公开(公告)号：AT315240T

公开(公告)日：2006-02-15

申请号：AT03750726

申请日：2003-08-28

Applicant: IBM

Inventor： KNICKERBOCKER JOHN U ,  JACOBOWITZ LAWRENCE ,  LUIJTEN RONALD P ,  SHINDE SUBHASH L

IPC: G02B6/42 ,  G02B6/43

Abstract: A set of interlocking modules supports and connects a die containing lasers, a set of precision molded lenses and a set of beam switching elements. Another embodiment of the invention is a structure for mounting a logic chip and an optical chip on a chip carrier, with the optical chip being mounted on the side of the carrier facing the system board on which the carrier is mounted, so that radiation travels in a straight path from optical sources on the optical chip into optical transmission guides on the board.

公开(公告)号：CA1308817C

公开(公告)日：1992-10-13

申请号：CA593138

申请日：1989-03-08

Applicant: IBM

Inventor： BAISE ARNOLD I ,  CASEY JON A ,  CLARKE DAVID R ,  DIVAKARUNI RENUKA S ,  DUNKEL WERNER E ,  HUMENIK JAMES N ,  KANDETZKE STEVEN M ,  KIRBY DANIEL P ,  KNICKERBOCKER JOHN U ,  MATTS AMY T ,  TAKACS MARK A ,  WIGGINS LOVELL B

IPC: H05K1/03 ,  C04B41/48 ,  C04B41/49 ,  H01L21/48 ,  H01L23/08 ,  H01L23/538 ,  H05K3/40 ,  H01L23/14

Abstract: The cracking experienced during thermal cycling of metal:dielectric semiconductor packages results from a mismatch in thermal co-efficients of expansion. The non-hermeticity associated with such cracking can be addressed by backfilling the permeable cracks with a flexible material. Uniform gaps between the metal and dielectric materials can similarly be filled with flexible materials to provide stress relief, bulk compressibility and strength to the package. Furthermore, a permeable, skeletal dielectric can be fabricated as a fired, multilayer structure having sintered metallurgy and subsequently infused with a flexible, temperature-stable material to provide hermeticity and strength. FI9-86-046

公开(公告)号：SG11201600462VA

公开(公告)日：2016-02-26

申请号：SG11201600462V

申请日：2014-07-29

Applicant: IBM

Inventor： DANG BING ,  KNICKERBOCKER JOHN U ,  TSANG CORNELIA KANG-I

IPC: H01L21/02 ,  H01L21/683

Abstract: Structures and methods are provided for temporarily bonding handler wafers to device wafers using bonding structures that include one or more releasable layers which are laser-ablatable using mid-wavelength infrared radiation

公开(公告)号：DE60303140D1

公开(公告)日：2006-03-30

申请号：DE60303140

申请日：2003-08-28

Applicant: IBM

Inventor： KNICKERBOCKER JOHN U ,  JACOBOWITZ LAWRENCE ,  LUIJTEN RONALD P ,  SHINDE SUBHASH L

IPC: G02B6/42 ,  G02B6/43

Abstract: A set of interlocking modules supports and connects a die containing lasers, a set of precision molded lenses and a set of beam switching elements. Another embodiment of the invention is a structure for mounting a logic chip and an optical chip on a chip carrier, with the optical chip being mounted on the side of the carrier facing the system board on which the carrier is mounted, so that radiation travels in a straight path from optical sources on the optical chip into optical transmission guides on the board.

公开(公告)号：AU2003293051A1

公开(公告)日：2004-08-10

申请号：AU2003293051

申请日：2003-11-25

Applicant: IBM

Inventor： HUMENIK JAMES N ,  KNICKERBOCKER JOHN U ,  VALLABHANENI RAO V ,  GOVINDARAJAN NATARAJAN ,  AHMAD UMAR ,  BEZAMA RASHID J

IPC: B01L3/00 ,  B29C65/00 ,  B32B18/00 ,  C03B29/00 ,  C04B33/34 ,  C04B37/00

Abstract: A plate for use in mixing and testing materials in the pharmaceutical industry is formed by a method in which apertures in a set of greensheets are formed by a material removal process, at least some of the apertures being filled with a fugitive material that escapes during sintering.

公开(公告)号：AU2003268949A1

公开(公告)日：2004-04-19

申请号：AU2003268949

申请日：2003-08-28

Applicant: IBM

Inventor： LUIJTEN RONALD P ,  SHINDE SUBHASH L ,  KNICKERBOCKER JOHN U ,  JACOBOWITZ LAWRENCE

IPC: G02B6/42 ,  G02B6/43

Abstract: A set of interlocking modules supports and connects a die containing lasers, a set of precision molded lenses and a set of beam switching elements. Another embodiment of the invention is a structure for mounting a logic chip and an optical chip on a chip carrier, with the optical chip being mounted on the side of the carrier facing the system board on which the carrier is mounted, so that radiation travels in a straight path from optical sources on the optical chip into optical transmission guides on the board.