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公开(公告)号：KR1020100069106A
公开(公告)日：2010-06-24
申请号：KR1020080127693
申请日：2008-12-16
Applicant: 제일모직주식회사
IPC: C08L63/00 , C08K5/54 , C08K5/5445 , H01L23/29
CPC classification number: H01L2924/0002 , H01L2924/00
Abstract: PURPOSE: An epoxy resin composition is provided to enhance the reliability of a semiconductor package by improving adhesive force with all kinds of lead frames and to secure excellent flame retardant property without using a separate flame retardant. CONSTITUTION: An epoxy resin composition for encapsulating a semiconductor device includes an epoxy resin, a hardener, a curing accelerator, inorganic filler, and an adhesive strength improver. The adhesive strength improver is a modified silicone compound which is marked as a chemical formula 1 and includes a maleimide group. In the chemical formula 1, the mean value of n is 10-100.
Abstract translation: 目的：提供一种环氧树脂组合物，通过提高各种引线框架的粘合力，提高半导体封装的可靠性，并且在不使用单独的阻燃剂的情况下确保优异的阻燃性能。 构成：用于封装半导体器件的环氧树脂组合物包括环氧树脂，硬化剂，固化促进剂，无机填料和粘合强度改进剂。 粘合强度改进剂是被标记为化学式1并包括马来酰亚胺基团的改性硅氧烷化合物。 在化学式1中，n的平均值为10-100。
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公开(公告)号：KR100896792B1
公开(公告)日：2009-05-11
申请号：KR1020070128283
申请日：2007-12-11
Applicant: 제일모직주식회사
Abstract: 본 발명은 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용하여 밀봉된 반도체 소자에 관한 것으로, 보다 상세하게는 에폭시수지, 경화제, 경화촉진제, 접착력 향상제, 및 무기 충전제를 포함하는 에폭시 수지 조성물에 있어서, 상기 접착력 향상제로 메타크릴로일-옥시헥실-티오우라실-카르복실레이트(6-methacryloyl-oxyhexyl-2-thiouracil-5-carboxylate)를 사용하여 리드 프레임과의 부착력을 향상시킴으로써 신뢰도가 우수한 반도체 소자를 제공한다.
반도체 소자, 접착력, 메타크릴로일-옥시헥실-티오우라실-카르복실레이트, 부착력, 신뢰도Abstract translation: 更具体地说，本发明涉及包含环氧树脂，固化剂，固化促进剂，粘合改进剂和无机填料的环氧树脂组合物，其中环氧树脂组合物 通过使用6-甲基丙烯酰氧基己基-2-硫尿嘧啶-5-羧酸酯作为粘合强度来提高与引线框的粘合性可以提高可靠性。 的。
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公开(公告)号：KR100797976B1
公开(公告)日：2008-01-24
申请号：KR1020060139237
申请日：2006-12-31
Applicant: 제일모직주식회사
Abstract: An epoxy resin composition for packaging a semiconductor device is provided to reduce the problem of adhesion generated between an epoxy packaging material and a wafer chip, thereby improving reliance. An epoxy resin composition comprises 1-6 wt% of a diglycidyl ether bisphenol modified epoxy resin represented by the formula 1; 2-8 wt% of a polyaromatic epoxy resin represented by the formula 3; 1-5 wt% of a polyaromatic curing agent represented by the formula 4; 0.1-1.5 wt% of a triazine-based resin represented by the formula 6; 0.11-2.1 wt% of a coupling agent represented by X3-Si-CH2-CH2-CH2-O-CH2-R (wherein R is a cyclo epoxy group, an amino group, a methacryl group, or a vinyl group; and X are independently a methoxy group or an ethoxy group); 0.05-1 wt% of a curing accelerator; and 80-90 wt% of an inorganic filler. In the formula 1, R is a hydroxyl group or a methyl group; G is a glycidyl group; and n is an integer of 1-3. In the formulae 3 and 4, R1 and R2 are independently a C1-C4 alkyl group; a is an integer of 0-4; and n is an integer of 1-7.
Abstract translation: 提供一种用于封装半导体器件的环氧树脂组合物，用于减少在环氧树脂封装材料和晶片芯片之间产生的粘附问题，从而提高依赖性。 环氧树脂组合物包含1-6重量％的由式1表示的二缩水甘油醚双酚改性环氧树脂; 2-8重量％由式3表示的多芳族环氧树脂; 1-5重量％由式4表示的多芳族固化剂; 0.1-1.5重量％的由式6表示的三嗪基树脂; 由X3-Si-CH2-CH2-CH2-O-CH2-R（其中R是环氧基，氨基，甲基丙烯酰基或乙烯基）表示的偶联剂的0.11-2.1重量％ 独立地是甲氧基或乙氧基）; 0.05-1重量％的固化促进剂; 和80-90重量％的无机填料。 在式1中，R是羟基或甲基; G是缩水甘油基; n为1-3的整数。 在式3和4中，R 1和R 2独立地为C 1 -C 4烷基; a是0-4的整数; n为1-7的整数。
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公开(公告)号：KR100678686B1
公开(公告)日：2007-02-05
申请号：KR1020050136064
申请日：2005-12-30
Applicant: 제일모직주식회사
Abstract: Provided is an epoxy resin composition for encapsulating semiconductor devices, which shows excellent flame resistance without using a halogen-containing flame retardant, and has improved moldability and reliability characteristics. The epoxy resin composition for encapsulating semiconductor devices comprises an epoxy resin, a curing agent, a flame retardant, a curing accelerant and an inorganic filler. In the composition, the flame retardant includes any one of a sodium borate hydrate represented by the formula of H3BO3*Na2[B4O5(OH)4]*8H2O and an ammonium sulfate-ammonium phosphate-potassium carbonate composite represented by the formula of (NH4)2SO4*K2CO3*NH4H2PO4. The curing accelerant includes an adduct of tertiary phosphine with para-benzoquinone represented by the following formula 3, wherein R is a C1-C4 alkyl group or alkoxy group, and m is an integer of 0-3.
