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公开(公告)号：KR101750742B1
公开(公告)日：2017-06-28
申请号：KR1020110105237
申请日：2011-10-14
Applicant: 삼성전자주식회사
IPC: H01L31/18 , G02B6/30 , G02B6/12 , H01L31/0232 , H01L31/103 , G02B6/132 , G02B6/136
CPC classification number: H01L31/02327 , G02B6/12004 , G02B6/132 , G02B6/136 , G02B6/30 , G02B6/305 , H01L31/103 , H01L31/1804 , H01L31/1808 , Y02E10/547 , Y02P70/521
Abstract: 본발명에따른광검출기구조체는내부에트렌치가형성되고상기트렌치내부에클래딩물질을채운제1 실리콘층; 상기제1 실리콘층및 상기클래딩물질의상부에형성된제2 실리콘층; 및상기제2 실리콘층의일측면이식각되어상기제2 실리콘층의측면에접속되고상기제1 실리콘층의상부에직접적으로접속하여단결정성장된게르마늄층을포함한다.
Abstract translation: 形成在其中填充有沟槽的内部包层材料的沟槽根据本发明的第一硅层的光学检测器结构; 在第一硅层和包层材料上形成的第二硅层; 并且具有单晶的锗层生长在第二硅层的一侧上并连接到第二硅层的一侧并直接连接到第一硅层的顶部。
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公开(公告)号：KR1020160038643A
公开(公告)日：2016-04-07
申请号：KR1020140132019
申请日：2014-09-30
Applicant: 삼성전자주식회사
CPC classification number: H01S5/2031 , H01S5/021 , H01S5/026 , H01S5/0422 , H01S5/1032 , H01S5/14 , H01S5/141 , H01S5/22 , H01S5/2232 , H01S5/227 , H01S5/34306
Abstract: 본발명의하이브리드실리콘레이저는벌크실리콘기판; 상기벌크실리콘기판상의일부영역에형성된국부절연층(localized insulating layer); 상기국부절연층상부에형성되고실리콘층으로이루어진광도파로를포함하는광도파로구조물(optical guide structure); 및상기광도파로구조물상에마련된레이징구조물(lasing structure)을포함한다.
Abstract translation: 本发明的混合硅激光器包括体硅衬底; 形成在体硅衬底的一部分上的局部绝缘层; 光导结构，其形成在所述局部绝缘层的上部，并且包括具有硅层的光波导; 以及在光导结构上制备的激光结构。 因此，可以容易地进行热辐射。
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34.发明公开
公开(公告)号：KR1020150086878A
公开(公告)日：2015-07-29
申请号：KR1020140007035
申请日：2014-01-21
Applicant: 삼성전자주식회사
CPC classification number: H04B10/2503 , H04B10/40 , H04B10/61 , H04J14/02
Abstract: 광메모리모듈은, 데이터를저장하는하나이상의메모리장치들및 상기메모리장치들과외부장치사이의광 통신을매개하는적어도하나의광 인터페이스모듈을포함한다. 상기광 인터페이스모듈은, 수신된광을분할하여송신용광 및수신용광을제공하는입출력광 분배부, 상기송신용광 및송신전기신호에기초하여변조동작을수행하여송신광 신호를발생하는전광변환부, 및상기수신용광 및수신광 신호에기초하여코히런트수신동작을수행하여수신전기신호를발생하는코히런트광전변환부를포함한다.
Abstract translation: 光存储器模块包括：存储数据的一个或多个存储器件; 以及一个或多个介质存储器件与外部器件之间的光通信的光接口模块。 光接口模块包括：输入/输出（I / O）配光单元，其分配接收的光以提供透射光和接收光; 电泳转换单元，其执行基于所述发送光的调制操作和电传输信号以产生光发送信号; 以及相干光电转换单元，其基于接收光执行相干接收操作和光接收信号以产生电接收信号。
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公开(公告)号：KR1020140000856A
公开(公告)日：2014-01-06
申请号：KR1020120068377
申请日：2012-06-26
Applicant: 삼성전자주식회사
CPC classification number: G02B6/12 , G02B6/12004 , G02F1/2257 , G02F2001/212 , G02F2201/063 , G02F2201/066 , G02F2202/105
Abstract: An optical integrated circuit includes a substrate including a single crystalline semiconductor material, a passive device including a single crystalline semiconductor material and extended onto the substrate in the crystal direction of the substrate, and an active device including a single crystalline semiconductor material and extended onto the substrate in the crystal direction of the substrate. [Reference numerals] (AA,HH) First direction; (BB,GG) Second direction; (CC,FF) Third direction; (DD,EE) Fourth direction
Abstract translation: 光学集成电路包括：包括单晶半导体材料的衬底，包括单晶半导体材料的无源器件，并且在衬底的<100>晶体方向上延伸到衬底上，以及包括单晶半导体材料的有源器件和 在衬底的<110>晶体方向延伸到衬底上。 （标号）（AA，HH）第一方向; （BB，GG）第二方向; （CC，FF）第三方向; （DD，EE）第四方向
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Patent Agency Ranking
公开(公告)号：KR1020130137448A
公开(公告)日：2013-12-17
申请号：KR1020120061077
申请日：2012-06-07
Applicant: 삼성전자주식회사
IPC: H01L27/14
CPC classification number: G02B6/12 , G02B6/4207 , G02B6/4214 , G02B6/428 , G02B6/43 , H01L2224/16225 , H01L2924/15174 , H01L2924/15311
Abstract: The technical background of the present invention relates to a semiconductor package and a semiconductor device including the same. The semiconductor package includes a package substrate; multiple connection devices on the package substrate; a semiconductor chip including at least one optical I/O device, which transmits and receives optical signals in a direction skewed from the vertical direction of the lower surface of the package substrate by an optical I/O angle, and electrically connected to the package substrate through the multiple connection device.
