公开(公告)号：US11977043B2

公开(公告)日：2024-05-07

申请号：US17253024

申请日：2019-08-02

Applicant: NEW COSMOS ELECTRIC CO., LTD.

Inventor： Hirokazu Mitsuhashi ,  Naganori Dogami

IPC: G01N27/12 ,  B81B3/00 ,  G01N27/414 ,  G01N33/00

CPC classification number: G01N27/129 ,  B81B3/0035 ,  G01N27/12 ,  G01N27/122 ,  G01N27/414 ,  G01N33/004 ,  G01N33/005 ,  B81B2201/02 ,  B81B2201/10

Abstract: The MEMS type semiconductor gas detection element of the invention is a MEMS type semiconductor gas detection element 1 having a MEMS structure, for detecting hydrogen gas, comprising: a substrate 2; a gas sensitive portion 3 mainly made of a metal oxide semiconductor and provided to the substrate 2; a heating portion 4 for heating the gas sensitive portion 3; an inactive film 5 having hydrogen-permselective and formed outside the gas sensitive portion 3; a protective film 6 formed outside the inactive film 5, for suppressing deterioration of the gas sensitive portion 3.

公开(公告)号：US20170217766A1

公开(公告)日：2017-08-03

申请号：US15484765

申请日：2017-04-11

Applicant: Intel IP Corporation

Inventor： Gerald Ofner ,  Thorsten Meyer ,  Reinhard Mahnkopf ,  Christian Geissler ,  Andreas Augustin

IPC: B81C1/00 ,  B81B7/00

CPC classification number: B81C1/00238 ,  B81B7/008 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/025 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2201/0271 ,  B81B2201/10 ,  B81B2207/012 ,  B81B2207/053 ,  B81B2207/07 ,  B81B2207/096 ,  B81C1/0023 ,  B81C2203/0792 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2924/15311 ,  H01L2924/00014

Abstract: In embodiments, a package assembly may include an application-specific integrated circuit (ASIC) and a microelectromechanical system (MEMS) having an active side and an inactive side. In embodiments, the MEMS may be coupled directly to the ASIC by way of one or more interconnects. The MEMS, ASIC, and one or more interconnects may define or form a cavity such that the active portion of the MEMS is within the cavity. In some embodiments, the package assembly may include a plurality of MEMS coupled directly to the ASIC by way of a plurality of one or more interconnects. Other embodiments may be described and/or claimed.

公开(公告)号：US20120018819A1

公开(公告)日：2012-01-26

申请号：US13190254

申请日：2011-07-25

Applicant: Marco Ferrera ,  Matteo Perletti ,  Igor Varisco ,  Luca Zanotti

Inventor： Marco Ferrera ,  Matteo Perletti ,  Igor Varisco ,  Luca Zanotti

IPC: H01L29/84 ,  H01L21/02

CPC classification number: B81C1/00119 ,  B01D67/0062 ,  B01D71/02 ,  B01D2325/021 ,  B01D2325/028 ,  B01L3/502707 ,  B01L3/502753 ,  B01L2300/0681 ,  B81B2201/10 ,  B81C1/00071 ,  B81C1/00087 ,  B81C2201/0133 ,  B81C2201/0157 ,  F04B19/006

Abstract: A process for manufacturing a micromechanical structure envisages: forming a buried cavity within a body of semiconductor material, separated from a top surface of the body by a first surface layer; and forming an access duct for fluid communication between the buried cavity and an external environment. The method envisages: forming an etching mask on the top surface at a first access area; forming a second surface layer on the top surface and on the etching mask; carrying out an etch such as to remove, in a position corresponding to the first access area, a portion of the second surface layer, and an underlying portion of the first surface layer not covered by the etching mask until the buried cavity is reached, thus forming both the first access duct and a filter element, set between the first access duct and the same buried cavity.

