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公开(公告)号：US20240215167A1
公开(公告)日：2024-06-27
申请号：US18145066
申请日：2022-12-22
Applicant: Garrett Transportation I Inc
Inventor： Valeriy Fedorikhin
CPC classification number: H05K1/18 , H05K3/3447 , H01L25/115 , H05K2201/10166 , H05K2201/10606 , H05K2201/10757 , H05K2201/10901
Abstract: An electric vehicle thermal management system for compressing a low pressure refrigerant with a centrifugal compressor to generate a high pressure refrigerant, determining a battery cooling condition, routing one of the low pressure refrigerant and the high pressure refrigerant to the heat exchanger in response to the battery cooling condition, regulating a transfer of heat between the refrigerant loop and the battery cooling loop in response to a temperature of the battery coolant within the battery cooling loop and the battery cooling condition, and regulating the transfer of heat between the battery coolant loop and a cabin coolant loop in response to the HVAC setting and a cabin coolant temperature within the cabin coolant loop.
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公开(公告)号：US11844178B2
公开(公告)日：2023-12-12
申请号：US17325080
申请日：2021-05-19
Inventor： John David Brazzle , Sok Mun Chew
CPC classification number: H05K1/181 , H01F27/29 , H01L23/3121 , H01L25/167 , H05K3/3447 , H01L23/49575 , H05K2201/1003 , H05K2201/10515 , H05K2201/10901
Abstract: An electronic device and a method of forming such an electronic device are disclosed. The electronic device can include an integrated device package and a component. The integrated device package includes a substrate and a package body over the substrate, and a hole formed through the package body to expose a conductive pad of the substrate. The component is mounted over the package body, and includes a component body and a lead extending from the component body through the hole. The lead includes an insulated portion and a distal exposed portion, and the insulated portion includes a conductor and an insulating layer disposed about the conductor, wherein the distal exposed portion is uncovered by the insulating layer such that the conductor is exposed at the distal portion. The electronic device can also include a conductive material that electrically connects the distal exposed portion to the conductive pad of the substrate.
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公开(公告)号：US11785703B2
公开(公告)日：2023-10-10
申请号：US17473093
申请日：2021-09-13
Applicant: Kioxia Corporation
Inventor： Kazuya Nagasawa , Tomoaki Morita , Takahisa Funayama , Norihiro Ishii , Hidenori Tanaka
CPC classification number: H05K1/0203 , H05K1/181 , H05K2201/10015 , H05K2201/10159 , H05K2201/10628 , H05K2201/10901
Abstract: According to one embodiment, a semiconductor storage device includes a board, a first electronic device mounted on the board, at least one second electronic device mounted on the board, and a heat dissipator. At least a portion of the second electronic device overlaps at least one of the board and the first electronic device in a first direction that is a thickness direction of the board. The heat dissipator includes a first member that includes a first portion located between the first electronic device and the second electronic device in the first direction, and a second member that includes a portion located between the first member and the second electronic device in the first direction. The second member is smaller in coefficient of thermal conductivity than the first member.
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公开(公告)号：US20180310409A1
公开(公告)日：2018-10-25
申请号：US15841324
申请日：2017-12-14
Applicant: BOSJOB COMPANY LTD.
Inventor： Liang-huan WENG , Min-hsiang WENG
CPC classification number: H05K1/18 , B23K9/1006 , H05K1/0263 , H05K1/144 , H05K2201/09227 , H05K2201/10015 , H05K2201/10166 , H05K2201/10189 , H05K2201/10303 , H05K2201/10333 , H05K2201/10522 , H05K2201/10651 , H05K2201/10901
Abstract: A stacked output structure of a capacitive power supply for welding equipment, having a plurality of capacitors to be connected in parallel, two electrodes of each capacitor are respectively provided with a pin including a long pin and a short pin; at least two PCB bus plates placed in stack are provided above the capacitor is provided. A lower PCB bus plate is connected with the short pin; and a pass-through hole is provided, at a position corresponds to the long pin, on the lower PCB bus plate. The long pin passes through the pass-through hole in the lower PCB bus plate and is connected with an upper PCB bus plate. There is a gap between the long pin and an inner wall of the pass-through hole.
