamber (50) to the absorber fluid chamber (52) in a manner effective to heat the CO2 absorbent fluid (24) by heat from the engine (14) exhaust to release CO2 gas from the CO2 absorbent fluid (24) and generate electricity in response to a temperature difference therebetween.

Abstract translation: 在废气配备有车辆（12）的发电用热交换器（18）（16）二氧化碳（CO 2）分离器，所述换热器（18），包括：被配置为引导发动机排放气体室（50）（14 ）通过排气热交换器（18）; （52）配置的吸收器的流体室的通过热交换器（18）以引导二氧化碳吸收液（24）; 并且被配置为耦合第一热电发电机（TEG（54））热排放气体室（50），以吸收体的流体室（52）（以有效的方式，以通过将热量从发动机加热CO2吸收流体（24） 14）排出到来自CO 2吸收液（24）释放CO 2气体，并响应于之间的温度差有发电。

公开(公告)号：EP1768179B1

公开(公告)日：2011-12-28

申请号：EP06076682.1

申请日：2006-09-08

Applicant: Delphi Technologies, Inc.

Inventor： Schubert, Peter J. ,  Myers, Bruce A.

IPC: H01L23/473

CPC classification number: H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

公开(公告)号：EP2312378A1

公开(公告)日：2011-04-20

申请号：EP10177882.7

申请日：2010-09-21

Applicant: Delphi Technologies, Inc.

Inventor： Myers, Bruce A. ,  Lambert, David K.

IPC: G02F1/1333 ,  G02F1/1335

CPC classification number: G02F1/13336 ,  G02F1/133526 ,  G02F2001/133562

Abstract: A transparent bevel apparatus (20/20') overlays marginal portions of juxtaposed display devices (12, 14) of a segmented display panel (10) to obscure the visual gap (G) between the display devices (12, 14). The bevel apparatus (20/20') at least partially overlaps only marginal pixels of the adjacent display devices (12, 14), so that light from a given display device (12, 14) that passes through the bevel apparatus (20/20') is bent toward the respective display device (12, 14) at an angle with respect to the remainder of the emitted light. Consequently, light emitted from the marginal portions of the juxtaposed display devices (12, 14) is seen by the viewer in the place where the visual gap (G) would otherwise be seen. The bevel apparatus may be constructed in the form of a sheet (20') that overlays an entire display device (12, 14), or all or a portion of the entire display panel (10), or a narrow strip (20) that is aligned with the seams (18) and affixed to juxtaposed faces (22, 24) of the display devices (12, 14).

Abstract translation: 透明斜面装置（20/20'）覆盖分段显示面板（10）的并列显示装置（12,14）的边缘部分，以遮蔽显示装置（12,14）之间的视差（G）。 斜面设备（20/20'）至少部分地仅重叠相邻显示设备（12,14）的边缘像素，使得来自给定显示设备（12,14）的光通过斜面设备（20/20 '）朝向相应的显示装置（12,14）相对于发射的光的其余部分以一定角度弯曲。 因此，观看者可以看到从并列的显示装置（12,14）的边缘部分发出的光，否则将看到视差（G）的位置。 斜面装置可以构成为覆盖整个显示装置（12,14）或整个显示面板（10）的全部或一部分的薄片（20'）或窄条（20）的形式，其中 与接缝（18）对齐并固定在显示装置（12,14）的并置面（22,24）上。

公开(公告)号：EP1748688A3

公开(公告)日：2009-06-03

申请号：EP06076287.9

申请日：2006-06-23

Applicant: Delphi Technologies, Inc.

Inventor： Berlin, Carl W. ,  Chengalva, Suresh K. ,  Brandenburg, Scott D. ,  Myers, Bruce A.

IPC: H05K7/20

CPC classification number: H01L23/473 ,  H01L23/44 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2924/09701 ,  H01L2924/1305 ,  H01L2924/13055 ,  H05K7/20236 ,  H05K7/20909 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An electronic package having circulated submersed cooling fluid and method are provided. The electronic package has a housing defining a sealed enclosure and electronic devices located in the housing. The electronic devices have thermal emitting electrical circuitry. A dielectric fluid, such as a liquid, is located in the housing in heat transfer relationship with the electronic devices. A fluid circulator, such as a piezo fan, is located in the housing in contact with the dielectric liquid for circulating the dielectric liquid to cool the electronic devices.

