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    Chip cooling system
    41.
    发明公开
    Chip cooling system 有权
    Chipkühler

    公开(公告)号：EP1768179A2

    公开(公告)日：2007-03-28

    申请号：EP06076682.1

    申请日：2006-09-08

    Applicant: Delphi Technologies, Inc.

    Inventor： Schubert, Peter J. ,  Myers, Bruce A.

    IPC: H01L23/473

    CPC classification number: H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A chip cooling system 10 including a semiconductor device 12 having a bulk region 14, wherein at least one fluid channel 16 extends at least partially through the bulk region 14, the fluid channel 16 having an inlet 18 and an outlet 20, a fluid inlet port 36 in fluid communication with the channel inlet 18, and a fluid outlet port 38 in fluid communication with the channel outlet 20, and a cooling fluid flows from the fluid inlet port 36, through the fluid channel 16 and to the fluid outlet port 38 to cool the bulk region 14.

    Abstract translation: 芯片冷却系统10包括具有主体区域14的半导体器件12，其中至少一个流体通道16至少部分延伸穿过本体区域14，具有入口18和出口20的流体通道16，流体入口 36，其与通道入口18流体连通，以及与通道出口20流体连通的流体出口38，并且冷却流体从流体入口端口36流过流体通道16并流到流体出口38至 冷却散装区域14。

    Vane integration into motor hub to enhance CD cooling
    42.
    发明公开
    Vane integration into motor hub to enhance CD cooling 审中-公开
    Drehtisch mit PropellerfürdieErhöhungderKühlung

    公开(公告)号：EP1760721A2

    公开(公告)日：2007-03-07

    申请号：EP06076603.7

    申请日：2006-08-21

    Applicant: Delphi Technologies, Inc.

    Inventor： Chengalva, Suresh K. ,  Wilson, Scott E. ,  Myers, Bruce A.

    IPC: G11B33/14

    CPC classification number: G11B17/028 ,  G11B17/0282 ,  G11B33/142

    Abstract: The present invention relates to the cooling of electronic components such as CD or DVD players and recorders and the disc or discs within. Specifically, the present invention relates to the internal cooling of a disc playing or recording device and the disc or discs within.

    Abstract translation: 本发明涉及诸如CD或DVD播放器和记录器之类的电子部件和其中的盘或盘的冷却。 具体来说，本发明涉及盘片播放或记录装置的内部冷却以及其内的盘或盘。

    Fluid-cooled Electronic System
    43.
    发明公开
    Fluid-cooled Electronic System 有权
    Flüssigkeitsgekühlteselektronisches系统

    公开(公告)号：EP1739746A2

    公开(公告)日：2007-01-03

    申请号：EP06076224.2

    申请日：2006-06-14

    Applicant: Delphi Technologies, Inc.

    Inventor： Myers, Bruce A. ,  Peugh, Darrel E. ,  Sanftleben, Henry M.

    IPC: H01L23/44

    CPC classification number: H01L23/473 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/09701 ,  H01L2924/16251 ,  H01L2924/00

    Abstract: A fluid-cooled electronic assembly including a base having a fluid inlet and a fluid outlet therein, a cap attached to the base to form a fluid containment chamber therebetween, wherein the fluid containment chamber is in fluid communication with the fluid inlet and the fluid outlet, and an electronic device disposed within the fluid containment chamber and connected to the base, the electronic device having a plurality of microchannels adapted to receive a cooling fluid flow therethrough, wherein the cap is shaped to direct a fluid flow from the fluid inlet to the microchannels such that a pressure drop between the fluid inlet and the fluid outlet is reduced.

    Abstract translation: 一种流体冷却的电子组件，包括其中具有流体入口和流体出口的底座，附接到基座以在其间形成流体容纳室的盖，其中流体容纳室与流体入口和流体出口流体连通 以及设置在所述流体容纳室内并连接到所述基座的电子设备，所述电子设备具有适于接收通过其中的冷却流体流动的多个微通道，其中所述盖被成形为将流体流从所述流体入口引导到 微通道，使得流体入口和流体出口之间的压降降低。

    Electronic assembly with integral thermal transient suppression
    44.
    发明公开
    Electronic assembly with integral thermal transient suppression 审中-公开
    Elektronische Baugruppe mit integrierter thermischerTransientenunterdrückung

    公开(公告)号：EP1703557A2

    公开(公告)日：2006-09-20

    申请号：EP06075528.7

    申请日：2006-03-07

    Applicant: Delphi Technologies, Inc.

    Inventor： Chengalva, Suresh K. ,  Myers, Bruce A. ,  Walsh, Matthew R.

    IPC: H01L23/427 ,  H01L23/373 ,  H01L23/367 ,  H01L23/31

    CPC classification number: H01L23/367 ,  H01L23/3675 ,  H01L23/4275 ,  H01L23/433 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

    Abstract: An electronic assembly (100) with integral thermal transient suppression includes an integrated circuit (IC) chip (106) disposed within a cavity (103) of an IC device package (102). A transient thermal suppression material (TTSM) (110) is disposed in the cavity (103) in thermal contact with the IC chip (106). A heat sink (112) may also be provided in thermal contact with the chip (106). When present, the heat sink (112) serves as a cover of the packaged IC chip (106) and may include fins (112A,112B) extending from an upper surface (in contact with air) and a lower surface (in thermal contact with the TTSM (110)).The TTSM (110) may be thought of as a phase change material that absorbs energy dissipated by the IC chip (106) in a phase change event.

