公开(公告)号：DE102010000400A1

公开(公告)日：2010-08-26

申请号：DE102010000400

申请日：2010-02-12

Applicant: INFINEON TECHNOLOGIES AG

Inventor： THEUSS HORST ,  MEYER-BERG GEORG

IPC: H01L21/98 ,  H01L23/32 ,  H01L25/04

Abstract: Ein Verfahren zum Herstellen eines Arrays von Halbleiterbauelementen (100) umfasst das Bereitstellen eines ersten Trägers (101), der mehrere Chipausrichtungsregionen (102) aufweist. Über den mehreren Chipausrichtungsregionen (102) werden mehrere Chips (104) platziert. Dann richten sich die Chips (104) auf die mehreren Chipausrichtungsregionen (102) aus. Die mehreren Chips (104) werden dann auf einem zweiten Träger (110) platziert. Der erste Träger (101) wird von den mehreren Chips (104) abgelöst. Auf die mehreren Chips (104) wird ein Einkapselungsmaterial (120) aufgebracht, um ein eingekapseltes Array von Halbleiterchips (140) zu bilden. Der zweite Träger (110) wird dann von dem eingekapselten Array von Halbleiterbauelementen (140) abgelöst.

公开(公告)号：DE102009013510A1

公开(公告)日：2009-10-08

申请号：DE102009013510

申请日：2009-03-17

Applicant: INFINEON TECHNOLOGIES AG

Inventor： THEUSS HORST ,  WIETSCHORKE HELMUT

IPC: G01P3/488 ,  B29C43/18 ,  B29C45/14 ,  B29C70/70 ,  G01D5/12 ,  G01D5/16

公开(公告)号：DE102008050063A1

公开(公告)日：2009-04-16

申请号：DE102008050063

申请日：2008-10-01

Applicant: INFINEON TECHNOLOGIES AG

Inventor： THEUSS HORST

IPC: H01L25/065 ,  H01L27/08

Abstract: A chip inductor includes a first substrate and a second substrate. The first substrate includes at least one first conductive strip line having end terminals at a surface of the first substrate and the second substrate includes at least one second conductive strip line having end terminals at a surface of the second substrate, wherein a pitch of the end terminals on the first substrate corresponds to a pitch of the end terminals on the second substrate. Furthermore, conductive studs are provided which connect the end terminals on the first substrate with the end terminals on the second substrate to form an inductor loop.

公开(公告)号：DE102005051332B4

公开(公告)日：2007-08-30

申请号：DE102005051332

申请日：2005-10-25

Applicant: INFINEON TECHNOLOGIES AG

Inventor： THEUSS HORST

IPC: H01L29/04 ,  H01L21/20 ,  H01L21/50 ,  H01L23/498 ,  H01L23/50

Abstract: A semiconductor substrate (8) comprises a monocrystalline material having a crystal structure K; and having areas with an extrinsic, permanent curvature, and the crystal structure K being compressed and/or widened and/or distorted in these areas. The monocrystalline material has a diamond structure, or a zinc blend structure. The monocrystalline material comprises silicon. Independent claims are included for: (1) a semiconductor chip (2); (2) a semiconductor component (1); and (3) a method for production of a semiconductor component.

公开(公告)号：DE102005062344A1

公开(公告)日：2007-07-05

申请号：DE102005062344

申请日：2005-12-23

Applicant: INFINEON TECHNOLOGIES AG

Inventor： THEUSS HORST ,  DANGELMAIER JOCHEN ,  ENGL MARIO

IPC: H01L23/50 ,  H01L21/60 ,  H01L23/66

Abstract: A semiconductor assembly has at least one chip (3), a substrate, contact terminals (4) mounted on the substrate, and first and second sets of one or more contact surfaces (pads) for conducting HF and LF signals respectively. The chip is arranged on the substrate between the pads (5) so that the chip (3) relative to a central position, is offset relative to all the pads (5) and that the bonding wires are shorter for the first set of pads than those of the second set. An independent claim is included for a method for fabricating a semiconductor assembly.

