公开(公告)号：MY135489A

公开(公告)日：2008-04-30

申请号：MYPI20042488

申请日：2004-06-24

Applicant: LAM RES CORP

Inventor： BOYD JOHN M ,  LARIOS JOHN M DE ,  RAVKIN MICHAEL ,  REDEKER FRED C

IPC: G03F7/20 ,  H01L21/00

Abstract: A SYSTEM AND METHOD FOR PROCESSING A WAFER INCLUDES APPLYING A PROCESS TO THE WAFER (108) (OPERATION 1405). THE PROCESS BEING SUPPORTED BY A SURFACE TENSION GRADIENT DEVICE (100,100-1,100-2,100-3,100-4,100-5, 1200, 1200'').A RESULT OF THE PROCESS IS MONITORED (OPERATION 1410).THE MONITORED RESULT IS OUTPUT (OPERATION 1415).(FIG 12A)

公开(公告)号：IL136287A

公开(公告)日：2006-10-05

申请号：IL13628799

申请日：1999-02-18

Applicant: LAM RES CORP ,  LARIOS JOHN M DE ,  ZHAO YUEXING ,  LI XU ,  HYMES DIANE J

Inventor： LARIOS JOHN M DE ,  ZHAO YUEXING ,  LI XU ,  HYMES DIANE J

IPC: C11D1/00 ,  C09K13/00 ,  C09K13/06 ,  C09K13/08 ,  C11D3/02 ,  C11D7/02 ,  C11D7/04 ,  C11D7/08 ,  C11D7/26 ,  C11D11/00 ,  C23G1/10 ,  H01L21/02 ,  H01L21/304 ,  H01L21/306 ,  H01L21/308 ,  H01L21/3205 ,  H01L21/321

Abstract: A cleaning solution, method, and apparatus for cleaning semiconductor substrates after chemical mechanical polishing of copper films is described. The present invention includes a cleaning solution which combines deionized water, an organic compound, and an ammonium compound in an acidic pH environment for cleaning the surface of a semiconductor substrate after polishing a copper layer. Such methods of cleaning semiconductor substrates after copper CMP alleviate the problems associated with brush loading and surface and subsurface contamination.

公开(公告)号：IL161684A

公开(公告)日：2012-07-31

申请号：IL16168404

申请日：2004-04-29

Applicant: LAM RES CORP ,  LARIOS JOHN M DE ,  GARCIA JAMES P ,  WOODS CARL A ,  RAVKIN MICHAEL ,  REDEKER FRED C

Inventor： LARIOS JOHN M DE ,  GARCIA JAMES P ,  WOODS CARL A ,  RAVKIN MICHAEL ,  REDEKER FRED C

公开(公告)号：MY143956A

公开(公告)日：2011-07-29

申请号：MYPI20051478

申请日：2005-04-01

Applicant: LAM RES CORP

Inventor： KOROLIK MIKHAIL ,  LARIOS JOHN M DE ,  RAVKIN MIKE ,  FARBER JEFFREY

IPC: H01L21/00 ,  H01L21/304 ,  B08B3/04

Abstract: A METHOD FOR PROCESSING A SUBSTRATE (108) IS PROVIDED WHICH INCLUDES GENERATING A FLUID MENISCUS (104) TO PROCESS THE SUBSTRATE AND APPLYING THE FLUID MENISCUS (104) TO A SURFACE OF THE SUBSTRATE. THE METHOD FURTHER INCLUDES REDUCING EVAPORATION OF FLUIDS FROM A SURFACE IN THE SUBSTRATE PROCESSING ENVIRONMENT (301,400,400’).

公开(公告)号：MY143289A

公开(公告)日：2011-04-15

申请号：MYPI20051473

申请日：2005-03-31

Applicant: LAM RES CORP

Inventor： RAVKIN MICHAEL ,  LARIOS JOHN M DE ,  KOROLIK MIKHAIL ,  SMITH MICHAEL G R ,  WOODS CARL

IPC: A47L15/00 ,  A47L25/00 ,  B08B1/02 ,  B08B1/04 ,  B08B3/00 ,  B08B3/04 ,  B08B7/00 ,  B08B7/04 ,  H01L21/00

Abstract: A METHOD FOR CLEANING AND DRIYING A FRONT AND A BACK SURFACE OFA SUBSTRATE ( 102) IS PROVIDED. THE METHOD INCLUDES BRUSH SCRUBBING THE BACK SURFACE ( 102B) OF THE SUBSTRATE ( 102) USING A BRUSH SCRUBBING FLUID CHEMISTRY (121). THE METHOD FURTHER INCLUDES APPLYING A FRONT MENISCUS (150) ONTO THE FRONT SURFACE ( 102A) OF THE SUBSTRATE ( 102) UPON COMPLETING THE BRUSH SCRUBBING OF THE BACK SURFACE (102B). THE FRONT MENISCUS (150) INCLUDES A FRONT CLEANING CHEMISTRY THAT IS CHEMICALLY COMPATIBLE WITH THE BRUSH SCRUBBING FLUID CHEMISTRY (121). A METHOD FOR PREPARING A SURFACE OF A SUBSTRATE (102) IS ALSO PROVIDED. THE METHOD INCLUDES SCANNING THE SURFACE OF THE SUBSTRATE BY A MENISCUS ( 150). PREPARING THE SURFACE OF THE SUBSTRATE USING THE MENISCUS (150) (1102). AND PERFORMING A NEXT PREPARATION OPERATION ON THE SURFACE OF THE SUBSTRATE (102) THAT WAS PREPARED WITHOUT PERFORMING A RINSING OPERATION ( 1104).