Abstract translation: 本发明的技术背景涉及半导体封装和包括该半导体封装的半导体器件。 半导体封装包括封装衬底; 封装衬底上的多个连接器件; 包括至少一个光学I / O装置的半导体芯片，其以从光学I / O角度的从封装基板的下表面的垂直方向倾斜的方向发送和接收光信号，并且电连接到封装基板 通过多重连接设备。
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公开(公告)号：KR1020130129567A
公开(公告)日：2013-11-29
申请号：KR1020120053556
申请日：2012-05-21
Applicant: 삼성전자주식회사
CPC classification number: H04B10/25 , G11C7/005 , G11C7/1054 , G11C7/1081 , G11C13/04 , H04B10/801
Abstract: An optical memory system includes a plurality of memory modules and an optical distributing part. A light source generates light. The memory modules include a plurality of memory devices respectively. Each of the memory module outputs an optical signal to a memory controller by converting an electric signal outputted from the memory devices into the optical signal by using the light generated by the light source. The optical distributing part is connected between the light source and the memory modules and distributes the light to the memory modules.
Abstract translation: 光学存储器系统包括多个存储器模块和光学分配部件。 光源产生光。 存储器模块分别包括多个存储器件。 每个存储器模块通过使用由光源产生的光将从存储器件输出的电信号转换成光信号而将光信号输出到存储器控制器。 光分配部分连接在光源和存储器模块之间，并将光分配到存储器模块。
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公开(公告)号：KR101274206B1
公开(公告)日：2013-06-14
申请号：KR1020060016865
申请日：2006-02-21
Applicant: 삼성전자주식회사
IPC: H01S5/22
CPC classification number: H01S5/22 , B82Y20/00 , H01S5/0425 , H01S5/34333
Abstract: 기판상에순차적으로형성된제1반도체층, 활성층, 제2반도체층및 전극을포함하는반도체레이저다이오드가개시되어있다. 개시된반도체레이저다이오드에서, 제2반도체층은리지구조를가지며, 전극은제2반도체층의리지구조상에리지의폭보다작은폭을가지도록형성된다.
Abstract translation: 提供一种半导体激光二极管，其包括基板，以及顺序地形成在基板上的第一半导体层，有源层，第二半导体层和电极。 在半导体激光二极管中，第二半导体层具有脊，电极形成在第二半导体层的脊上，宽度小于脊的宽度。
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公开(公告)号：KR1020120110614A
公开(公告)日：2012-10-10
申请号：KR1020110028579
申请日：2011-03-30
Applicant: 삼성전자주식회사
IPC: H04N5/225 , H01L27/146
CPC classification number: H04N5/2254 , H01L27/14603 , H04N5/369
Abstract: PURPOSE: A 3D image sensor is provided to polarize received light reflected from a subject, thereby reducing interference effects due to external light. CONSTITUTION: A light source module(300) irradiates transmitting light onto a subject. A lens module(400) polarizes the received light, which is reflected from the subject, by the transmitting light. The lens module provides the polarized received light. A sensing unit(100) converts the polarized received light into electrical signals.
Abstract translation: 目的：提供3D图像传感器，用于偏振从被摄体反射的接收光，从而减少由外部光引起的干扰影响。 构成：光源模块（300）将透射光照射到被摄体上。 透镜模块（400）通过透射光将从受检者反射的接收光偏振。 透镜模块提供偏振的接收光。 感测单元（100）将偏振的接收光转换成电信号。
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公开(公告)号：KR1020120089895A
公开(公告)日：2012-08-16
申请号：KR1020100130323
申请日：2010-12-17
Applicant: 삼성전자주식회사
IPC: H04B10/548 , H04B10/532 , H04B10/50 , G02B6/30 , G02F1/225
CPC classification number: G02B6/305 , G02B6/30 , G02F1/225 , G02F2201/307 , H04B10/548 , H04B10/505 , H04B10/532
Abstract: PURPOSE: An optical modulator with reduced size and an optical transmitter having the same are provided to implement miniaturization by removing the use of a passive component and to implement a magh zender type modulator. CONSTITUTION: An optical input unit divides an input optical signal into a first optical signal and a second optical signal. A phase shifter(130) is located in a first path or a second path. The phase shifter modulates the first optical signal or the second optical signal. An optical output unit generates an output optical signal by combination of signals.
Abstract translation: 目的：提供具有减小尺寸的光调制器和具有该光调制器的光发射机，以通过去除无源元件的使用并实现一种电荷调制器来实现小型化。 构成：光输入单元将输入光信号分为第一光信号和第二光信号。 移相器（130）位于第一路径或第二路径中。 移相器调制第一光信号或第二光信号。 光输出单元通过信号的组合生成输出光信号。
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