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35.发明申请公开(公告)号：US20180263121A1
公开(公告)日：2018-09-13
申请号：US15913094
申请日：2018-03-06
Applicant: BorgWarner Ludwigsburg GmbH
Inventor： Sisay Tadele , Helmut Hoppe , Alexander Dauth , Gerd Bräuchle
IPC: H05K3/30
CPC classification number: H05K3/306 , H01G2/06 , H01G2/106 , H01G9/06 , H01G9/08 , H01G9/26 , H05K1/18 , H05K3/301 , H05K3/3447 , H05K2201/09027 , H05K2201/10015 , H05K2201/1003 , H05K2201/10265 , H05K2201/10272 , H05K2201/10522 , H05K2201/10606 , H05K2201/10628 , H05K2201/10651 , H05K2201/10901 , H05K2201/2018 , H05K2201/2045
Abstract: What is described is a mounting aid for mounting electrical components, in particular electrolytic capacitors or chokes, on a printed circuit board, said mounting aid comprising a body, which has compartments for receiving the electrical components, wherein the compartments have a base with openings for the insertion of connection wires of the electrical components, and metal parts fastened to the body, which metal parts each form at least one contact pin on the underside of the body and each from a busbar for connection to electrical components in a plurality of compartments of the body.
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Patent Agency Ranking
36.发明申请公开(公告)号：US20180242454A1
公开(公告)日：2018-08-23
申请号：US15900031
申请日：2018-02-20
Applicant: LG CHEM, LTD.
Inventor： Jin Oh Yang , Suk Jin Song , Young Su Son , Jae Young Jang
CPC classification number: H05K1/18 , H05K1/0204 , H05K1/111 , H05K3/3405 , H05K3/3421 , H05K3/3447 , H05K3/4015 , H05K2201/09072 , H05K2201/10037 , H05K2201/10901
Abstract: The present disclosure relates to a printed circuit board connected to a battery, and more particularly, to a printed circuit board having an improved structure connected to an electrode led out from a battery.
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公开(公告)号：US20170149155A1
公开(公告)日：2017-05-25
申请号：US14952242
申请日：2015-11-25
Applicant: MERCURY SYSTEMS, INC.
Inventor： Darryl J. MCKENNEY , Absu METHRATTA , Erica OUELLETTE
CPC classification number: H01R12/58 , H01R4/028 , H01R12/00 , H01R12/526 , H01R12/714 , H01R12/716 , H01R13/05 , H01R13/405 , H01R13/652 , H05K1/0213 , H05K1/0237 , H05K1/0298 , H05K1/11 , H05K1/111 , H05K1/112 , H05K1/115 , H05K1/181 , H05K1/184 , H05K3/308 , H05K3/34 , H05K3/3421 , H05K3/42 , H05K3/421 , H05K2201/09472 , H05K2201/09509 , H05K2201/09545 , H05K2201/09827 , H05K2201/10098 , H05K2201/10189 , H05K2201/10295 , H05K2201/1078 , H05K2201/10803 , H05K2201/10871 , H05K2201/10878 , H05K2201/10901 , H05K2203/0455 , Y02P70/611
Abstract: According to exemplary embodiments, a tapered surface interconnect is formed on a printed circuit board (PCB). A compliant pin of an electrical connector may be coupled to the tapered surface interconnect and soldered thereto. The surface interconnect may be formed by drilling through one or more layers of the PCB. The depth of the surface interconnect may be shorter than a height or a thickness of the PCB. The surface interconnect may have a tapered side wall to allow for a better fit with a tapered compliant pin. The inclination of the side wall of the surface interconnect may be linear or concave. The intersection between the tapered sidewall and the bottom of the surface interconnect may be rounded to minimize pin insertion issues and may allow for easier solder flux evacuation from the surface interconnect during the soldering process. The compliant pin may be soldered into place upon being coupled to the tapered surface interconnect.
