公开(公告)号：EP2868171B1

公开(公告)日：2016-09-07

申请号：EP13724836.5

申请日：2013-05-23

Applicant: SAGEMCOM BROADBAND SAS

Inventor： KOHN, Stéphane

IPC: H05K3/36 ,  H05K3/34

CPC classification number: H05K1/14 ,  H05K1/11 ,  H05K3/3447 ,  H05K3/368 ,  H05K2201/042 ,  H05K2201/10242 ,  H05K2201/10409 ,  H05K2201/10803 ,  H05K2201/1081 ,  H05K2201/10818 ,  H05K2201/10848 ,  H05K2201/10871 ,  H05K2201/2036

公开(公告)号：EP2101552B1

公开(公告)日：2014-05-07

申请号：EP08017982.3

申请日：2008-10-14

Applicant: Hitachi Ltd.

Inventor： Yamashita, Shiro ,  Yoshinari, Hideto

IPC: H05K3/30

CPC classification number: H05K1/119 ,  H05K1/0366 ,  H05K1/056 ,  H05K1/141 ,  H05K3/308 ,  H05K3/42 ,  H05K2201/09827 ,  H05K2201/09854 ,  H05K2201/10189 ,  H05K2201/10446 ,  H05K2201/1059 ,  H05K2201/10803 ,  Y10S439/941

公开(公告)号：EP2868171A1

公开(公告)日：2015-05-06

申请号：EP13724836.5

申请日：2013-05-23

Applicant: Sagemcom Broadband SAS

Inventor： KOHN, Stéphane

IPC: H05K3/36 ,  H05K3/34

CPC classification number: H05K1/14 ,  H05K1/11 ,  H05K3/3447 ,  H05K3/368 ,  H05K2201/042 ,  H05K2201/10242 ,  H05K2201/10409 ,  H05K2201/10803 ,  H05K2201/1081 ,  H05K2201/10818 ,  H05K2201/10848 ,  H05K2201/10871 ,  H05K2201/2036

Abstract: The invention concerns a solder spacer comprising an elongate body (102) having one end provided with a tapped hole (104) and an opposite end provided with a transverse support surface (106) from which a smooth centring pin (103) extends protruding, the pin (103) comprising a longitudinal outer passage (108) extending over a least a portion of the length of same to the transverse support surface (106), allowing a molten soldering paste to rise by capillarity to the transverse support surface (106). The invention also concerns a module (112) comprising such a spacer.

Abstract translation: 本发明提供了一种用于焊接的间隔件，其包括细长本体，其一端设置有螺纹孔，并且相对端设置有具有从其突出的平滑定心栓的横向支承表面，所述钉具有延伸至少一部分的纵向外部通道 其长度为横向轴承表面，以使熔融焊料能够通过毛细管力渗透到横向支承表面。 本发明还提供了一种包括这种间隔物的模块。

公开(公告)号：EP2757864A3

公开(公告)日：2015-01-07

申请号：EP13198761.2

申请日：2013-12-20

Applicant: FUJITSU LIMITED

Inventor： Kajio, Naohiko ,  Kosugi, Naofumi ,  Matsumoto, Yoshio

IPC: H05K1/14

CPC classification number: H05K1/142 ,  H05K1/144 ,  H05K7/142 ,  H05K2201/0311 ,  H05K2201/042 ,  H05K2201/09827 ,  H05K2201/10189 ,  H05K2201/10409 ,  H05K2201/10568 ,  H05K2201/10803 ,  H05K2201/2036 ,  H05K2203/167

Abstract: First and second tapered holes are provided at facing positions of the first and second circuit boards. The elastic spacer including first and second spacers is attached between them to couple the two in parallel and thereby facilitate attachment of the two to a back panel. The first spacer is provided at one end part with a tapered part which fits with the first tapered hole and the second spacer is provided at one end part with a tapered part which fits with the second tapered hole. A spring is inserted between the two spacers. The first spacer is fit in the tapered hole and fastened by a screw to the first circuit board. The second circuit board is fastened by a screw to the first spacer in a state fitting the second tapered hole over the second spacer with the second circuit board approaching the first circuit board.

公开(公告)号：JP5983417B2

公开(公告)日：2016-08-31

申请号：JP2013005690

申请日：2013-01-16

Applicant: 富士通株式会社

Inventor： 梶尾 直彦 ,  小杉 尚史 ,  松本 吉生

IPC: H05K1/14

CPC classification number: H05K1/142 ,  H05K1/144 ,  H05K7/142 ,  H05K2201/0311 ,  H05K2201/042 ,  H05K2201/09827 ,  H05K2201/10189 ,  H05K2201/10409 ,  H05K2201/10568 ,  H05K2201/10803 ,  H05K2201/2036 ,  H05K2203/167

公开(公告)号：JP5927435B2

公开(公告)日：2016-06-01

申请号：JP2013546466

申请日：2012-05-30

Applicant: パナソニックIPマネジメント株式会社

Inventor： 齋藤 孝夫 ,  大島 誠

IPC: H05K1/02 ,  H01R4/02 ,  H01R12/55 ,  H05K1/18

CPC classification number: H05K3/4015 ,  H01R12/58 ,  H05K3/303 ,  H05K2201/09063 ,  H05K2201/09854 ,  H05K2201/10295 ,  H05K2201/10393 ,  H05K2201/10409 ,  H05K2201/10787 ,  H05K2201/10803 ,  H05K2201/10863 ,  H05K2201/10871 ,  H05K2203/0455 ,  H05K3/3468 ,  Y02P70/613