    Abstract translation: 具有整体热瞬变抑制的电子组件（100）包括设置在IC器件封装（102）的空腔（103）内的集成电路（IC）芯片（106）。 瞬时热抑制材料（TTSM）（110）设置在与IC芯片（106）热接触的空腔（103）中。 还可以提供与芯片（106）热接触的散热器（112）。 当存在时，散热器（112）用作封装的IC芯片（106）的盖子，并且可以包括从上表面（与空气接触）和下表面（与空气接触的热表面）延伸的翅片（112A，112B） TTSM（110）），TTSM（110）可以被认为是在相变事件中吸收由IC芯片（106）消耗的能量的相变材料。

    Integrated circuit package with integral leadrame heat dissipator and manufacturing method therefor
    48.
    发明公开
    Integrated circuit package with integral leadrame heat dissipator and manufacturing method therefor 审中-公开
    壳体与集成电路和一个集成引线框架和散热片和其制备方法

    公开(公告)号：EP1526571A2

    公开(公告)日：2005-04-27

    申请号：EP04077853.2

    申请日：2004-10-14

    Applicant: Delphi Technologies, Inc.

    Inventor： Chengalva, Suresh K. ,  Myers, Bruce A.

    IPC: H01L23/495 ,  H01L23/433

    CPC classification number: H01L23/49568 ,  H01L23/36 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/49433 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

    Abstract: An electronic package (10) and packaging method in which integral convective fins are formed of portions of a leadframe (14) from which electrical leads (18) are also formed. The leadframe (14) comprises a base (16) and first and second sets of leads (18,28) extending from the base (16). The first set of leads (18) is separated from the base (16) and from the second set of leads (28), such that each lead of the first set has an interior end adjacent but separate from the base (16), and each lead of the second set has an interior portion that remains attached to the base (16). A circuit device (12) is mounted to the base (16) and electrically connected to the interior ends of the first set of leads (18). The device (12), base (16), and interior ends and portions of the leads are then encased within a housing (26). Exterior ends of the leads remain outside the housing (26) as package (10) terminals and thermal dissipaters.

    Abstract translation: 在其中积分对流散热片形成为从哪个电引线（18）的引线框架（14）的部分的电子封装（10）和封装方法被形成。 引线框架（14）包括基部（16）和从基部（16）延伸出的引线（18,28）的第一和第二组。 第一组导线（18）从基座（16）分离并从第二组引线（28）检测所做的第一组中的每个引线有一个内端相邻而从所述基座（16）分开，并且 所述第二组中的每个引线具有保持附接到所述基部（16）的内部部分。 一种电路装置（12）安装到连接到所述第一组引线（18）的内部端部的基部（16）和电。 的装置（12），基部（16）和内端和引线的部分随后的壳体（26）内包覆。 引线的外端保持在所述壳体（26）包（10）端子和热消散器的外部。

    Thermally-capacitive phase change encapsulant for electronic devices
    49.
    发明公开
    Thermally-capacitive phase change encapsulant for electronic devices 有权
    电子邮件电子邮件

    公开(公告)号：EP1336992A2

    公开(公告)日：2003-08-20

    申请号：EP03075211.7

    申请日：2003-01-23

    Applicant: Delphi Technologies, Inc.

    Inventor： Myers, Bruce A. ,  Chaudhuri, Arun K. ,  Burns, Jeffrey H.

    IPC: H01L23/427

    CPC classification number: H01L23/295 ,  H01L23/29 ,  H01L23/3733 ,  H01L23/4275 ,  H01L2924/0002 ,  Y10T428/2991 ,  Y10T428/2998 ,  Y10T428/31663 ,  H01L2924/00

    Abstract: An encapsulation material (10,20,30) suitable for dissipating heat generated by an electronic module (40,50), such as by directly contacting a heat-generating power device (42) or contacting a heat sink (56) of a heat-generating power device (52). The encapsulation material (10,20,30) comprises phase change particles (14) dispersed in a gel material (12). The phase change particles (14) preferably comprise a solder alloy encapsulated by a dielectric coating (16) so the phase change particles (14) are electrically insulated from each other. The encapsulation material (10,20,30) may further comprise dielectric particles (22) dispersed in the gel material (12) for the purpose of increasing the thermal conductivity of the encapsulation material (10,20,30). Alternatively or in addition, the dielectric coating (16) on the phase change particles (14) may comprise dielectric particles (32) that are dispersed in a dielectric matrix, again with the preferred effect of increasing the thermal conductivity of the encapsulation material (10,20,30).

    Abstract translation: 适合于消散由电子模块（40,50）产生的热量的封装材料（10,20,30），例如通过直接接触发热功率器件（42）或接触热量的散热器（56） - 发电电力装置（52）。 包封材料（10,20,30）包含分散在凝胶材料（12）中的相变颗粒（14）。 相变粒子（14）优选地包括由电介质涂层（16）包封的焊料合金，使得相变粒子（14）彼此电绝缘。 为了增加封装材料（10,20,30）的热导率，封装材料（10,20,30）还可以包含分散在凝胶材料（12）中的介电颗粒（22）。 或者或另外，相变粒子（14）上的电介质涂层（16）可以包括分散在电介质基质中的电介质颗粒（32），再次具有提高封装材料（10）的热导率的优选效果 ，20,30）。

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