Abstract translation: 微机械结构的制造方法设想：在半导体材料体内形成通过第一表面层从主体顶表面分离的掩埋腔; 以及形成用于在所述掩埋腔和外部环境之间流体连通的进入管。 该方法设想：在第一进入区域的顶表面上形成蚀刻掩模; 在顶表面和蚀刻掩模上形成第二表面层; 进行蚀刻，以在对应于第一进入区域的位置中移除第二表面层的一部分，以及未被蚀刻掩模覆盖的第一表面层的下面部分，直到达到掩埋空腔，因此 形成第一进入管道和过滤元件，设置在第一进入管道和相同的掩埋空腔之间。

公开(公告)号：US20100294710A1

公开(公告)日：2010-11-25

申请号：US12308522

申请日：2007-05-04

Applicant: Tino Fuchs ,  Christina Leinenbach

Inventor： Tino Fuchs ,  Christina Leinenbach

IPC: B32B5/16 ,  C23F1/00 ,  C23C16/50 ,  B01D69/00 ,  B01D63/08 ,  G01N33/00

CPC classification number: B81C1/0069 ,  B01D61/243 ,  B01D67/003 ,  B01D67/0058 ,  B01D71/02 ,  B01D2323/35 ,  B01D2325/028 ,  B01D2325/08 ,  B01D2325/26 ,  B81B2201/10 ,  B81C2201/0115 ,  Y10T428/24893

Abstract: A method for producing a component, and a component, in particular a micromechanical and/or microfluidic and/or microelectronic component, is provided, the component including at least one patterned material region, and in a first step the patterned material region is produced in that microparticles of a first material are embedded in a matrix of a second material, and in a second step the patterned material region is rendered porous by etching using a dry etching method or a gas-phase etching method.

Abstract translation: 提供了一种用于制造组件和组件，特别是微机械和/或微流体和/或微电子部件的方法，所述部件包括至少一个图案化材料区域，并且在第一步骤中，图案化材料区域 将第一材料的微粒嵌入第二材料的基体中，在第二步骤中，通过使用干蚀刻法或气相蚀刻法蚀刻图案化材料区域而使多孔化。

公开(公告)号：US20060147679A1

公开(公告)日：2006-07-06

申请号：US11368813

申请日：2006-03-06

Applicant: Johannes Edlinger ,  Claus Heine-Kempkens ,  Othmar Zuger

Inventor： Johannes Edlinger ,  Claus Heine-Kempkens ,  Othmar Zuger

IPC: B32B3/00

CPC classification number: G02B1/118 ,  B01D21/0012 ,  B01D39/2051 ,  B01L3/502707 ,  B01L3/50273 ,  B01L3/502753 ,  B01L3/502761 ,  B01L3/502792 ,  B01L2200/0647 ,  B01L2200/0668 ,  B01L2200/141 ,  B01L2300/0681 ,  B01L2300/0816 ,  B01L2300/0825 ,  B01L2300/16 ,  B01L2400/0406 ,  B01L2400/0409 ,  B01L2400/086 ,  B81B1/002 ,  B81B2201/047 ,  B81B2201/10 ,  B81B2203/0338 ,  B81C1/00119 ,  C23C14/04 ,  C23C14/046 ,  G02B5/1809 ,  G02B5/1847 ,  G02B5/3058 ,  G02B5/3083 ,  G02B2006/12097 ,  Y10S428/913 ,  Y10T428/24612 ,  Y10T428/24942 ,  Y10T428/249953 ,  Y10T428/249961 ,  Y10T428/249975 ,  Y10T428/249977 ,  Y10T428/249979 ,  Y10T428/24998 ,  Y10T428/31678 ,  Y10T436/111666 ,  Y10T436/112499 ,  Y10T436/25375 ,  Y10T436/255

Abstract: An optical component or an analytical platform includes a substrate, an array of microstructures on the substrate and microchannels formed by side walls of adjacent microstructures, a width of the microchannels varies as a function of distance to the substrate, the width continuously decreasing with increasing distance from the substrate within at least one distance-interval. In a method for producing such a component or such a platform a substrate with an array of surface microstructures is coated in a vapor treatment in such a way that shadowing effects of the coating mechanism narrow at least partially a width of the upper parts of side walls of the microstructures thereby forming at least partially embedded microchannels.

