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公开(公告)号：KR1020170042429A
公开(公告)日：2017-04-19
申请号：KR1020150141754
申请日：2015-10-08
Applicant: 삼성전자주식회사
IPC: H01L23/538
CPC classification number: H01L24/17 , H01L23/562 , H01L24/06 , H01L24/14 , H01L2224/0401 , H01L2224/0903 , H01L2224/09154 , H01L2224/1403 , H01L2224/1703 , H01L2224/17055 , H01L2224/1712 , H01L2924/15311 , H01L2924/3511
Abstract: 본발명의실시예에따라반도체패키지를제공한다. 반도체패키지는기판상에실장되고, 상면및 상기상면에대향하는하면을갖는반도체칩 및상기기판과상기반도체칩을연결하는연결부재들을포함하고, 상기연결부재들은, 상기반도체칩의중앙영역에배치되고크기가서로동일한제 1 연결부재들및 상기반도체칩의가장자리영역에배치되고크기가서로동일한제 2 연결부재들을포함하고, 상기제 1 연결부재들과상기제 2 연결부재들은서로높이가상이하다.
Abstract translation: 根据本发明的实施例提供了一种半导体封装。 一种半导体封装，包括：半导体芯片，安装在基板上并具有与所述上表面相对的顶表面和底表面;以及连接构件，连接所述基板和所述半导体芯片，其中所述连接构件布置在所述半导体芯片的中央区域中 并且，具有彼此相同尺寸的第一连接构件和布置在半导体芯片的边缘区域中并具有相同尺寸的第二连接构件，其中第一连接构件和第二连接构件彼此虚拟 。
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公开(公告)号：KR1020170006749A
公开(公告)日：2017-01-18
申请号：KR1020150097867
申请日：2015-07-09
Applicant: 삼성전자주식회사
IPC: H01L23/495 , H01L23/525
CPC classification number: H01L22/32 , G11C29/1201 , H01L2224/16145 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2924/15311 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
Abstract: 본발명의반도체칩은칩 바디의제1 영역에형성된칩 패드; 상기칩 패드와떨어져서상기칩 바디의제1 영역에형성되고, 상기칩 패드와재배선구조를통하여연결된재배선테스트패드; 및상기칩 바디의제1 영역또는상기칩 바디의제2 영역에형성되고, 상기칩 패드와상기재배선구조를통하여연결된재배선접속패드를포함한다.
Abstract translation: 公开了一种半导体芯片，其包括设置在芯片体的第一区域中的芯片焊盘，布置在芯片体的与芯片焊盘间隔开的第一区域中的再分配布线测试焊盘，并通过再分配布线连接到芯片焊盘 结构，以及设置在芯片体的第一区域或芯片体的第二区域中并且通过再分配布线结构连接到芯片焊盘的再分配布线连接焊盘。
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公开(公告)号：KR1020150125815A
公开(公告)日：2015-11-10
申请号：KR1020140052581
申请日：2014-04-30
Applicant: 삼성전자주식회사
CPC classification number: H01L25/50 , H01L21/3043 , H01L21/30604 , H01L21/561 , H01L21/563 , H01L21/565 , H01L21/76897 , H01L21/76898 , H01L23/00 , H01L23/29 , H01L23/293 , H01L23/31 , H01L23/3128 , H01L23/3135 , H01L23/3178 , H01L23/498 , H01L23/49827 , H01L23/538 , H01L23/5383 , H01L23/5384 , H01L23/5385 , H01L24/03 , H01L24/08 , H01L24/89 , H01L24/94 , H01L24/97 , H01L25/0652 , H01L25/0657 , H01L25/105 , H01L2224/0401 , H01L2224/04105 , H01L2224/0557 , H01L2224/06181 , H01L2224/12105 , H01L2224/16145 , H01L2224/16227 , H01L2224/16235 , H01L2224/17181 , H01L2224/32145 , H01L2224/32225 , H01L2224/73204 , H01L2224/73259 , H01L2224/92125 , H01L2224/92152 , H01L2224/94 , H01L2224/97 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06548 , H01L2225/06565 , H01L2225/06596 , H01L2225/1023 , H01L2225/1058 , H01L2225/107 , H01L2924/1431 , H01L2924/1432 , H01L2924/1436 , H01L2924/15192 , H01L2924/15311 , H01L2924/15331 , H01L2924/18161 , H01L2224/81 , H01L2924/00 , H01L2224/03 , H01L2224/11 , H01L2224/83
Abstract: 본발명의실시예에따른반도체패키지는기판상에적층된반도체칩, 상기반도체칩과상기기판사이를채우고, 상기반도체칩의측면을덮는언더필수지막, 및상기언더필수지막및 상기기판의측면을덮는몰딩막을포함한다.
