21.
    发明专利
    未知

    公开(公告)号:DE69208348D1

    公开(公告)日:1996-03-28

    申请号:DE69208348

    申请日:1992-12-07

    Applicant: IBM

    Abstract: The present invention describes a high speed, high precision electrochemical micromachining tool, chemical solution and method for the one sided through-mask micropatterning of conducting foils and films supported by insulating material. The tool of the present invention can include either a movable plate means allowing for the movement of the workpiece (20) to and from above the cathode assembly (18), or a movable cathode assembly means allowing for the movement of said cathode assembly to and fro beneath the workpiece. Said cathode assembly also consists of a nozzle assembly from which the electrolytic solution emerges as electrolytic shower and impinges upon the workpiece. Methods to resolve the problems related to the loss of electrical contact during the electrochemical micromachining process are also described.

    22.
    发明专利
    未知

    公开(公告)号:DE69204869D1

    公开(公告)日:1995-10-26

    申请号:DE69204869

    申请日:1992-01-16

    Applicant: IBM

    Abstract: An integrated inductive write, magnetoresistive (MR) read thin film magnetic head comprising an open magnetic yoke having outside legs each having a winding thereon and a central leg having an opening across which the MR element is coupled. The outer legs are overlapped at one end to form confronting pole pieces having a transducing gap between the pole pieces, and the central leg is positioned between the pole pieces at one end and joined with the outer legs at the other end to form a symmetrical magnetic yoke structure. The windings are wound in a direction so that the flux produced by equally energizing the windings is equal and opposite in each of the outside legs, is additive at the transducing gap between the pole pieces, and produces no net flux through the central leg.

    Mask-less selective electroplating process

    公开(公告)号:IT1148822B

    公开(公告)日:1986-12-03

    申请号:IT2161180

    申请日:1980-04-24

    Applicant: IBM

    Abstract: A selective electroplating process involves placing a cathode and an anode in a non-photo decomposable electrolyte, directing a focusable beam of energy of intensity 102-106 W/cm2 onto the cathode surface to heat the regions to be plated, and establishing an electrical potential between the cathode and the anode. Also claimed is a similar process which employs a light beam of intensity \-102W/cm2 for heating the cathode surface. The process is esp. useful for personalising the repairing integrated circuits, but is also useful e.g. in video display techniques. Deposition rates of about 103 times greater on the heated regions than on the background can be achieved.

    24.
    发明专利
    未知

    公开(公告)号:IT8025316D0

    公开(公告)日:1980-10-14

    申请号:IT2531680

    申请日:1980-10-14

    Applicant: IBM

    Abstract: A thin film inductive transducer head includes a magnetic circuit with a pair of legs and inductive coils. The legs are thinner near the pole tip than in the back gap region. The legs are also narrower in the pole tip region than in the back gap region. Resolution is enhanced by the thin pole tips and saturation of the yoke structure is avoided by increasing the cross-sectional area of the yoke structure away from the pole tip region.

    26.
    发明专利
    未知

    公开(公告)号:DE69612778D1

    公开(公告)日:2001-06-21

    申请号:DE69612778

    申请日:1996-02-13

    Applicant: IBM

    Abstract: An integrated data storage disk and disk drive assembly includes a rotatably supported magnetic disk for storing data. A rotor is fixedly joined to the disk for rotating the disk, and includes a plurality of rotor poles. A stator includes a plurality of stator poles positioned around the rotor for sequentially cooperating with respective ones of the rotor poles for rotating the rotor to rotate the disk. The disk and drive may be fabricated using lithographic and electroplating techniques, and a plurality of coaxial disks may be driven by a single disk drive in exemplary embodiments.

    27.
    发明专利
    未知

    公开(公告)号:DE69207888T2

    公开(公告)日:1996-08-14

    申请号:DE69207888

    申请日:1992-11-28

    Applicant: IBM

    Abstract: The invention relates to an electropolishing tool for the removal of metal from a workpiece (22), said electropolishing tool comprising a container means (10) for retaining an electrolytic solution (12), a cathode assembly (18) in the shape of a pyramid the height of which is adjustable, a power supply means including a negative terminal and a positive terminal with said negative terminal being electrically connectable to said cathode assembly (18), a plate means (14) for holding the workpiece (22) and for forming an electrical connection to the workpiece, said plate means connected to the positive terminal of said power supply means, and an enclosure means (16) placed over the workpiece (22) leaving only the surface of the workpiece which is to be polished exposed to the electrolytic solution such that when the workpiece is secured to said plate means and said cathode assembly is connected to the negative terminal of said power supply means and is placed over the said enclosure means directly facing the workpiece enclosed therein, that portion of the workpiece exposed to the electrolytic solution undergoes electropolishing.

    28.
    发明专利
    未知

    公开(公告)号:DE69207888D1

    公开(公告)日:1996-03-07

    申请号:DE69207888

    申请日:1992-11-28

    Applicant: IBM

    Abstract: The invention relates to an electropolishing tool for the removal of metal from a workpiece (22), said electropolishing tool comprising a container means (10) for retaining an electrolytic solution (12), a cathode assembly (18) in the shape of a pyramid the height of which is adjustable, a power supply means including a negative terminal and a positive terminal with said negative terminal being electrically connectable to said cathode assembly (18), a plate means (14) for holding the workpiece (22) and for forming an electrical connection to the workpiece, said plate means connected to the positive terminal of said power supply means, and an enclosure means (16) placed over the workpiece (22) leaving only the surface of the workpiece which is to be polished exposed to the electrolytic solution such that when the workpiece is secured to said plate means and said cathode assembly is connected to the negative terminal of said power supply means and is placed over the said enclosure means directly facing the workpiece enclosed therein, that portion of the workpiece exposed to the electrolytic solution undergoes electropolishing.

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