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    Apparatus and Methods for Growing Nanofibres and Nanotips
    31.
    发明申请
    Apparatus and Methods for Growing Nanofibres and Nanotips 审中-公开
    用于生长纳米纤维和纳米线的装置和方法

    公开(公告)号：US20090078561A1

    公开(公告)日：2009-03-26

    申请号：US12179699

    申请日：2008-07-25

    Applicant: Kenneth Boh Khin Teo ,  Torquil Wells ,  William Ireland Milne ,  Mark Mann ,  Mohamed Mochtar El Gomati

    Inventor： Kenneth Boh Khin Teo ,  Torquil Wells ,  William Ireland Milne ,  Mark Mann ,  Mohamed Mochtar El Gomati

    IPC: C01B31/00 ,  H05B1/00 ,  B01J19/08

    CPC classification number: G01Q70/12 ,  H01J1/3044 ,  H01J9/025 ,  H01J37/073 ,  H01J37/20 ,  H01J37/32009 ,  H01J2201/30415 ,  H01J2201/3043 ,  H01J2237/06316 ,  H01J2237/2001 ,  H01J2237/28

    Abstract: This invention relates to heating apparatus and methods with particular applications for growing a nanofibre, and to nanotips fabricated by such methods and apparatus. Embodiments of the invention can be implemented to provide nanotips for electron gun sources and scanning probe microscopy. A nanotip fabrication apparatus includes a heater for heating an object in the presence of an electric field. The heater comprises: a substantially planar electrically conductive heating element configured to define at least one aperture; a support to mount the heated object such that it protrudes through said aperture; and at least one electrical connection to said heating element. In use, the heating element can be biased by said at least one electrical connection such that the electric field in the vicinity of the object is substantially perpendicular to the plane of the element.

    Abstract translation: 本发明涉及具有用于生长纳米纤维的特殊应用的加热装置和方法，以及通过这些方法和装置制造的纳米技术。 本发明的实施例可以实现为电子枪源和扫描探针显微镜提供纳米尖端。 纳米尖端制造装置包括用于在存在电场的情况下加热物体的加热器。 加热器包括：基本上平面的导电加热元件，其被配置为限定至少一个孔; 用于安装加热物体使得其穿过所述孔突出的支撑件; 以及与所述加热元件的至少一个电连接。 在使用中，加热元件可以被所述至少一个电连接偏压，使得物体附近的电场基本上垂直于元件的平面。

    TWO-WAFER MEMS IONIZATION DEVICE
    33.
    发明申请
    TWO-WAFER MEMS IONIZATION DEVICE 审中-公开
    双波长MEMS离子化装置

    公开(公告)号：WO2013101716A1

    公开(公告)日：2013-07-04

    申请号：PCT/US2012/071176

    申请日：2012-12-21

    Applicant: UTC FIRE & SECURITY CORPORATION ,  MANTESE, Joseph V. ,  VINCITORE, Antonio M.

    Inventor： MANTESE, Joseph V. ,  VINCITORE, Antonio M.

    IPC: H01J33/02 ,  H01J1/304 ,  H01J9/02 ,  G08B17/11

    CPC classification number: H01J33/02 ,  G08B17/11 ,  H01J1/3044 ,  H01J9/025 ,  H01J2201/30415 ,  H01J2201/3048

    Abstract: A micro-electromechanical system (MEMS) assembly includes at least one emission source; a top wafer having a plurality of side walls and a generally horizontal portion, the horizontal portion having a thickness between a first side and a directly opposed second side, at least one window in the horizontal portion extending between the first and second sides and a transmission membrane across the at least one window; and a bottom wafer having a first portion with a first substantially planar surface, an intermediate surface directly opposed to the first substantially planar surface, a second portion with a second substantially planar surface, the at least one emission source provided on the second substantially planar surface; where the top wafer bonds to the bottom wafer at the intermediate surface and encloses a cavity within the top wafer and the bottom wafer.