Abstract translation: 根据本发明的实施例的半导体封装包括堆叠在基板上的半导体芯片，填充在半导体芯片和基板之间并覆盖半导体芯片的侧面的底部填充树脂层和成型层， 覆盖底部填充树脂层和基板的侧面。 本发明提高了半导体封装的可靠性。
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公开(公告)号：KR1020150102365A
公开(公告)日：2015-09-07
申请号：KR1020140024145
申请日：2014-02-28
Applicant: 삼성전자주식회사
CPC classification number: A47L9/2826 , A47L9/009 , A47L9/0477 , A47L9/14 , A47L9/2868 , A47L2201/04
Abstract: 본 발명은 로봇청소기에 관한 것이다.
본 발명의 일 측면은 전방에 형성되는 제1하우징과 제1하우징의 후방에 형성되는 제2하우징을 포함하는 본체, 제1하우징에 설치되며 바닥의 먼지를 쓸어 담도록 구성되는 브러시 유닛, 제2하우징에 설치되며 브러시 유닛으로 유입된 먼지를 저장하도록 구성되는 집진 유닛, 본체를 구동하며 제2하우징에 집진 유닛의 횡방향에 위치하도록 결합되는 구동 유닛, 제2하우징에 설치되며 집진 유닛의 후방에 위치하도록 결합되는 전원 유닛을 포함하는 것을 특징으로 하는 로봇청소기를 제공한다.
본 발명의 실시예에 따르면 집진통의 용량과 배터리의 용량을 늘림과 동시에 로봇청소기의 소형화가 가능하다.Abstract translation: 机器人清洁器技术领域本发明涉及一种机器人清洁器。 根据本发明的一个方面，本发明包括：主体，其具有形成在前侧的第一壳体和形成在第一壳体的后侧上的第二壳体; 安装在所述第一壳体中并且被构造成扫掠地板的刷子单元; 灰尘收集单元，安装在所述第二壳体中，并且构造成存储引入到所述刷单元中的灰尘; 驱动单元，其操作所述主体，所述驱动单元联接成沿着所述集尘单元的水平方向定位到所述第二壳体; 以及安装在第二壳体中的动力单元，其联接以定位在集尘单元的后侧。 根据本发明的实施例，本发明能够提高集尘容器的容量和电池的容量，并且能够最小化。
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公开(公告)号：KR1020140119674A
公开(公告)日：2014-10-10
申请号：KR1020140112193
申请日：2014-08-27
Applicant: 삼성전자주식회사
CPC classification number: A47L9/2805 , A47L9/106 , A47L9/28 , A47L9/2815 , A47L9/30 , A47L2201/00 , A47L2201/024 , A47L2201/028 , A47L2201/04 , A47L2201/06 , A47L9/00 , A47L9/04 , B25J9/16
Abstract: The present invention relates to a robot cleaner, a maintenance station, and a cleaning system having the same. In the cleaning system, dusts gathered in a dust container are floated by the air introduced in through an opening of the robot cleaner, and then discharged through a first opening of the robot cleaner to a second opening of the maintenance station.