公开(公告)号：EP1768179A3

公开(公告)日：2008-09-03

申请号：EP06076682.1

申请日：2006-09-08

Applicant: Delphi Technologies, Inc.

Inventor： Schubert, Peter J. ,  Myers, Bruce A.

IPC: H01L23/473

CPC classification number: H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A chip cooling system 10 including a semiconductor device 12 having a bulk region 14, wherein at least one fluid channel 16 extends at least partially through the bulk region 14, the fluid channel 16 having an inlet 18 and an outlet 20, a fluid inlet port 36 in fluid communication with the channel inlet 18, and a fluid outlet port 38 in fluid communication with the channel outlet 20, and a cooling fluid flows from the fluid inlet port 36, through the fluid channel 16 and to the fluid outlet port 38 to cool the bulk region 14.

公开(公告)号：EP1534052A3

公开(公告)日：2007-10-24

申请号：EP04078154.4

申请日：2004-11-18

Applicant: Delphi Technologies, Inc.

Inventor： Chengalva, Suresh K. ,  Ihms, David W. ,  Myers, Bruce A.

IPC: H05K1/02 ,  H01L23/00

CPC classification number: H05K1/0206 ,  H01L2224/16225 ,  H01L2224/73204 ,  H05K1/0271 ,  H05K3/0061 ,  H05K2201/068 ,  H05K2201/10204 ,  H05K2201/10545 ,  H05K2201/10674 ,  H05K2201/2009

Abstract: A circuit board assembly (10) comprising a laminate substrate (12) and a surface mount device (18) having a CTE less than that of the laminate substrate (12) and attached with at least one solder joint (20) to a first surface (14) of the laminate substrate (12). The assembly (10) further includes a localized stiffener (24,124,224) attached to a second surface (16) of the laminate substrate (12) so as to be directly opposite the circuit device (18). The localized stiffener (24,124,224) is formed of a material and is shaped so that, when attached to the laminate substrate (12), the stiffener (24,124,224) is capable of increasing the thermal cycle fatigue life of the one or more solder joints (20) that attach the device (18) to the substrate (12).

公开(公告)号：EP1750306A1

公开(公告)日：2007-02-07

申请号：EP06076348.9

申请日：2006-07-03

Applicant: Delphi Technologies, Inc.

Inventor： Myers, Bruce A. ,  Ihms, David W. ,  Oman, Todd P.

IPC: H01L23/488 ,  H01L21/56

CPC classification number: H01L21/563 ,  H01L24/29 ,  H01L24/81 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/10165 ,  H01L2224/73203 ,  H01L2224/81024 ,  H01L2224/81136 ,  H01L2224/8114 ,  H01L2224/81191 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83102 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H05K3/305 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2201/2036 ,  Y02P70/613 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: An electronic package (10) having a controlled standoff height between a surface mount device (16) and a circuit board (12). The electronic package (10) includes a circuit board (12) having a substrate and circuitry including mounting pads (14) and a surface mount device (16) having circuitry and contact terminals (18). Solder joints (20) connect the contact terminals (18) of the surface mount device (16) to the mounting pads (14) on the circuit board (12). A dielectric underfill (22) is disposed between the circuit board (12) and the surface mount device (16), and a plurality of filler particles (24) are disposed in the underfill material (22) to provide a separation distance between the circuit board (12) and the surface mount device (16).

Abstract translation: 一种在表面安装装置（16）和电路板（12）之间具有受控的支座高度的电子封装（10）。 电子封装（10）包括具有基板的电路板（12）和包括安装焊盘（14）和具有电路和接触端子（18）的表面安装装置（16）的电路。 焊接接头（20）将表面安装器件（16）的接触端子（18）连接到电路板（12）上的安装焊盘（14）。 电介质底部填充物（22）设置在电路板（12）和表面安装装置（16）之间，并且多个填料颗粒（24）设置在底部填充材料（22）中以提供电路 板（12）和表面安装装置（16）。