公开(公告)号：BR9302987A

公开(公告)日：1994-03-01

申请号：BR9302987

申请日：1993-07-26

Applicant: IBM

Inventor： BANTU NAGESHWER R ,  BHATT ANIKUMAR C ,  KEESLER ROSS W ,  PAPATHOMAS KONSTANTINOS ,  WAGNER JEROME J

IPC: B01D3/00 ,  C07D317/36 ,  G03F7/30 ,  G03F7/42 ,  H01L21/02 ,  H01L21/027 ,  H01L21/30 ,  C07C69/96

公开(公告)号：MY117854A

公开(公告)日：2004-08-30

申请号：MYPI9702207

申请日：1997-05-20

Applicant: IBM

Inventor： LAUFFER JOHN M ,  PAPATHOMAS KONSTANTINOS

IPC: H05K1/16 ,  H05K3/42 ,  H05K3/46

Abstract: A METHOD IS PROVIDED FOR PRODUCING A CAPACITOR(44-50,78-80) TO BE EMBEDDED IN AN ELECTRONIC CIRCUIT PACKAGE COMPRISING THE STEPS OF SELECTING A FIRST CONDUCTOR FOIL, SELECTING A DIELECTRIC MATERIAL, COATING THE DIELECTRIC MATERIAL ON AT LEAST ONE SIDE OF THE FIRST CONDUCTOR FOIL, AND LAYERING THE COATED FOIL WITH A SECOND CONDUCTOR FOIL ON TOP OF THE COATING OF DIELECTRIC MATERIAL. ALSO CLAIMED IS AN ELECTRONIC CIRCUIT PACKAGE INCORPORATING AT LEAST ONE EMBEDDED CAPACITOR MANUFACTURED IN ACCORDANCE WITH THE PRESENT INVENTION. (FIG.1)

公开(公告)号：HU0003638A2

公开(公告)日：2001-02-28

申请号：HU0003638

申请日：1998-06-12

Applicant: IBM

Inventor： FARQUHAR DONALD SETON ,  KLODOWSKI MICHAEL JOSEPH ,  PAPATHOMAS KONSTANTINOS ,  WILCOX JAMES ROBERT

IPC: H01L21/60 ,  H01L21/54 ,  H01L21/56 ,  H01L23/31

Abstract: The electrical connections of an integrated circuit chip assembly comprised of an integrated circuit chip attached to a substrate are encapsulated and reinforced with a high viscosity encapsulant material by dispensing the encapsulant material through an opening in the substrate into the space between the integrated circuit chip and the substrate. An integrated circuit chin assembly having a reinforced electrical interconnection which is more resistant to weakening as a result of stress created by differences in coefficient of thermal expansion between the integrated circuit chip and the substrate to which the integrated circuit chip is attached is produced.

公开(公告)号：AT196902T

公开(公告)日：2000-10-15

申请号：AT93480108

申请日：1993-07-30

Applicant: IBM

Inventor： BANTU NAGESCHWER R ,  KEESLER ROSS W ,  SINCLAIR TERRY D ,  BHATT ANILKUMAR C ,  PAPATHOMAS KONSTANTINOS ,  WAGNER JEROME J

IPC: B01D3/00 ,  C07D317/36 ,  G03F7/30 ,  G03F7/42 ,  H01L21/02 ,  H01L21/027 ,  H01L21/30

公开(公告)号：ID20506A

公开(公告)日：1998-12-31

申请号：ID980728

申请日：1998-05-18

Applicant: IBM

Inventor： FARQUHAR DONALD SETON ,  KLODOWSKI MICHAEL JOSEPH ,  PAPATHOMAS KONSTANTINOS ,  WILCOX JAMES ROBERT

IPC: H01L21/60 ,  H01L21/54 ,  H01L21/56 ,  H01L23/31 ,  H05K3/38

Abstract: The electrical connections of an integrated circuit chip assembly comprised of an integrated circuit chip attached to a substrate are encapsulated and reinforced with a high viscosity encapsulant material by dispensing the encapsulant material through an opening in the substrate into the space between the integrated circuit chip and the substrate. An integrated circuit chin assembly having a reinforced electrical interconnection which is more resistant to weakening as a result of stress created by differences in coefficient of thermal expansion between the integrated circuit chip and the substrate to which the integrated circuit chip is attached is produced.

公开(公告)号：CA2094407C

公开(公告)日：1997-04-08

申请号：CA2094407

申请日：1993-04-20

Applicant: IBM

Inventor： BANTU NAGESHWER RAO ,  BHATT ANILKUMAR CHINUPRASAD ,  KEESLER ROSS WILLIAM ,  PAPATHOMAS KONSTANTINOS ,  SINCLAIR TERRY DONALD ,  WAGNER JEROME JAMES

IPC: B01D3/00 ,  C07D317/36 ,  G03F7/30 ,  G03F7/42 ,  H01L21/02 ,  H01L21/027 ,  H01L21/30 ,  B01D1/00

Abstract: Disclosed is a method of recovering a cyclic alkylene carbonate, such as propylene carbonate, from an effluent stream of a process in which the cyclic alkylene carbonate removes an organic photoresist material from a substrate. The effluent is a cyclic alkylene carbonate effluent, e.g., a propylene carbonate effluent, of the carbonate, water, and polymeric solids. In the recovery process the cyclic alkylene carbonate effluent is fed to a heat exchanger, and separated into (i) water and volatiles, and (ii) cyclic carbonate. This lowers the concentration of water in the cyclic alkylene carbonate to a level that is low enough to substantially avoid hydrolysis of cyclic alkylene carbonate to the corresponding glycol. The dewatered cyclic alkylene carbonate is evaporated to separate the cyclic alkylene carbonate from high boiling materials and polymeric solids. The dewatered cyclic alkylene carbonate is separated into (i) a cyclic alkylene carbonate fraction, and (ii) a photoresist solids fraction. The photoresist materials fractions contains photoresist material in the alkylene carbonate. The cyclic alkylene carbonate fraction is further separated in a fractionation means into a higher vapor pressure alkylene glycol fraction, and a lower vapor pressure alkylene carbonate fraction.

公开(公告)号：CA2094407A1

公开(公告)日：1994-02-05

申请号：CA2094407

申请日：1993-04-20

Applicant: IBM

Inventor： BANTU NAGESHWER R ,  BAHAT ANILKUMAR C ,  KEESLER ROSS W ,  PAPATHOMAS KONSTANTINOS ,  SINCLAIR TERRY D ,  WAGNER JEROME J

IPC: B01D3/00 ,  C07D317/36 ,  G03F7/30 ,  G03F7/42 ,  H01L21/02 ,  H01L21/027 ,  H01L21/30 ,  B01D1/00