Abstract translation: 本发明涉及一种机器人清洁器，维护站以及具有该清洁系统的清洁系统。 在清洁系统中，聚集在灰尘容器中的灰尘被通过机器人清洁器的开口引入的空气浮起，然后通过机器人清洁器的第一开口排出到维护站的第二开口。
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Patent Agency Ranking
公开(公告)号：KR1020140041229A
公开(公告)日：2014-04-04
申请号：KR1020120108315
申请日：2012-09-27
Applicant: 삼성전자주식회사
CPC classification number: A47L9/0477 , A47L9/009 , A47L2201/00
Abstract: The present invention relates to a robot cleaner comprising a robot cleaner main body; a dust suction part arranged on the bottom surface of the main body and in a direction perpendicular to the front side direction of the main body, which is the heading direction thereof; and a guide part arranged at the front side of the dust suction part and capable of guiding dust to the dust suction part, wherein the guide part includes a first guide part arranged at the front side of the dust suction part and adhering to a surface to be cleaned so that the suction efficiency of the dust suction part for small dust can be improved; and a second guide part arranged on the bottom surface of the main body and in an inclined direction, and has a height adhering to the surface from the main body so that the small dust can pass through the lower side of the second guide part and large dust can be sucked into the dust suction part by being guided by the sides of the second guide part. The robot cleaner according to the present invention has a structure for simultaneously sucking the large dust and the small dust so that a dust suction structure can be improved, and, as a result, dust suction efficiency can be increased and cleaning efficiency can be improved.
Abstract translation: 本发明涉及一种机器人清洁器，其包括机器人清洁器主体; 吸尘部件，其设置在主体的底面上，并且沿与主体的前方方向正交的方向，该主体的前进方向; 以及引导部，其布置在所述吸尘部的前侧，并且能够将灰尘引导到所述吸尘部，所述引导部包括布置在所述吸尘部的前侧的第一引导部， 清洁，可以提高小尘埃吸尘部的吸入效率; 以及第二引导部，其布置在主体的底面上并且沿倾斜方向，并且具有从主体附着到表面的高度，使得小的灰尘可以穿过第二引导部的下侧，并且具有大的 灰尘可以通过由第二引导部分的侧面引导而被吸入吸尘部分。 根据本发明的机器人清洁器具有同时吸入大灰尘和小灰尘的结构，从而可以提高吸尘结构，从而可以提高除尘效率并提高清洗效率。
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公开(公告)号：KR1020120112292A
公开(公告)日：2012-10-11
申请号：KR1020120092568
申请日：2012-08-23
Applicant: 삼성전자주식회사
CPC classification number: A47L9/0633 , A47L2201/00
Abstract: PURPOSE: A robot cleaner is provided to ensure improved cleaning performance by preventing an installation failure of blades due to assembly or molding tolerances and blades from floating off the floor. CONSTITUTION: A robot cleaner comprises a main body with an opening, a brush unit installed in the opening, and a blade assembly(82) guiding the dust drawn in by the brush unit. The blade assembly comprises a blade(83) with a contact part which is extended toward the floor and contacts the floor and a maintaining unit which is provided in the rear of the contact part and formed of a different material from the contact part.
Abstract translation: 目的：提供机器人清洁器，以通过防止由于组装或成型公差和叶片浮出地板而造成的叶片安装故障，从而提高清洁性能。 构成：机器人清洁器包括具有开口的主体，安装在开口中的刷子单元和引导由刷子单元吸入的灰尘的叶片组件（82）。 刀片组件包括刀片（83），刀片（83）具有朝向地板延伸并接触地板的接触部分和保持单元，该保持单元设置在接触部件的后部并且由与接触部件不同的材料形成。
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公开(公告)号：KR1020100050642A
公开(公告)日：2010-05-14
申请号：KR1020080109633
申请日：2008-11-06
Applicant: 삼성전자주식회사
Abstract: PURPOSE: A semiconductor device and a method of manufacturing the semiconductor device are provided to improve the reliability by eliminating a bubble included in an insulating layer on a fuse box. CONSTITUTION: A semiconductor structure(110) comprises an input-output pad and a fuse box. A first insulation layer(120) is formed on the semiconductor structure. A first insulation layer exposes an input/output pad and a fuse box to the outside. A rewiring pattern(130) is formed on the first insulation layer. The rewiring pattern is electrically connected to the input/output pad. A second insulation layer(140) is formed on the rewiring pattern, the first insulation layer and the fuse box.