    Abstract translation: 微机电系统（MEMS）组件包括至少一个发射源; 具有多个侧壁和大致水平部分的顶部晶片，所述水平部分具有在第一侧和直接相对的第二侧之间的厚度，所述水平部分中的至少一个窗口在所述第一侧和第二侧之间延伸， 膜穿过至少一个窗口; 以及底部晶片，其具有第一部分和第二基本上平坦的表面，与所述第一基本上平坦的表面直接相对的中间表面，具有第二基本平坦表面的第二部分，所述至少一个发射源设置在所述第二基本上平坦的表面上 ; 其中顶部晶片在中间表面处接合到底部晶片并且在顶部晶片和底部晶片内包围空腔。

    粒子源及其制造方法
    35.
    发明申请
    粒子源及其制造方法 审中-公开

    公开(公告)号：WO2012174993A1

    公开(公告)日：2012-12-27

    申请号：PCT/CN2012/076827

    申请日：2012-06-13

    Applicant: 中国电子科技集团公司第三十八研究所 ,  刘华荣

    Inventor： 刘华荣

    IPC: H01J37/04

    CPC classification number: C23F4/02 ,  B82Y99/00 ,  H01J1/00 ,  H01J1/3044 ,  H01J9/025 ,  H01J27/26 ,  H01J37/04 ,  H01J37/06 ,  H01J37/073 ,  H01J37/08 ,  H01J2201/30415 ,  H01J2237/0807

    Abstract: 一种用于制造粒子源（100）的方法，包括：将金属丝置于真空环境中并通入活性气体和催化气体，对金属丝的温度进行调节，并对金属丝施加正高压V，使得金属丝表面的活性气体离解，在金属丝头部侧面产生刻蚀带，在该刻蚀带内发生场致刻蚀；场致刻蚀使得金属丝头部顶端处表面电场增强，直到大于金属丝材料的场致蒸发电场，使得此处的金属原子被蒸发出去；在场致刻蚀触发了场致蒸发之后，这两种机制相互调节直到金属丝头部形状变成了由底座（120）和底座（120）上的针尖（110）组成，其中场致刻蚀发生在侧面，形成了底座（120），而场致蒸发发生在顶端，形成了针尖（110）；以及当获得具有预定形状的金属丝头部时，停止场致刻蚀和场致蒸发。

    FIELD EMISSION ARRAY HAVING CARBON MICROSTRUCTURE AND METHOD OF MANUFACTURING THE SAME
    36.
    发明申请
    FIELD EMISSION ARRAY HAVING CARBON MICROSTRUCTURE AND METHOD OF MANUFACTURING THE SAME 审中-公开
    具有碳微结构的场发射阵列及其制造方法

    公开(公告)号：WO2010002046A1

    公开(公告)日：2010-01-07

    申请号：PCT/KR2008/003874

    申请日：2008-07-01

    Applicant: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY ,  LEE, Seung Seob ,  LEE, Seok Woo ,  LEE, Jung A

    Inventor： LEE, Seung Seob ,  LEE, Seok Woo ,  LEE, Jung A

    IPC: H01J1/30

    CPC classification number: H01J1/3044 ,  H01J3/022 ,  H01J9/025 ,  H01J31/127 ,  H01J63/02 ,  H01J2201/30415 ,  H01J2201/30453 ,  H01J2203/0228 ,  H01J2329/0418 ,  H01J2329/0444 ,  H01J2329/4626

    Abstract: Provided is a method for manufacturing a field emission array with a carbon microstructure, The method includes: a photomask attachment step of attaching a photomask with a pattern groove to one surface of a transparent substrate; a photoresist attachment step of attaching a negative photoresist to one surface of the photomask; an exposure step of irradiating light toward the opposite surface of the transparent substrate from the photomask to cure a portion of the negative photoresist with the light irradiated on the negative photoresist through the pattern groove; a developing step of removing an uncured portion of the negative photoresist while leaving the cured portion of the negative photoresist as a microstructure; a pyrolysis step of heating and carbonizing the microstructure thus obtained; and a cathode attachment step of attaching a voltage- supplying cathode to the surface of the transparent substrate on which the microstructure is formed.

    Abstract translation: 本发明提供一种具有碳微观结构的场致发射阵列的制造方法。该方法包括：将具有图案槽的光掩模附着在透明基板的一个表面上的光掩模附着工序; 将负性光致抗蚀剂附着到光掩模的一个表面的光致抗蚀剂附着步骤; 曝光步骤，从所述光掩模向所述透明基板的相对表面照射光，以通过所述图案凹槽照射在所述负性光致抗蚀剂上的光来固化所述负性光致抗蚀剂的一部分; 去除负性光致抗蚀剂的未固化部分同时留下负性光致抗蚀剂的固化部分作为微结构的显影步骤; 对由此获得的微结构进行加热和碳化的热解步骤; 以及将电压供给阴极附接到其上形成微结构的透明基板的表面的阴极附着步骤。

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