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公开(公告)号：KR1020090056312A
公开(公告)日：2009-06-03
申请号：KR1020070123409
申请日：2007-11-30
Applicant: 제일모직주식회사
IPC: C09J133/08 , C09J133/00 , C09J7/02 , C09J7/00
CPC classification number: C09J11/08 , C09J7/385 , C09J133/00 , C09J133/08
Abstract: A photo-curable pressure sensitive adhesive composition is provided to ensure excellent adhesive power and pick-up performance by introducing liquid polyisoperene rubber, and to be applied to dicing adhesive tape including an adhesive film layer for dicing and die bonding. A photo-curable pressure sensitive adhesive composition comprises a photo-curable acrylic adhesion binder 45~55 parts by weight including liquid polyisoperene rubber represented by chemical formula 1; a photoinitiator 0.2~1.0 parts by weight; a thermosetting material 1~5 parts by weight; and 35~50 parts by weight. In chemical formula 1, R is a C4~C9 alkyl group or hydroxyl group; n is an integer of 400~700. The molecular weight of the photo-curable acrylic adhesion binder is 150,000~700,000.
Abstract translation: 提供光固化型压敏粘合剂组合物以通过引入液体聚异戊二烯橡胶来确保优异的粘合力和吸收性能，并且应用于包括用于切割和芯片粘合的粘合剂膜层的切割粘合带。 光固化压敏粘合剂组合物包含45〜55重量份的可光固化丙烯酸粘合粘合剂，包括由化学式1表示的液体聚异戊二烯橡胶; 光引发剂0.2〜1.0重量份; 热固性材料1〜5重量份; 和35〜50重量份。 在化学式1中，R为C 4〜C 9烷基或羟基; n为400〜700的整数。 光固化丙烯酸粘合粘合剂的分子量为15万〜70万。
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公开(公告)号：KR1020090055267A
公开(公告)日：2009-06-02
申请号：KR1020070122101
申请日：2007-11-28
Applicant: 제일모직주식회사
CPC classification number: H01L24/27 , C08L2666/14 , C09J7/20 , C09J133/062 , C09J163/00 , C09J2203/326 , C09J2433/00 , C09J2461/00 , C09J2463/00 , H01L21/6836 , H01L24/29 , H01L24/83 , H01L2221/68327 , H01L2224/274 , H01L2224/29 , H01L2224/2919 , H01L2224/2929 , H01L2224/29339 , H01L2224/29347 , H01L2224/29355 , H01L2224/29386 , H01L2224/29387 , H01L2224/29388 , H01L2224/29393 , H01L2224/83191 , H01L2224/8385 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01021 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01072 , H01L2924/01073 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/1461 , H01L2924/181 , Y10T428/2848 , H01L2924/0635 , H01L2924/066 , H01L2924/00 , H01L2924/3512 , H01L2924/00014 , H01L2924/05432 , H01L2924/0532 , H01L2924/05032 , H01L2924/05442 , H01L2924/0503 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
Abstract: An adhesive composition is provided to minimize the generation of gap or void generated form the interface in bonding an adhesive film for die bonding and a semiconductor wafer and to form a film by increasing tensile strength of the film. An adhesive composition for semiconductor assembly comprises a binder part, a hardened part and solvent. The solvent is a binary mixed solvent consisting of low-boiling-point solvent of 40-100 °C and high-boiling-point solvent of 140-200 °C. The binder part is an acrylic polymer, an NCO-added polymer or an epoxy-added polymer. The hardened part is epoxy resin, phenol type hardened resin, urethane resin, silicon resin, polyester resin, amine-based hardened resin, melanin hardened resin, urea hardened resin or acid anhydride-based hardened resin.
Abstract translation: 提供粘合剂组合物以最小化在粘合用于芯片接合的粘合剂膜和半导体晶片时从界面产生的间隙或空隙的产生，并且通过增加膜的拉伸强度来形成膜。 用于半导体组件的粘合剂组合物包括粘合剂部分，硬化部分和溶剂。 溶剂是由40-100℃的低沸点溶剂和140-200℃的高沸点溶剂组成的二元混合溶剂。 粘合剂部分是丙烯酸聚合物，加入NCO的聚合物或加入环氧树脂的聚合物。 硬化部分是环氧树脂，苯酚型硬化树脂，聚氨酯树脂，硅树脂，聚酯树脂，胺类硬化树脂，黑色素硬化树脂，尿素硬化树脂或酸酐类硬化树脂。
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公开(公告)号：KR1020090025821A
公开(公告)日：2009-03-11
申请号：KR1020070090953
申请日：2007-09-07
Applicant: 제일모직주식회사
IPC: C09J133/08 , C09J133/10 , C09J163/00 , C09J11/00
CPC classification number: C09J133/08 , C09J11/06 , C09J163/00
Abstract: A photo-curable adhesive composition is provided to excellent adhesive force to a ring frame, wafer or adhesive film for die bonding, and to ensure excellent curability and releasability. A photo-curable adhesive composition comprise (A) photo-curable acrylic adhesion binder 90~97 parts by weight containing a vinyl group, (B) photoinitiator 0.5~1 parts by weight and (C) thermosetting material 3~7 parts by weight. The photo-curable acrylic adhesion binder containing a vinyl group comprises an epoxy group 2~5 mole % and has the hydroxyl value of 15~30 and the acid value of 1 or less.