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公开(公告)号：US20150282295A1
公开(公告)日：2015-10-01
申请号：US14626936
申请日：2015-02-20
Inventor： TAKASHI MATSUMOTO , TETSUYOSHI OGURA , DAISUKE WAKUDA
CPC classification number: H05K1/028 , H05K1/0283 , H05K1/115 , H05K1/181 , H05K1/189 , H05K3/0044 , H05K3/14 , H05K3/16 , H05K2201/055 , H05K2201/09063 , H05K2201/09081 , H05K2201/09854 , H05K2201/10083 , H05K2201/10151 , H05K2201/10901 , Y10T29/49162
Abstract: An elastic flexible substrate including an insulating film base material provided with a wire is provided. In the insulating film base material, a plurality of slits are provided with a predetermined space left therebetween, the insulating film base material has a bellows shape in which the insulating film base material is bent or curved by using the slits as base points, and the slits are deformed when the insulating film base material is stretched.
Abstract translation: 提供一种包括设置有导线的绝缘膜基材的弹性柔性基板。 在绝缘膜基材中，多个狭缝在其间留有预定的空间，绝缘膜基材具有波纹管形状，其中绝缘膜基材通过使用狭缝作为基点而弯曲或弯曲，并且 当绝缘膜基材被拉伸时，狭缝变形。
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公开(公告)号：JP2018534746A
公开(公告)日：2018-11-22
申请号：JP2018524292
申请日：2016-11-10
Applicant: フェニックス コンタクト ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント コンパニー コマンディートゲゼルシャフト , Phoenix Contact GmbH & Co.KG
Inventor： ラルフ ゲスケ
CPC classification number: H01R13/052 , H01R12/585 , H01R12/71 , H01R43/16 , H05K1/184 , H05K2201/10863 , H05K2201/10878 , H05K2201/10901 , H05K2201/10939
Abstract: 本明細書では、プリント回路基板(2)のコンタクトホール(3)内へプラグインコンタクト(1)を差し込むことにより、プリント回路基板(2)に電気的に接触接続するプラグインコンタクト(1)であって、平坦で相互に比較的弾性的な2つの接触脚部(4,5)と、接続領域(6)とを有しており、前記接続領域(6)からは前記2つの接触脚部(4,5)が前記プラグインコンタクト(1)の差し込み方向(E)に延在し、前記プラグインコンタクト(1)は、金属製の平坦な材料から単一部品に打ち抜かれている、プラグインコンタクト(1)が図示され説明される。本発明によるプラグインコンタクト(1)、すなわち、2つの接触脚部(4,5)に隣接する接続領域(6)に切欠部(7)が形成されており、2つの接触脚部(4,5)は、切欠部(7)から始まって自身の自由端部(4a,5a)の方向に相互に拡大する間隔を有しており、2つの接触脚部(4,5)は相対的に相互に拡開された状態を有し、2つの接触脚部(4,5)は共に、プリント回路基板(2)の対応する前記コンタクトホール(3)の直径(D)に等しいかまたはわずかだけ小さい幅(B)を有している、プラグインコンタクトでは、小さな寸法であっても高い接触部垂直抗力が可能となり、それによりこのプラグインコンタクトは、小さな直径のコンタクトホール(3)であっても、接触対向部品との間で良好で永続的な電気的接触接続を保証する。
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公开(公告)号：JP4554873B2
公开(公告)日：2010-09-29
申请号：JP2002118905
申请日：2002-04-22
Applicant: 日本電気株式会社
Inventor： 裕希 百川
CPC classification number: H05K3/3452 , H05K3/301 , H05K3/306 , H05K3/3447 , H05K3/3463 , H05K2201/099 , H05K2201/10568 , H05K2201/10575 , H05K2201/10901 , H05K2201/10909 , H05K2201/2036 , H05K2201/2081 , H05K2203/0182 , H05K2203/0577 , H05K2203/0588 , H05K2203/1189 , H05K2203/1394
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