Abstract:
A method of manufacturing a semiconductor device is capable of preventing a dishing phenomenon from occurring without using dummy patterns. A plurality of conductive patterns are formed along the entire surface of a semiconductor substrate with an irregular pattern density. The conductive patterns have a first stopper layer at the top thereof. An interlayer insulating layer is formed on the conductive patterns. Next, a second stopper layer is formed on the interlayer insulating layer. An etching mask is formed on the second stopper layer so as to expose a first region having a conductive pattern density that is higher than that of another region(s). By using the etching mask, the second stopper layer and part of the interlayer insulating layer are etched at the first region. The resultant structure is then first polished to expose the first stopper layer at the first region, by using a slurry that provides a polishing rate for the interlayer insulating layer that is higher than that for either the first and second stopper layers. The resultant structure is then polished for a second time to remove the second stopper layer form the region(s) of lower pattern density, by using a slurry that provides a polishing rate that is higher for the second stopper layer than for either the first stopper layer and the interlayer insulating layer.
Abstract:
화학기계적 연마 공정의 수행에 따라 슬러리에 노출되는 표면이 소수성을 띠는 물질층, 예를 들어 폴리실리콘층을 정지막으로 하여, 그 노출 표면이 친수성을 띠는 피연마 물질층, 예를 들어 실리콘산화막을 연마할 시 유용하게 사용할 수 있는 슬러리가 제공되며, 상기 슬러리는 물, 연마입자 및 친수성 작용기와 소수성 작용기를 동시에 갖는 폴리머 첨가제를 포함한다.
Abstract:
게이트 전극용 도전층을 필드산화막에 의해 리세스(recess) 된 활성영역에 다마신 구조 형성되는 반도체 소자 및 그 형성방법을 설명한다. 본 발명에 의하면, 활성영역에서는 게이트전극용 도전층이 형성되고 비활성영역에서는 게이트 전극용 도전층이 형성되지 않기 때문에 후속공정에서 층간절연막을 증착할 때, 층간절연막의 두께를 줄여서 층간절연막 내부에서 보이드(void)가 발생하는 것을 억제하고, 활성영역의 바닥면에 선택적 성장에 의한 폴리실리콘막을 다시 성장시키기 때문에 활성영역의 바닥면에서 발생되는 마이크로 스크래치(micro scratch), 피팅(pitting) 및 스트링거의 영향을 최소화시킬 수 있다.
Abstract:
PURPOSE: A method for fabricating a semiconductor device having a gate electrode of a damascene structure is provided to control generation of a void in an interlayer dielectric deposited after a gate line is formed, and to minimize a defect like a micro scratch, pitting or stringer. CONSTITUTION: An insulation layer for a filed oxide layer(106) is formed in a trench formed by patterning a pad oxide layer and a polishing stop layer formed on a semiconductor substrate(100). A chemical mechanical polishing(CMP) process for forming a shallow trench isolation(STI) is performed to define an active region and an inactive region. The polishing stop layer and the pad oxide layer in the active region are removed to form a gate oxide layer. A conductive layer for a gate electrode is deposited. A CMP process is performed to make the conductive layer for the gate electrode have a damascene structure by using the filed oxide layer in the inactive region as a polishing stop layer. A silicide layer and a gate upper insulation layer are stacked and patterned on the substrate to form respective gates in the active and inactive regions. A gate line having a spacer is formed on the sidewall of the gate stack, and a polysilicon layer(120) is grown on the bottom surface of the active region by a selective growth method. An etch stop layer(122) is formed by a blanket etch method. An interlayer dielectric is formed on the semiconductor substrate having the etch stop layer and is etched back.
Abstract:
PURPOSE: A carrier film and a manufacturing method thereof are provided to allow improvement of polishing uniformity in a CMP process. CONSTITUTION: The carrier film(70) is used for a CMP apparatus including a carrier base(80) and a retaining ring(60) formed along circumference of a top surface of the carrier base(80). In the CMP apparatus, the carrier film(70) is attached to the top surface of the carrier base(80) inside the retaining ring(60) by an adhesive layer(82). The carrier film(70) has a difference in compressibility according to regions thereof, preferably the difference being about twice minimum compressibility. In addition, the carrier film(70) is composed of a thin strong polyester layer(62) and a surface layer(64) with pores(72,74) determining compressibility. The first pores(72) formed in outer portions of the carrier film(70) is greater in size than the second pores(74) formed in inner portions. The method includes coating the polyester layer(62) with a mixed layer of polymer and solvent while controlling the solvent, and then forming the pores(72,74) by volatilizing the solvent.
Abstract:
PURPOSE: A device and a method for estimating and converting illuminating chromaticity using cognitive light source and highlight are provided to exactly estimate and convert illuminating chromaticity by considering characteristics of highlight based on relatively stable illuminating chromaticity estimated from cognitive light source. CONSTITUTION: A device for estimating and converting illuminating chromaticity using cognitive light source and highlight includes an image input part(40) for inputting color image, a highlight detecting part(41) for extracting highlight areas from the input color image, a highlight variable calculating part(42) projecting each highlight area to chromaticity coordinate and calculating geometrically expressive variables of shape on the chromaticity coordinate, a cognitive light source chromaticity estimating part(43) for illuminating chromaticity to the input color image through a cognitive light source estimating method, and an adjusted chromaticity calculating part(44) selecting geometrically expressive variables around the estimated illuminating chromaticity and calculating final illuminating chromaticity.
Abstract:
PURPOSE: A trench isolation method is provided to simplify a manufacturing process and reduce an aspect ratio in filling a trench as compared with a shallow trench isolation(STI) method by using a photoresist pattern as a mask for forming the trench, and to uniformly maintain chemical mechanical polishing(CMP) quantity for forming an isolation layer of a uniform thickness by using CeO2 based polishing agent having a large CMP selectivity of a silicon substrate and an oxidation layer. CONSTITUTION: A photoresist pattern is formed on a side of a bare silicon substrate(100). A predetermined depth of the substrate is etched to form a trench by using the photoresist pattern as an etching mask. The photoresist pattern is eliminated. An insulating layer is formed in the trench. A chemical mechanical polishing(CMP) process is performed regarding the resultant structure having the insulating layer by using slurry including CeO2 based polishing agent until the substrate is exposed.