Abstract translation: 提供光固化性粘合剂组合物，用于对环形框架，晶片或用于芯片接合的粘合剂膜具有优异的粘附力，并且确保优异的固化性和脱模性。 光固化性粘合剂组合物包含（A）含有乙烯基的90〜97重量份的光固化丙烯酸粘合粘合剂，（B）0.5〜1重量份的光引发剂和（C）热固性材料3〜7重量份。 含有乙烯基的光固化型丙烯酸类粘合粘合剂包含2〜5摩尔％的环氧基，羟基值为15〜30，酸值为1以下。
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公开(公告)号：KR1020090025516A
公开(公告)日：2009-03-11
申请号：KR1020070090433
申请日：2007-09-06
Applicant: 제일모직주식회사
IPC: C09J133/08 , C09J133/10 , C09J7/02 , C09J7/00
CPC classification number: C09J7/00 , C09J4/00 , C09J133/08 , C09J2203/326
Abstract: A photocurable composition for forming an adhesive film is provided to ensure excellent pick-up property due to the reduction of adhesion strength after UV curing and to obtain a dicing die bonding film with one dicing process and die bonding process of a supporting member. A photocurable composition for forming an adhesive film comprises (A) binder resin having adhesion property 100.0 parts by weight, (B) UV-curable urethane acrylate oligomer 20-150 parts by weight, (C) trimethylolpropane-tri(meth)acrylate UV-curable acrylate 3-50 parts by weight and (D) thermosetting agent 0.1-10 parts by weight. The photopolymerization initiator(C) is included in the amount of 0.1-5 parts by weight per UV-curable acrylate(B+C) 100 parts by weight. The polymer binder resin is acrylic resin and comprises a polar functional group selected from the group consisting of -OH, epoxy group and amine group.
Abstract translation: 提供了一种用于形成粘合剂膜的可光固化组合物，以确保由于UV固化后的粘附强度的降低而导致的优异的拾取性能，并且通过一个切割工艺和支撑构件的芯片粘合工艺获得切割芯片接合膜。 用于形成粘合剂膜的可光固化组合物包含（A）粘合性为100.0重量份的粘合剂树脂，（B）20-150重量份的UV可固化氨酯丙烯酸酯低聚物，（C）三羟甲基丙烷 - 三（甲基）丙烯酸酯UV- 可固化丙烯酸酯3-50重量份和（D）热硬化剂0.1-10重量份。 光聚合引发剂（C）的含量相对于100重量份的UV固化性丙烯酸酯（B + C）为0.1-5重量份。 聚合物粘合剂树脂是丙烯酸树脂，并且包含选自-OH，环氧基和胺基的极性官能团。
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公开(公告)号：KR100876522B1
公开(公告)日：2008-12-31
申请号：KR1020060124651
申请日：2006-12-08
Applicant: 제일모직주식회사
IPC: C09J163/00 , C09J9/02 , C09J9/00
Abstract: A resin composition for an anisotropically conductive adhesive is provided to produce an anisotropically conductive adhesive having excellent dimensional stability, reliability, and insulating properties. A resin composition for an anisotropically conductive adhesive includes (a) an epoxy resin, (b) a latent hardener, (c) conductive particles, and (d) rubbers of core-shell structure. The composition further comprises 0.01-5wt% of a solvent. The epoxy resin is a molecule having a aliphatic, alicyclic, aromatic cyclic or linear main chain having a molecular weight of 300 or more, which is a polyfunctional epoxy resin having at least two glycidyl groups in the molecule. The latent hardener is a powdery hardener or capsule-like hardener.
