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公开(公告)号:DE10246101A1
公开(公告)日:2004-04-15
申请号:DE10246101
申请日:2002-10-02
Applicant: INFINEON TECHNOLOGIES AG
Inventor: DAECHE FRANK , WEBER MICHAEL , DANGELMAIER JOCHEN , EHRLER GUENTER , MECKES ANDREAS
Abstract: Production of a housing for a chip with a micro-mechanical structure used in the production of micro-mechanical switches comprises preparing a base having a first photolithographic structurable layer, structuring and further processing. Production of a housing for a chip with a micro-mechanical structure (22) comprises preparing a first base having a first photolithographic structurable layer, structuring the first layer to form a lid for the micro-mechanical structure, preparing a chip with the micro-mechanical structure arranged on a main surface of the chip between first contact elements, applying a second photolithographic structurable layer (28) on a partial region of the main surface of the chip, structuring the second layer to form a recess (32) surrounded by a wall (30) in the second layer and to expose the contact elements, joining the first base and the chip, removing the first base to obtain a chip with a hollow chamber, joining the second base and the chip so that the first contact elements are connected to the second base via a conducting structure, and removing the second base to expose the conducting structure.
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公开(公告)号:DE10310617B4
公开(公告)日:2006-09-21
申请号:DE10310617
申请日:2003-03-10
Applicant: INFINEON TECHNOLOGIES AG
Inventor: WEBER MICHAEL , AUBURGER ALBERT , THEUSS HORST , DAECHE FRANK , EHRLER GUENTER , MECKES ANDREAS , AIGNER ROBERT
IPC: H01L21/50 , H01L23/31 , H01L23/495 , H03H9/05
Abstract: An electronic device can include a top side with circuit structures. The circuit structures form the bottom region of a cavity. Each cavity can be surrounded by a cavity frame made of plastic and can have a cavity cover made of semiconductor material.
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公开(公告)号:DE59810039D1
公开(公告)日:2003-12-04
申请号:DE59810039
申请日:1998-08-14
Applicant: INFINEON TECHNOLOGIES AG
Inventor: BEVER THOMAS , SCHMITT STEPHAN , EHRLER GUENTER
Abstract: The invention relates to a semiconductor detector with a base structure (4) and at least one deformable body (8), wherein the deformable body (8) consists of a semiconductor substrate which is doped with a dopant displaying a first type of conductivity. Piezo resistors (14) doped with a dopant displaying an opposite type of conductivity are located in the deformable body (8). The deformable body (8) is in contact with a medium in at least one partial area. The inventive semiconductor detector is characterized in that the partial area has a dopant concentration that is lower than the dopant concentration in the area located between said partial area and the piezo resistor (14).
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公开(公告)号:DE10246101B4
公开(公告)日:2005-12-01
申请号:DE10246101
申请日:2002-10-02
Applicant: INFINEON TECHNOLOGIES AG
Inventor: DAECHE FRANK , WEBER MICHAEL , DANGELMAIER JOCHEN , EHRLER GUENTER , MECKES ANDREAS
Abstract: Production of a housing for a chip with a micro-mechanical structure used in the production of micro-mechanical switches comprises preparing a base having a first photolithographic structurable layer, structuring and further processing. Production of a housing for a chip with a micro-mechanical structure (22) comprises preparing a first base having a first photolithographic structurable layer, structuring the first layer to form a lid for the micro-mechanical structure, preparing a chip with the micro-mechanical structure arranged on a main surface of the chip between first contact elements, applying a second photolithographic structurable layer (28) on a partial region of the main surface of the chip, structuring the second layer to form a recess (32) surrounded by a wall (30) in the second layer and to expose the contact elements, joining the first base and the chip, removing the first base to obtain a chip with a hollow chamber, joining the second base and the chip so that the first contact elements are connected to the second base via a conducting structure, and removing the second base to expose the conducting structure.
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公开(公告)号:DE10310617A1
公开(公告)日:2004-09-30
申请号:DE10310617
申请日:2003-03-10
Applicant: INFINEON TECHNOLOGIES AG
Inventor: WEBER MICHAEL , AUBURGER ALBERT , THEUSS HORST , DAECHE FRANK , EHRLER GUENTER , MECKES ANDREAS , AIGNER ROBERT
IPC: H01L23/31 , H01L23/495 , H03H9/05 , H01L21/50
Abstract: An electronic device can include a top side with circuit structures. The circuit structures form the bottom region of a cavity. Each cavity can be surrounded by a cavity frame made of plastic and can have a cavity cover made of semiconductor material.
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公开(公告)号:DE10155927A1
公开(公告)日:2003-06-05
申请号:DE10155927
申请日:2001-11-14
Applicant: INFINEON TECHNOLOGIES AG
Inventor: TIMME HANS-JOERG , NIKLAS ALFRED , AIGNER ROBERT , MECKES ANDREAS , ELBRECHT LUEDER , NESSLER WINFRIED , EHRLER GUENTER
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