公开(公告)号：DE102006012780B3

公开(公告)日：2007-06-06

申请号：DE102006012780

申请日：2006-03-17

Applicant: INFINEON TECHNOLOGIES AG

Inventor： WIETSCHORKE HELMUT ,  PAULUS STEFAN ,  THEUSS HORST ,  AUBURGER ALBERT ,  GHAHREMANI CYRUS ,  SCHMITT JEAN ,  DANGELMAIER JOCHEN ,  LICHTENEGGER THOMAS

IPC: H01L31/12 ,  G02B6/42 ,  H01L31/0232

Abstract: An optical coupler for interconverting optical and electrical signals comprises a housing (4) with plug connection (5) to a light conductor (6) and a mountable external contact (8) on a conductive film (9). An optical semiconductor chip (12) and an application-specific integrated circuit chip (13) lie on the optical axis (10) and the conductive film has a curved region (14) between the mounting position and external contact that is completely embedded in the housing material so that only the underside contact (25) is accessible. Independent claims are also included for the following: (A) A mobile phone; (B) A digital camera;and (C) A camcorder comprising the above.

公开(公告)号：DE102005040686A1

公开(公告)日：2006-11-16

申请号：DE102005040686

申请日：2005-08-26

Applicant: INFINEON TECHNOLOGIES AG

Inventor： THEUSS HORST ,  DANGELMAIER JOCHEN ,  HIRTREITER JOSEF ,  BLASCHE HAGEN ,  KILGER THOMAS

IPC: H01L23/485 ,  H01L21/60

Abstract: The connector (1) has mesa contact (7) and contact covering (8) formed on the contact area (6) of a semiconductor chip (3) mounted on a circuit board. The mesa contact is formed in a semiconductor chip position corresponding to the contact area of the semiconductor chip. The contact covering may be made of nickel-phosphorus-gold, silver-tin or gold-tin. Discrete semiconductor components (5) are mounted on the semiconductor wafer of the semiconductor chip. Independent claims are included for the following: (a) Semiconductor component; (b) Semiconductor wafer manufacture; (c) Semiconductor chip manufacture; (d) Discrete semiconductor component manufacture; and (e) Connection method.

公开(公告)号：DE10310617B4

公开(公告)日：2006-09-21

申请号：DE10310617

申请日：2003-03-10

Applicant: INFINEON TECHNOLOGIES AG

Inventor： WEBER MICHAEL ,  AUBURGER ALBERT ,  THEUSS HORST ,  DAECHE FRANK ,  EHRLER GUENTER ,  MECKES ANDREAS ,  AIGNER ROBERT

IPC: H01L21/50 ,  H01L23/31 ,  H01L23/495 ,  H03H9/05

Abstract: An electronic device can include a top side with circuit structures. The circuit structures form the bottom region of a cavity. Each cavity can be surrounded by a cavity frame made of plastic and can have a cavity cover made of semiconductor material.

公开(公告)号：DE102005003298A1

公开(公告)日：2006-07-27

申请号：DE102005003298

申请日：2005-01-24

Applicant: INFINEON TECHNOLOGIES AG

Inventor： THEUSS HORST

IPC: H01L23/29 ,  H01L23/66

Abstract: An electronic component for radio frequency applications is surrounded by a housing for protection, wherein the housing is produced from a foamed material.

公开(公告)号：DE102005002707A1

公开(公告)日：2006-07-27

申请号：DE102005002707

申请日：2005-01-19

Applicant: INFINEON TECHNOLOGIES AG

Inventor： THEUSS HORST ,  GUENGERICH VOLKER

IPC: H01L23/50 ,  H01L21/60 ,  H01L23/498 ,  H01L23/64 ,  H05K1/11 ,  H05K3/40

Abstract: The component has a micro connecting unit (3) to provide high frequency coupling of components (5) of the semiconductor component. The unit has a three ply structure with two layers (6, 8) made up of conductive material and a layer (7) made up of insulating material. The layers (6, 8) extend along a common middle line protecting against interfering fields and fixed on contact surface pairs of the components (5). An independent claim is also included for a method for creating an electrical connection between components of a semiconductor component and micro-connection unit.