Abstract translation: 提供用于各向异性导电粘合剂的树脂组合物以制造具有优异尺寸稳定性，可靠性和绝缘性能的各向异性导电粘合剂。 用于各向异性导电粘合剂的树脂组合物包括（a）环氧树脂，（b）潜在硬化剂，（c）导电颗粒和（d）核 - 壳结构橡胶。 该组合物还包含0.01-5重量％的溶剂。 环氧树脂是具有分子量为300以上的脂肪族，脂环族，芳香族环状或直链状的主链的分子，是分子内具有至少2个缩水甘油基的多官能环氧树脂。 潜伏性硬化剂是一种粉状硬化剂或胶囊状硬化剂。
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Patent Agency Ranking
公开(公告)号：KR100832677B1
公开(公告)日：2008-05-27
申请号：KR1020060102989
申请日：2006-10-23
Applicant: 제일모직주식회사
IPC: C09J175/04 , C09J133/08 , C09J133/06 , C09J9/02
Abstract: 본 발명은 평균 분자량(Mw)이 약 10,000내지 1,000,000인 폴리우레탄 및 그 변성수지와 평균 분자량(Mw)이 약 100 내지 100,000인 인덴 수지 및 그 공중합체를 바인더부의 성분으로 포함하는 (메타)아크릴레이트 타입의 고신뢰성 이방 전도성 필름용 조성물에 관한 것으로, 이를 이용하여 필름을 제조하면, 우수한 초기 접착력, 낮은 접속 저항 및 고온 고습 조건 하에서도 높은 신뢰성을 발현할 수 있어 생산성을 향상시킬 수 있고, 최종 제품에 대한 신뢰성 또한 증가시킬 수 있다.
이방 전도성 필름, 우레탄 수지, 인덴 수지, 접착력, 고신뢰성, 접속 저항-
公开(公告)号：KR1020080037387A
公开(公告)日：2008-04-30
申请号：KR1020060104450
申请日：2006-10-26
Applicant: 제일모직주식회사
IPC: C09J183/04 , C09J183/00 , C09J163/00 , C09J7/00
CPC classification number: B32B7/12 , B32B27/38 , C08G59/621 , C08G59/68 , C09J163/00 , Y10T428/25 , Y10T428/28 , Y10T428/2848 , Y10T428/31511
Abstract: An adhesive film composition for assembling a semiconductor, an adhesive film formed by using the composition, and a dicing die bond film containing the adhesive film are provided to improve reliance and the storage stability for a long time. An adhesive film composition for assembling a semiconductor comprises 5-60 wt% of an elastomer resin having a total hydroxyl group, a carboxyl group or an epoxy group; 5-60 wt% of a film forming resin having a glass transition temperature of 0-200 deg.C; 5-40 wt% of an epoxy resin; 5-40 wt% of a phenolic resin represented by the formula 1; 0.01-10 wt% of a curing accelerator; 0.01-10 wt% of a silane coupling agent; and 3-60 wt% of a filler, wherein R1 and R2 are independently a C1-C4 alkyl group or H; a and b are 0-4; and n is an integer of 0-7.
Abstract translation: 提供用于组装半导体的粘合膜组合物，使用该组合物形成的粘合膜以及含有粘合膜的切割模接合膜，以提高长时间的依赖性和储存稳定性。 用于组装半导体的粘合膜组合物包含5-60重量％的具有总羟基，羧基或环氧基的弹性体树脂; 5-60重量％的玻璃化转变温度为0-200℃的成膜树脂; 5-40重量％的环氧树脂; 5-40重量％的由式1表示的酚醛树脂; 0.01〜10重量％的固化促进剂; 0.01-10重量％的硅烷偶联剂; 和3-60重量％的填料，其中R1和R2独立地为C1-C4烷基或H; a和b为0-4; n为0〜7的整数。
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公开(公告)号：KR1020080023638A
公开(公告)日：2008-03-14
申请号：KR1020070090009
申请日：2007-09-05
Applicant: 제일모직주식회사
IPC: C09J163/00 , C09J175/04 , C09J7/00
CPC classification number: H01L2224/2919 , H01L2924/01012 , H01L2924/01013 , H01L2924/0104 , H01L2924/01051 , H01L2924/0665 , H01L2924/00
Abstract: An adhesive film composition for assembling a semiconductor is provided to improve the tensile strength of a film, thereby enhancing the reliance and processability of a semiconductor. An adhesive film composition for assembling a semiconductor comprises 100 parts by weight of an elastomer resin containing a hydroxyl group or a carboxyl group and an epoxy group; 10-60 parts by weight of a film forming resin having a glass transition temperature (Tg) of -10 to 200 deg.C; 10-60 parts by weight of an epoxy-based resin; 5-30 parts by weight of a phenolic curing agent; 0.01-5 parts by weight of a curing catalyst; 0.01-30 parts by weight of a pre-curing additive; 0.01-10 parts by weight of a silane coupling agent; 0.1-60 parts by weight of a filler; and optionally organic solvent.