公开(公告)号：SG154438A1

公开(公告)日：2009-08-28

申请号：SG2009044637

申请日：2006-11-29

Applicant: LAM RES CORP

Inventor： FREER ERIK M ,  LARIOS JOHN M DE ,  MIKHAYLICHENKO KATRINA ,  RAVKIN MICHAEL ,  KOROLIK MIKHAIL ,  REDEKER FRED C

Abstract: A cleaning compound is provided. The cleaning compound includes about 0.1 weight percent to about 10 weight percent of a fatty acid dispersed in water. The cleaning compound includes an amount of a base sufficient to bring a pH of the fatty acid water solution to about a level where above about 50% of the dispersed fatty acid is ionized. A method for cleaning a substrate, a system for cleaning a substrate, and a cleaning solution prepared by a process are also provided.

公开(公告)号：SG133543A1

公开(公告)日：2007-07-30

申请号：SG2006087423

申请日：2006-12-15

Applicant: LAM RES CORP

Inventor： FREER ERIK M ,  LARIOS JOHN M DE ,  MIKHAYLICHENKO KATRINA ,  RAVKIN MICHAEL ,  KOROLIK MIKHAIL ,  REDEKER FRED C ,  THOMAS CLINT ,  PARKS JOHN

Abstract: An apparatus for cleaning a substrate is disclosed. The apparatus having a first head unit and a second head unit. The first head unit is positioned proximate to the surface of the substrate and has a first row of channels defined within configured to supply a foam to the surface of the substrate. The second head unit is positioned substantially adjacent to the first head unit and proximate to the surface of the substrate. A second and a third row of channels are defined within the second head unit. The second row of channels is configured to supply a fluid to the surface of the substrate. The third row of channels is configured to apply a vacuum to the surface of the substrate.

公开(公告)号：SG133499A1

公开(公告)日：2007-07-30

申请号：SG2006083448

申请日：2006-11-29

Applicant: LAM RES CORP

Inventor： FREER ERIK M ,  LARIOS JOHN M DE ,  MIKHAYLICHENKO KATRINA ,  RAVKIN MICHAEL ,  KOROLIK MIKHAIL ,  REDEKER FRED C

Abstract: A cleaning compound is provided. The cleaning compound includes about 0.1 weight percent to about 10 weight percent of a fatty acid dispersed in water. The cleaning compound includes an amount of a base sufficient to bring a pH of the fatty acid water solution to about a level where above about 50% of the dispersed fatty acid is ionized. A method for cleaning a substrate, a system for cleaning a substrate, and a cleaning solution prepared by a process are also provided.

公开(公告)号：SG133491A1

公开(公告)日：2007-07-30

申请号：SG2006080493

申请日：2006-11-20

Applicant: LAM RES CORP

Inventor： FREER ERIK M ,  LARIOS JOHN M DE ,  MIKHAYLICHENKO KATRINA ,  RAVKIN MICHAEL ,  KOROLIK MIKHAIL ,  REDEKER FRED C

Abstract: A method is provided for removing contamination from a substrate. The method includes applying a cleaning solution having a dispersed phase, a continuous phase and particles dispersed within the continuous phase to a surface of the substrate. The method includes forcing one of the particles dispersed within the continuous phase proximate to one of the surface contaminants. The forcing is sufficient to overcome any repulsive forces between the particles and the surface contaminants so that the one of the particles and the one of the surface contaminants are engaged. The method also includes removing the engaged particle and surface contaminant from the surface of the substrate. A process to manufacture the cleaning material is also provided.

公开(公告)号：AU2003277052A1

公开(公告)日：2004-04-23

申请号：AU2003277052

申请日：2003-09-29

Applicant: LAM RES CORP

Inventor： WOODS CARL A ,  GARCIA JAMES P ,  LARIOS JOHN M DE ,  RAVKIN MICHAEL ,  REDEKER FRED C

IPC: H01L25/00 ,  B08B1/02 ,  B08B3/04 ,  H01L21/00

Abstract: A system and method for processing an edge of a substrate includes an edge roller and a first proximity head. The first proximity head being mounted on the edge roller. The first proximity head capable of forming a meniscus and including a concave portion and multiple ports opening into the concave portion. The concave portion being capable of receiving an edge of a substrate and the ports including at least one process liquid injection port, at least one vacuum port and at least one surface tension control port.