Abstract translation: 本发明提供一种半导体装置密封用环氧树脂组合物，其不使用含卤素阻燃剂而显示优异的阻燃性，并且成型性，可靠性特性得到改善。 用于封装半导体器件的环氧树脂组合物包含环氧树脂，固化剂，阻燃剂，固化促进剂和无机填料。 在该组合物中，阻燃剂包括由式H3BO3·Na2 [B4O5（OH）4]·8H2O表示的硼酸钠水合物和由式（NH4）2·4H2O表示的硫酸铵 - 磷酸铵 - 碳酸钾复合物中的任何一种 ）2 SO 4 *碳酸钾*磷酸二氢铵。 固化促进剂包括由下式3表示的叔膦与对苯醌的加合物，其中R为C1-C4烷基或烷氧基，m为0-3的整数。
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公开(公告)号：KR100652830B1
公开(公告)日：2006-12-01
申请号：KR1020050133632
申请日：2005-12-29
Applicant: 제일모직주식회사
IPC: C08L63/00
Abstract: Provided is an epoxy resin composition for packaging a semiconductor device which is improved in heat impact resistance, crack resistance and adhesion even without using a halogen-based flame retardant and an antimony trioxide-based flame retardant. The epoxy resin composition comprises 0.1-5 wt% of an isocyanate terminated polyurethane prepolymer represented by the formula 1; a polyaromatic epoxy resin represented by the formula 2; and a polyaromatic curing agent represented by the formula 3. In the formula 1, R is H or a methyl group, and n is an integer of 1-10; in the formula 2, R1 and R2 are identical or different each other and are a C1-C4 alkyl group, a is an integer of 1-4, and n has an average number of 1-7; and in the formula 3, R1 and R2 are identical or different each other and are a C1-C4 alkyl group, a is an integer of 1-4, and n has an average number of 1-7.
Abstract translation: 本发明提供即使不使用卤系阻燃剂和三氧化锑系阻燃剂，也能提高耐热冲击性，耐裂纹性和密合性的半导体装置封装用环氧树脂组合物。 该环氧树脂组合物包含0.1-5重量％的由式1表示的异氰酸酯封端的聚氨酯预聚物; 由式2表示的聚芳族环氧树脂; 和由式3表示的聚芳族固化剂。在式1中，R是H或甲基，并且n是1-10的整数; 在式2中，R1和R2彼此相同或不同，并且是C1-C4烷基，a是1-4的整数，并且n具有1-7的平均数; 并且在式3中，R1和R2彼此相同或不同，并且是C1-C4烷基，a是1-4的整数，并且n具有1-7的平均数。
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Patent Agency Ranking
公开(公告)号：KR100611459B1
公开(公告)日：2006-08-09
申请号：KR1020030100376
申请日：2003-12-30
Applicant: 제일모직주식회사
IPC: C08L63/04
Abstract: 본 발명은 반도체 소자 밀봉용 에폭시 수지 조성물에 대한 것으로 보다 상세하게는 인체나 기기에 유해한 할로겐계 난연제 및 인계 난연제를 사용하지 않고, 다방향족 에폭시 수지와 다방향족 경화제를 사용하며, 여기에 무기난연제로서 포스파젠(phosphazene)을 사용하고, 선택적으로 징크보레이트(zinc borate)를 혼합하여 난연성을 달성한 반도체 소자 밀봉용 에폭시 수지 조성물에 관한 것이다.