公开(公告)号：US20240268033A1

公开(公告)日：2024-08-08

申请号：US18436098

申请日：2024-02-08

Applicant: Robert Bosch GmbH

Inventor： Florian Eichkorn

IPC: H05K1/18

CPC classification number: H05K1/189 ,  H05K2201/05 ,  H05K2201/09227 ,  H05K2201/09236 ,  H05K2201/09745 ,  H05K2201/10181 ,  H05K2201/10803

Abstract: A flexible printed circuit board, in particular for connecting electrical and/or electronic components, includes a fuse conductor track (10). The fuse conductor track has a conductor width (B1) formed on the flexible printed circuit board (1). The fuse conductor track (10) has a taper (12) in a fuse area (11) of the fuse conductor track (10), at which the fuse conductor track (10) has a fuse width (B2) which is smaller than the conductor width (B1) of the fuse conductor track (10) outside the fuse area (11).

公开(公告)号：US09967977B1

公开(公告)日：2018-05-08

申请号：US14308283

申请日：2014-06-18

Applicant: Arkansas Power Electronics International, Inc.

Inventor： Brice McPherson

IPC: H05K1/11

CPC classification number: H05K1/111 ,  H05K2201/10803 ,  H05K2201/1081

Abstract: A step etched metal electrical contact including a main body formed from a metal sheet defining a metal tab sized to match a die/device terminal and an electrical clearance aperture, electrical clearance trench, and/or an electrical clearance gaps. A heat sink may be combined with the step etched metal electrical contact to provide double sided module cooling for increased thermal performance of power modules.

公开(公告)号：US20170244184A1

公开(公告)日：2017-08-24

申请号：US15422978

申请日：2017-02-02

Applicant: MERCURY SYSTEMS, INC.

Inventor： Darryl J. MCKENNEY ,  Absu METHRATTA ,  Erica OUELLETTE

IPC: H01R12/71 ,  H05K1/02 ,  H05K1/11 ,  H01R13/405 ,  H01R13/05

CPC classification number: H01R12/58 ,  H01R4/028 ,  H01R12/00 ,  H01R12/526 ,  H01R12/714 ,  H01R12/716 ,  H01R13/05 ,  H01R13/405 ,  H01R13/652 ,  H05K1/0213 ,  H05K1/0237 ,  H05K1/0298 ,  H05K1/11 ,  H05K1/111 ,  H05K1/112 ,  H05K1/115 ,  H05K1/181 ,  H05K1/184 ,  H05K3/308 ,  H05K3/34 ,  H05K3/3421 ,  H05K3/42 ,  H05K3/421 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/09545 ,  H05K2201/09827 ,  H05K2201/10098 ,  H05K2201/10189 ,  H05K2201/10295 ,  H05K2201/1078 ,  H05K2201/10803 ,  H05K2201/10871 ,  H05K2201/10878 ,  H05K2201/10901 ,  H05K2203/0455 ,  Y02P70/611

Abstract: According to exemplary embodiments, a tapered surface interconnect is formed on a printed circuit board (PCB). A compliant pin of an electrical connector may be coupled to the tapered surface interconnect and soldered thereto. The surface interconnect may be formed by drilling through one or more layers of the PCB. The depth of the surface interconnect may be shorter than a height or a thickness of the PCB. The surface interconnect may have a tapered side wall to allow for a better fit with a tapered compliant pin. The inclination of the side wall of the surface interconnect may be linear or concave. The intersection between the tapered sidewall and the bottom of the surface interconnect may be rounded to minimize pin insertion issues and may allow for easier solder flux evacuation. The compliant pin may be soldered into place upon being coupled to the tapered surface interconnect.

公开(公告)号：US20160021747A1

公开(公告)日：2016-01-21

申请号：US14333774

申请日：2014-07-17

Applicant: DELPHI INTERNATIONAL OPERATIONS LUXEMBOURG, S.A.R.L.

Inventor： KIN YEAN CHOW

IPC: H05K1/11 ,  H05K1/18

CPC classification number: H05K1/116 ,  H05K1/181 ,  H05K3/308 ,  H05K3/328 ,  H05K2201/10015 ,  H05K2201/10803 ,  H05K2201/10856 ,  H05K2201/10901 ,  H05K2201/10924 ,  H05K2203/107

Abstract: A circuit board assembly includes a printed circuit board and a component. The printed circuit board includes a plated thru-hole through the printed circuit board. The component includes a lead to interconnect the component to the printed circuit board. The lead is formed to define an opening through the lead. The lead is placed into the plated thru-hole such that at least part of the opening is within the plated thru-hole. The lead is laser welded to the plated thru-hole.

Abstract translation: 电路板组件包括印刷电路板和部件。 印刷电路板包括穿过印刷电路板的电镀通孔。 该部件包括用于将部件与印刷电路板互连的引线。 引线形成为通过引线定义开口。 引线被放置在电镀通孔中，使得开口的至少一部分在电镀通孔内。 铅被激光焊接到电镀通孔上。