Abstract translation: 目的：提供半导体器件和制造半导体器件的方法，以通过消除保险丝盒上的绝缘层中包含的气泡来提高可靠性。 构成：半导体结构（110）包括输入 - 输出焊盘和熔丝盒。 在半导体结构上形成第一绝缘层（120）。 第一绝缘层将输入/输出焊盘和保险丝盒暴露在外部。 在第一绝缘层上形成重新布线图案（130）。 重新布线图案电连接到输入/输出板。 第二绝缘层（140）形成在重新布线图案，第一绝缘层和保险丝盒上。
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公开(公告)号：KR1020090041988A
公开(公告)日：2009-04-29
申请号：KR1020070107817
申请日：2007-10-25
Applicant: 삼성전자주식회사
IPC: H01L27/00
CPC classification number: H01L25/0657 , H01L24/02 , H01L24/16 , H01L25/50 , H01L2224/0401 , H01L2224/05548 , H01L2224/05567 , H01L2224/13023 , H01L2224/13024 , H01L2224/16112 , H01L2224/16147 , H01L2224/16237 , H01L2224/2518 , H01L2224/81141 , H01L2224/81191 , H01L2224/81365 , H01L2224/81385 , H01L2224/81805 , H01L2225/06513 , H01L2225/06527 , H01L2225/06541 , H01L2924/01006 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/014
Abstract: A manufacturing method of a chip-on-chip semiconductor device is provided to rapidly perform a signal transmission between semiconductor chips by directly connecting a metal wiring of a first wafer to a bump of a second wafer. A first wafer(101) having a metal wiring is prepared. A plurality of discontinuous points(172) is formed on the metal wiring. A second wafer(201) is prepared. A plurality of bumps(140A) corresponding to the discontinuous points is formed on a surface of the first wafer. The first wafer is arranged on the second wafer. The bumps of the second wafer are connected to the discontinuous points of the first wafer. The discontinuous points of the first wafer are formed on a bump pad.
Abstract translation: 提供一种片上芯片半导体器件的制造方法，通过将第一晶片的金属布线直接连接到第二晶片的凸块来快速地执行半导体芯片之间的信号传输。 准备具有金属布线的第一晶片（101）。 在金属布线上形成多个不连续点（172）。 制备第二晶片（201）。 在第一晶片的表面上形成对应于不连续点的多个凸块（140A）。 第一晶片布置在第二晶片上。 第二晶片的凸块连接到第一晶片的不连续点。 第一晶片的不连续点形成在凸块上。
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公开(公告)号：KR1020080105242A
公开(公告)日：2008-12-04
申请号：KR1020070052543
申请日：2007-05-30
Applicant: 삼성전자주식회사
CPC classification number: H01L2224/16 , H01L2224/48095 , H01L2224/4847 , H01L2924/01079 , H01L2924/10253 , H01L2924/15311 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: A chip scale semiconductor package is provided to reduce the height of semiconductor package as same as the planarization layer by reducing the planarization layer arranged between the substrate and the rerouting line of the semiconductor chip. A semiconductor package(900) comprises the substrate(100), the re-ordering wiring(300), the solder ball(400), the insulating layer(500). A semiconductor chip(200) including the integrated circuit and the connection pad(220) for exchanging the electric signal the integrated circuit is fixed. The re-ordering wiring is consecutively arranged along the top of substrate and top of the semiconductor chip. The re-ordering wiring has the wiring step height between the first area positioned on the top of the semiconductor chip and the second part positioned on the top of substrate. The re-ordering wiring is electrically connected with the connection pad. The solder ball comprises the connection part(410), and the connector area(420). The connection part is electrically connected to the re-ordering wiring. The connector area is connected to the connection part and the connector area electrically connects the external signal source and the semiconductor chip. The insulating layer is arranged on the substrate. The insulating layer electrically insulates the semiconductor chip and the re-ordering wiring.
Abstract translation: 提供了一种芯片级半导体封装，通过减少布置在半导体芯片的基板和重新布线之间的平坦化层，来降低与平坦化层相同的半导体封装的高度。 半导体封装（900）包括基板（100），重新排序布线（300），焊球（400），绝缘层（500）。 包括集成电路的半导体芯片（200）和用于将集成电路交换电信号的连接焊盘（220）固定。 重新排序的布线沿着衬底的顶部和半导体芯片的顶部连续布置。 再排序布线具有位于半导体芯片顶部的第一区域和位于基板顶部的第二部分之间的布线步长。 重新排序的接线与连接垫电连接。 焊球包括连接部分（410）和连接器区域（420）。 连接部分电连接到重新订购的布线。 连接器区域连接到连接部分，并且连接器区域电连接外部信号源和半导体芯片。 绝缘层设置在基板上。 绝缘层将半导体芯片和重新排序的布线电绝缘。
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