할로겐 난연제, 인계 난연제, 다방향족 에폭시 수지, 다방향족 경화제, 포스파젠, 징크보레이트Abstract translation: 更具体地说，本发明涉及用于密封半导体器件的环氧树脂组合物，并且更具体地涉及包含聚芳族环氧树脂和聚芳族固化剂的阻燃环氧树脂组合物， 本发明涉及用于封装半导体器件的环氧树脂组合物，其通过混合磷腈和任选的硼酸锌以获得阻燃性而获得。
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公开(公告)号：KR100543092B1
公开(公告)日：2006-01-20
申请号：KR1020020077553
申请日：2002-12-07
Applicant: 제일모직주식회사
IPC: C08L63/00
Abstract: 본 발명은 (1) 커플링제, (2) 에폭시 수지, (3) 경화제, (4) 경화촉진제, (5) 변성 실리콘 오일 또는 실리콘 파우더, 및 (6) 무기 충전제를 포함하는 에폭시 수지 조성물에 있어서, 상기 성분 (1)이 특정 구조를 갖는 올리고머 에폭시 실라놀 커플링제이고, 상기 성분 (6)의 함량이 조성물 전체에 대해 80~90중량%로 고충전된 것을 특징으로 하는 반도체 소자 밀봉용 에폭시 수지 조성물에 관한 것으로, 본 발명의 에폭시 수지 조성물은 금속소지와의 부착특성, 흡습특성, 고온 내크랙특성, 경화특성 및 기계적 특성 등이 우수하여 고신뢰성의 반도체 소자 패키지 성형에 유용하다.
반도체 소자, 패키지, 에폭시 수지, 금속소지, 올리고머 에폭시 실라놀 커플링제, 부착특성, 신뢰성, 성형성-
公开(公告)号：KR1020050006318A
公开(公告)日：2005-01-17
申请号：KR1020030046008
申请日：2003-07-08
Applicant: 제일모직주식회사
IPC: C08L63/00
Abstract: PURPOSE: Provided is an epoxy resin composition for sealing a semiconductor device which is improved in flame retardancy, reliance and formability without using a halogenated flame retardant. CONSTITUTION: The epoxy resin composition comprises 3.5-15 wt% of an epoxy resin; 2-10.5 wt% of a curing agent; 0.5-5 wt% of a nonhalogenated flame retardant; 0.1-0.3 wt% of a curing accelerator; 0.05-1.5 wt% of a modified silicone oil; and 73-90 wt% of an inorganic filler, wherein the resin is a single polyaromatic resin represented by the formula 1 or 2 or their mixture, the curing agent is a polyaromatic curing agent represented by the formula 3, and the nonhalogenated flame retardant is zinc borate represented by 2ZnO·3B2O3·3.5H2O and/or hydrotalcite represented by Mg4·5 Al2(OH)13CO3·3.5H2O, wherein n is a number of 1-7.
Abstract translation: 目的：提供一种用于密封半导体器件的环氧树脂组合物，其在不使用卤化阻燃剂的情况下提高了阻燃性，依赖性和成型性。 构成：环氧树脂组合物含有3.5-15重量％的环氧树脂; 2-10.5重量％的固化剂; 0.5-5重量％的非卤代阻燃剂; 0.1-0.3重量％的固化促进剂; 0.05-1.5重量％的改性硅油; 和73-90重量％的无机填料，其中树脂是由式1或2表示的单一多芳族树脂或它们的混合物，固化剂是由式3表示的多芳族固化剂，非卤化阻燃剂是 由2ZnO·3B2O3·3.5H2O表示的硼酸锌和/或由Mg4·5Al2（OH）13CO3·3.5H2O表示的水滑石，其中n为1-7。
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公开(公告)号：KR100384477B1
公开(公告)日：2003-11-28
申请号：KR1019970071841
申请日：1997-12-22
Applicant: 제일모직주식회사
Abstract: PURPOSE: A liquid epoxy resin composition for semiconductor device package is provided, to improve crack resistance and moldability by using inorganic fillers having different particle sizes. CONSTITUTION: The liquid epoxy resin composition comprises 15-30 wt% of an epoxy resin; 8-15 wt% of a curing agent; 5-20 wt% of a silica with an average particle size of 0.3 micrometers or less as an inorganic filler; 40-50 wt% of a silica with an average particle size of 1-45 micrometers as an inorganic filler; 1-3 wt% of a flame retardant; 1-3 wt% of an inorganic flame retardant; and 1-5.5 wt% of an additive. Preferably the epoxy resin is a naphthalene-based multifunctional liquid epoxy resin; the curing agent is a novolac phenol resin; the flame retardant is a brominated epoxy resin; and the inorganic flame retardant is antimony trioxide.
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公开(公告)号：KR1019990052378A
公开(公告)日：1999-07-05
申请号：KR1019970071841
申请日：1997-12-22
Applicant: 제일모직주식회사
Abstract: 본 발명은 에폭시 수지, 경화제, 경화촉진제, 무기충전제, 난연제, 착색제 및 첨가제로 이루어지는 에폭시 수지 조성물에 있어서, 상기 무기충전제로 실리카를 사용하되 입자크기가 0.3㎛이하인 것을 10 내지 20중량%, 1 내지 45㎛범위의 것을 40 내지 50중량% 사용하는 것을 특징으로 하는 반도체 소자 봉지용 액상 에폭시 수지 조성물에 관한 것으로, 본 발명에 의한 에폭시 수지 조성물을 사용함으로써 반도체 리드사이의 미세한 공간에 무기충전제가 용이하게 침투할 수 있어 반도체 소자의 밀봉시 내크랙성 및 성형성이 우수하게 된다.
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