公开(公告)号：US06660648B1

公开(公告)日：2003-12-09

申请号：US09678418

申请日：2000-10-02

Applicant: Paul Charles Galambos ,  Randy J. Shul ,  Christi Gober Willison

Inventor： Paul Charles Galambos ,  Randy J. Shul ,  Christi Gober Willison

IPC: H01L21302

CPC classification number: B81C1/00158 ,  B81B2201/058 ,  B81B2201/10 ,  B81C2201/0115 ,  B81C2201/0132

Abstract: A new class of semipermeable membranes, and techniques for their fabrication, have been developed. These membranes, formed by appropriate etching of a deposited silicon nitride layer, are robust, easily manufacturable, and compatible with a wide range of silicon micromachining techniques.

Abstract translation: 已开发出一类新型半透膜及其制造技术。 通过适当蚀刻沉积的氮化硅层形成的这些膜是坚固的，易于制造的，并且与各种硅微加工技术相容。

公开(公告)号：US20030180024A1

公开(公告)日：2003-09-25

申请号：US10366095

申请日：2003-02-12

Inventor： Johannes Edlinger ,  Claus Heine-Kempkens ,  Othmar Zuger

IPC: G02B006/10

CPC classification number: G02B1/118 ,  B01D21/0012 ,  B01D39/2051 ,  B01L3/502707 ,  B01L3/50273 ,  B01L3/502753 ,  B01L3/502761 ,  B01L3/502792 ,  B01L2200/0647 ,  B01L2200/0668 ,  B01L2200/141 ,  B01L2300/0681 ,  B01L2300/0816 ,  B01L2300/0825 ,  B01L2300/16 ,  B01L2400/0406 ,  B01L2400/0409 ,  B01L2400/086 ,  B81B1/002 ,  B81B2201/047 ,  B81B2201/10 ,  B81B2203/0338 ,  B81C1/00119 ,  C23C14/04 ,  C23C14/046 ,  G02B5/1809 ,  G02B5/1847 ,  G02B5/3058 ,  G02B5/3083 ,  G02B2006/12097 ,  Y10S428/913 ,  Y10T428/24612 ,  Y10T428/24942 ,  Y10T428/249953 ,  Y10T428/249961 ,  Y10T428/249975 ,  Y10T428/249977 ,  Y10T428/249979 ,  Y10T428/24998 ,  Y10T428/31678 ,  Y10T436/111666 ,  Y10T436/112499 ,  Y10T436/25375 ,  Y10T436/255

Abstract: An optical component or an analytical platform includes a substrate, an array of microstructures on the substrate and microchannels formed by side walls of adjacent microstructures, a width of the microchannels varies as a function of distance to the substrate, the width continuously decreasing with increasing distance from the substrate within at least one distance-interval. In a method for producing such a component or such a platform a substrate with an array of surface microstructures is coated in a vapor treatment in such a way that shadowing effects of the coating mechanism narrow at least partially a width of the upper parts of side walls of the microstructures thereby forming at least partially embedded microchannels.

Abstract translation: 光学部件或分析平台包括基板，基板上的微结构阵列和由相邻微结构的侧壁形成的微通道，微通道的宽度随着距衬底的距离而变化，宽度随着距离的增加而连续减小 在至少一个距离间隔内的衬底。 在用于制造这种部件或这种平台的方法中，具有表面微结构阵列的基板以蒸气处理方式被涂覆，使得涂覆机构的遮蔽效应至少部分地缩小了侧壁上部的宽度 从而形成至少部分嵌入的微通道。

公开(公告)号：US06613241B1

公开(公告)日：2003-09-02

申请号：US09699116

申请日：2000-10-27

Applicant: Axel Scherer ,  Theodore Doll ,  Michael Hochberg

Inventor： Axel Scherer ,  Theodore Doll ,  Michael Hochberg

IPC: B44C122

CPC classification number: B01D67/0086 ,  B01D67/0065 ,  B01D71/025 ,  B81B2201/10 ,  B81C1/00158 ,  B81C2201/0109 ,  B81C2201/053 ,  B81C2203/032 ,  C25D11/045 ,  Y10T428/24331 ,  Y10T428/24926

Abstract: The invention is a method of introducing porous membranes into MEMS elements by supporting the membranes by frames to form an heterostructure. This is achieved by attaching to a structured or porous substrate one or more monolithically fabricated frames and membranes. Having membranes disposed on frames enables them to be batch processed and facilitates separation, handling and mounting within MEMS or nanofluidic systems. Applications include, but are not limited to, filters for gases or liquids, electron transmissive windows and scanning electron microscopy (SEM) accessible arrays of nanotest tubes containing liquid phases and other sample states. The invention includes the apparatus made by the method.

