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公开(公告)号:ITTO20120614A1
公开(公告)日:2014-01-12
申请号:ITTO20120614
申请日:2012-07-11
Applicant: ST MICROELECTRONICS SRL
Inventor: PACI DARIO , VIGNA BENEDETTO , ZERBINI SARAH
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公开(公告)号:DE602004023082D1
公开(公告)日:2009-10-22
申请号:DE602004023082
申请日:2004-09-22
Applicant: ST MICROELECTRONICS SRL
Inventor: MERASSI ANGELO , ZERBINI SARAH , VIGNA BENEDETTO
IPC: G01P15/125 , G01P15/18
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公开(公告)号:DE69938658D1
公开(公告)日:2008-06-19
申请号:DE69938658
申请日:1999-09-10
Applicant: ST MICROELECTRONICS SRL
Inventor: ZERBINI SARAH , SASSOLINI SIMONE , VIGNA BENEDETTO
IPC: B81B5/00 , B81B3/00 , G01C19/5684 , G01P15/00 , G01P15/08 , G01P15/125 , G01P15/135 , H01L29/84
Abstract: A microelectromechanical structure (40) includes a rotor element (22) having a barycentric axis (G) and suspended regions (25) arranged a distance with respect to the barycentric axis. The rotor element (22) is supported and biased via a suspension structure (30, 45, 49) having a single anchoring portion (49) extending along the barycentric axis (G). The single anchoring portion (49; 73; 92) is integral with a body (41) of semiconductor material on which electric connections (50a) are formed.
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公开(公告)号:DE60030963D1
公开(公告)日:2006-11-09
申请号:DE60030963
申请日:2000-06-06
Applicant: ST MICROELECTRONICS SRL
Inventor: MURARI BRUNO , MASTROMATTEO UBALDO , VIGNA BENEDETTO
IPC: H01L23/58 , H01L23/31 , H01L23/36 , H01L23/373 , H01L23/482
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公开(公告)号:DE69632950D1
公开(公告)日:2004-08-26
申请号:DE69632950
申请日:1996-07-31
Applicant: ST MICROELECTRONICS SRL
Inventor: FORONI MARIO , FERRARI PAOLO , VIGNA BENEDETTO , VILLA FLAVIO
IPC: G01L1/18 , B81B3/00 , B81B7/02 , B81C1/00 , G01L9/00 , G01P15/02 , G01P15/08 , H01L21/306 , H01L21/764 , H01L29/84 , H01L21/00 , H01L21/762
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公开(公告)号:DE69916782D1
公开(公告)日:2004-06-03
申请号:DE69916782
申请日:1999-02-26
Applicant: ST MICROELECTRONICS SRL
Inventor: VIGNA BENEDETTO , MASTROMATTEO UBALDO
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公开(公告)号:DE69726718D1
公开(公告)日:2004-01-22
申请号:DE69726718
申请日:1997-07-31
Applicant: ST MICROELECTRONICS SRL
Inventor: FERRARI PAOLO , VIGNA BENEDETTO , MONTANINI PIETRO , FERRERA MARCO
IPC: G01P9/04 , B81B3/00 , G01C19/56 , G01P15/08 , G01P15/125 , H01L21/762 , H01L21/764 , H01L41/08
Abstract: To increase the sensitivity of the sensor, the movable mass (40) forming the seismic mass is formed starting from the epitaxial layer (13) and is covered by a weighting region of tungsten (26c) which has high density. To manufacture it, buried conductive regions (2) are formed in the substrate (1); then, at the same time, a sacrificial region is formed in the zone where the movable mass is to be formed and oxide insulating regions (9a-9d) are formed on the buried conductive regions (2) so as to cover them partially; the epitaxial layer (13) is then grown, using a nucleus region; a tungsten layer (26) is deposited and defined and, using a silicon carbide layer (31) as mask, the suspended structure (40) is defined; finally the sacrificial region is removed, forming an air gap (38).
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公开(公告)号:DE69724100D1
公开(公告)日:2003-09-18
申请号:DE69724100
申请日:1997-05-28
Applicant: ST MICROELECTRONICS SRL
Inventor: VILLA FLAVIO FRANCESCO , VIGNA BENEDETTO , FERRARI PAOLO
IPC: G01D5/34
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公开(公告)号:DE69627645D1
公开(公告)日:2003-05-28
申请号:DE69627645
申请日:1996-07-31
Applicant: ST MICROELECTRONICS SRL
Inventor: VIGNA BENEDETTO , FERRARI PAOLO , VILLA FLAVIO
Abstract: The pressure sensor is integrated in a SOI (Silicon-on-Insulator) substrate using the insulating layer as a sacrificial layer, which is partly removed by chemical etching to form the diaphragm. To fabricate the sensor, after forming the piezoresistive elements (10) and the electronic components (4, 6-8) integrated in the same chip, trenches (26) are formed in the upper wafer (23) of the substrate and extending from the surface to the layer of insulating material (22); the layer of insulating material (22) is chemically etched through the trenches (26) to form an opening (31) beneath the diaphragm (27); and a dielectric layer (25) is deposited to outwardly close the trenches (26) and the opening (31). Thus, the process is greatly simplified, and numerous packaging problems eliminated.
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公开(公告)号:DE69617674T2
公开(公告)日:2002-08-08
申请号:DE69617674
申请日:1996-09-10
Applicant: ST MICROELECTRONICS SRL
Inventor: VIGNA BENEDETTO , FERRARI PAOLO , MASTROMATTEO UBALDO
Abstract: An acceleration sensor is described which is formed by planar technology on a substrate (10). It includes a core (11) of ferromagnetic material and, coupled conductively together by the core, a first winding (13) adapted to be connected to a power supply (14) and a second winding (15) adapted to be connected to circuit means (16) for measuring an electrical magnitude induced therein. The core (11) has two suspended portions which are free to bend as a result of an inertial force due to an accelerative movement of the sensor itself. The bending causes lengthening of the core (11) and hence a variation in the reluctance of the magnetic circuit. If a constant current is supplied to the first winding (13), a voltage is induced in the second winding (15) as a result of the variation in the magnetic flux caused by the variation in reluctance.
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