Abstract translation: 提供用于组装半导体的粘合膜组合物以提高膜的拉伸强度，从而提高半导体的依赖性和加工性。 用于组装半导体的粘合膜组合物包含100重量份的包含羟基或羧基和环氧基的弹性体树脂; 10-60重量份玻璃化转变温度（Tg）为-10-200℃的成膜树脂; 10-60重量份的环氧类树脂; 5-30重量份酚类固化剂; 0.01-5重量份固化催化剂; 0.01-30重量份的预固化添加剂; 0.01-10重量份的硅烷偶联剂; 0.1-60重量份填料; 和任选的有机溶剂。
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公开(公告)号：KR100776133B1
公开(公告)日：2007-11-15
申请号：KR1020070001348
申请日：2007-01-05
Applicant: 제일모직주식회사
Abstract: An electrode composition for off-set printing is provided to allow formation of a micropattern, thereby permitting fabrication of a plasma display panel with high cost efficiency by decreasing the use of silver. An electrode composition for off-set printing comprises a conductive material, an organic binder, glass frit and a solvent, wherein the organic binder includes a polymer having a glass transition temperature of -40 to -5 deg.C and a polyvinyl pyrrolidone-vinyl acetate copolymer. Particularly, the electrode composition comprises: 50-80 wt% of a conductive material; 1-20 wt% of a polymer having a glass transition temperature of -40 to -5 deg.C; 1-15 wt% of a polyvinyl pyrrolidone-vinyl acetate copolymer; and 2-15 wt% of glass frit.
Abstract translation: 提供用于偏移印刷的电极组合物以形成微图案，从而通过减少使用银而制造具有高成本效率的等离子体显示面板。 用于偏移印刷的电极组合物包括导电材料，有机粘合剂，玻璃料和溶剂，其中有机粘合剂包括玻璃化转变温度为-40至-5℃的聚合物和聚乙烯吡咯烷酮 - 乙烯基 乙酸酯共聚物。 特别地，电极组合物包含：50-80重量％的导电材料; 1-20重量％的玻璃化转变温度为-40至-5℃的聚合物; 1-15重量％的聚乙烯吡咯烷酮 - 乙酸乙烯酯共聚物; 和2-15重量％的玻璃料。
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公开(公告)号：KR100773634B1
公开(公告)日：2007-11-05
申请号：KR1020060104448
申请日：2006-10-26
Applicant: 제일모직주식회사
IPC: C09J133/06 , C09J133/08 , C09J133/10
CPC classification number: C09J133/02 , C08L1/02 , C08L2312/06 , C08L2666/26
Abstract: A radiation curing pressure sensitive adhesive composition and a pressure sensitive adhesive tape comprising the composition are provided to improve initial adhesive strength and to obtain excellent releasing property even after the radiation curing with UV rays of a low energy. A radiation curing pressure sensitive adhesive composition comprises 35-65 wt% of an acrylic binder composition which comprises a copolymer of a cellulose-based compound and an acrylic monomer; 25-60 wt% of an acrylate oligomer compound; 1-20 wt% of a curing agent; and 1-5 wt% of a photoinitiator. Preferably the copolymer comprises 5-20 wt% of a cellulose-based compound and 70-95 wt% of an acrylic monomer, and the cellulose-based compound contains 2-30 wt% of acetyl and has a hydroxyl number of 20-150, a glass transition temperature of 85-130 deg.C and a weight average molecular weight of 1,200-70,000.
Abstract translation: 提供辐射固化压敏粘合剂组合物和包含该组合物的压敏粘合带以提高初始粘合强度，并且甚至在用低能量的紫外线辐射固化后也获得优异的脱模性能。 辐射固化压敏粘合剂组合物包含35-65重量％的丙烯酸粘合剂组合物，其包含纤维素基化合物和丙烯酸单体的共聚物; 25-60重量％的丙烯酸酯低聚物化合物; 1-20重量％的固化剂; 和1-5重量％的光引发剂。 优选地，共聚物包含5-20重量％的纤维素类化合物和70-95重量％的丙烯酸单体，纤维素类化合物含有2-30重量％的乙酰基，羟值为20-150， 玻璃化转变温度为85-130摄氏度，重均分子量为1,200-70,000。
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