Abstract translation: 本发明是通过框架支撑膜以形成异质结构而将多孔膜引入MEMS元件的方法。 这通过将一个或多个整体制造的框架和膜附接到结构化或多孔基底来实现。 将膜放置在框架上使得它们能够被批量处理，并且有助于在MEMS或纳米流体系统中的分离，处理和安装。 应用包括但不限于用于气体或液体的过滤器，电子透射窗和扫描电子显微镜（SEM）可访问的纳米级管，其包含液相和其他样品状态的阵列。 本发明包括通过该方法制造的装置。

公开(公告)号：US20180043283A1

公开(公告)日：2018-02-15

申请号：US15674438

申请日：2017-08-10

Applicant: IMEC VZW

Inventor： Zheng Tao ,  Boon Teik Chan ,  XiuMei Xu ,  Khashayar Babaei Gavan ,  Efrain Altamirano Sanchez

IPC: B01D15/10 ,  B01D53/04

CPC classification number: B01D15/10 ,  B01D53/0407 ,  B01D63/14 ,  B01L3/502753 ,  B01L2300/0896 ,  B81B2201/058 ,  B81B2201/10 ,  B81B2203/0315 ,  B81B2203/0338 ,  B81B2203/0346 ,  B81B2203/0384 ,  B81C1/00119 ,  C12M1/123 ,  C12M33/14

Abstract: A method for producing a structure including, on a main surface of a substrate, at least one elongated cavity having openings at opposing ends. The method includes providing a substrate having a main surface. On the main surface, a first pair of features are formed that protrude perpendicularly from the main surface. The features have elongated sidewalls and a top surface, are parallel to one another, are separated by a gap having a width s1 and a bottom area, and have a width w1 and a height h1. At least the main surface of the substrate and the first pair of features are brought in contact with a liquid, suitable for making a contact angle of less than 90° with the material of the elongated sidewalls and subsequently the substrate is dried.

公开(公告)号：US20160200566A1

公开(公告)日：2016-07-14

申请号：US14403571

申请日：2013-06-28

Applicant: INTEL IP CORPORATION

Inventor： Gerald Ofner ,  Thorsten Meyer ,  Reinhard Mahnkopf ,  Christian Geissler ,  Andreas Augustin

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81C1/00238 ,  B81B7/008 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/025 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2201/0271 ,  B81B2201/10 ,  B81B2207/012 ,  B81B2207/053 ,  B81B2207/07 ,  B81B2207/096 ,  B81C1/0023 ,  B81C2203/0792 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2924/15311 ,  H01L2924/00014

Abstract: In embodiments, a package assembly may include an application-specific integrated circuit (ASIC) and a microelectromechanical system (MEMS) having an active side and an inactive side. In embodiments, the MEMS may be coupled directly to the ASIC by way of one or more interconnects. The MEMS, ASIC, and one or more interconnects may define or form a cavity such that the active portion of the MEMS is within the cavity. In some embodiments, the package assembly may include a plurality of MEMS coupled directly to the ASIC by way of a plurality of one or more interconnects. Other embodiments may be described and/or claimed.

Abstract translation: 在实施例中，封装组件可以包括专用集成电路（ASIC）和具有有源侧和无源侧的微机电系统（MEMS）。 在实施例中，MEMS可以通过一个或多个互连直接耦合到ASIC。 MEMS，ASIC和一个或多个互连可以限定或形成空腔，使得MEMS的有源部分在空腔内。 在一些实施例中，封装组件可以包括通过多个一个或多个互连件直接耦合到ASIC的多个MEMS。 可以描述和/或要求保护其他实施例。