STRUCTURE METHOD FOR ELECTRIC POWER DEVICE

    公开(公告)号:JPH09129722A

    公开(公告)日:1997-05-16

    申请号:JP26699796

    申请日:1996-10-08

    Abstract: PROBLEM TO BE SOLVED: To provide an electric power device wherein high yield efficiency is obtained with low ion implantation energy and provided with a deep edge ring by, with the use of a boron and Al as a dopant, forming a deep ring at the same time for the main body of a device in a single thermal process, and further, an oxide layer used during Al ion implantation. SOLUTION: On a heavily doped N type substrate 10, a slightly doped N type epitaxial layer 20 is grown, further, over the upper part of the epitaxial layer 20, an oxide 30 is grown. By photo-etching, an main body is exposed itself in an area 30, and boron 40 is implanted for a p are 42 to be generated. Then, oxide etching is performed, the area for Al ion implantation is made exposed, thus an Al ring is configured. By masking the main body area with a photosensitive material layer, an Al ion 60 is implanted. Then, through a single thermal diffusion process, P /N joint 80 formed through formation of a thermal oxide layer 70 and boron, and one or more P /N joints 90 formed by Al are formed at the same time.

    METHOD AND EQUIPMENT FOR DYNAMIC SELF-BIAS REGION OF INTEGRATED CIRCUIT

    公开(公告)号:JPH08306794A

    公开(公告)日:1996-11-22

    申请号:JP9344496

    申请日:1996-03-22

    Abstract: PROBLEM TO BE SOLVED: To ensure a timely response when the voltage of an isolated region clamped by a switch is rapidly changed by maintaining the isolated region with a reference potential, and instructing the opening of the switch. SOLUTION: When the potential of a region 1 (SUB) is rapidly dropped to a ground potential by capacity coupling, the potential of an isolated region 2 (ISO) is dragged toward a negative voltage value. The dynamic potential movement of the region 2 is detected by a comparator COMP beyond a reference voltage clamped by a switch T, and the switch T is opened by changing the state. The region 2 is turned into a high impedance state against a floating or ground node according to the opening of the switch T, and as a result, the region potential is turned into a free state by capacitive coupling C1 and C2, and the decreased voltage of the substrate region 1 is tracked by presenting a negative voltage value. Thus, the region 2 can be biased to the potential presented by the substrate region 1, and allowed to stay with a negative potential.

    METHOD FOR STORAGE OF MEMBERSHIP FUNCTION AND APPARATUS FOR COMPUTATION OF BELONGINGNESS DEGREE OF ANTECEDENT PART OF FUZZY RULE

    公开(公告)号:JPH08305575A

    公开(公告)日:1996-11-22

    申请号:JP7221496

    申请日:1996-03-27

    Abstract: PROBLEM TO BE SOLVED: To provide a method for storing a membership function for easily and economically deciding the crossing of the membership function with an input. SOLUTION: This method for storing a membership function includes the storing of a position CV in an universe of discourse UdD of the vertex of a triangle normalizing the membership function, and the storing of a first distance LVD between the cross point of the left side of the triangle with the axis of the universe of discourse and the position CV of the vertex. Moreover, this method includes the storing of a second distance RVD between the cross point of the right side of the triangle with the axis of the universe of discourse and the position CV of the vertex. Moreover, in a circuit which calculates the assignment of the data of the antecedent part of a fuzzy rule, an input variable can be made fuzzy by using a geometrical ratio generated among the similar corresponding sides of the triangle normalized by the position of an input value in the universe of discourse.

    SEMICONDUCTOR DEVICE,CONTROL CIRCUIT AND ITS PREPARATION

    公开(公告)号:JPH08274183A

    公开(公告)日:1996-10-18

    申请号:JP28050295

    申请日:1995-10-27

    Abstract: PROBLEM TO BE SOLVED: To remove a layer containing the existence of a parasitic transistor which is not desirable with former constitution, by providing at least one N channel-type MOS transistor stored in a well which is directly brought into contact with an isolation well for a control circuit for semiconductor device, which is formed on a substrate where a first conductivity type dopant is doped. SOLUTION: An integrated circuit is provided with a first epitaxial layer 2 which is grown on a substrate 1 and to which a first conductivity type dopant is doped and the isolation well to which a second conductivity type dopant is doped. The control circuit is provided with at least a first control transistor M1 to which a second conductivity type dopant is doped and which is formed in a first well 8 formed in the isolation well.

    ETCHING METHOD OF COBALT SILICIDE LAYER

    公开(公告)号:JPH08139080A

    公开(公告)日:1996-05-31

    申请号:JP24610495

    申请日:1995-09-25

    Abstract: PROBLEM TO BE SOLVED: To provide a method for etching a cobalt silicide layer for prescribing small shape dimensions. SOLUTION: In a method for etching a cobalt silicide layer 15, that is superposed on a polysilicon layer 14 formed on a silicon substrate 12 and is selectively covered with a mask material 16, the cobalt silicide layer 15 is exposed to a pressure stipulated to a gas nitrogen flow, a gas nitrogen is ionized by using a prescribed power, and a plasma for selectively eliminating the cobalt silicide layer 15 is formed.

    METHOD TO FORM EMBEDDING OXIDIZING ZONE IN SILICON WAFER ANDSEMICONDUCTOR COMPONENT

    公开(公告)号:JPH08111453A

    公开(公告)日:1996-04-30

    申请号:JP24327195

    申请日:1995-09-21

    Abstract: PROBLEM TO BE SOLVED: To form a silicon oxide buried layer in a silicon wafer by a method, wherein a recess is formed in the silicon wafer, and light ions are injected at more shallow depth to form air bubbles, and the light ions are evaporated, and a cavity remains in a place of air bubbles for oxidizing the cavity via the recess. SOLUTION: If helium ions 3 are injected into the entire surface 2 of a silicon wafer 1, helium air bubbles 4 are formed at an average permeation depth of the ions 3. If the silicon wafer 1 is heated at a temperature of 700 deg.C or higher, helium diffuses to the surface 2 and a buried layer which is an empty cavity remains in a place of air bubbles 4. A recess or groove 5 is formed, so that its depth is deeper than the depth that the cavity 4 is installed and is divided into an upper portion 6a and a lower portion 6b. If the silicon wafer 1 is heated in a furnace at a dense oxygen concentration, the buried layer containing the cavity 4 is uniformly oxidized and a buried layer 7 of a silicon oxide can be formed in the silicon wafer 1.

    APPLIED-VOLTAGE FUZZY-CONTROLLING PROCESS FOR INDUCTION MOTOR,AND DEVICE THEREFOR

    公开(公告)号:JPH0866089A

    公开(公告)日:1996-03-08

    申请号:JP16242195

    申请日:1995-06-28

    Abstract: PURPOSE: To improve performance of an applied-voltage fuzzy control process and a usual control system by applying fuzzy control to velocity errors, differen tial coefficient of the velocity error and electric power errors, in order to gener ate the values of a pulse and a voltage which are proper for driving an electric motor. CONSTITUTION: A signal Wref , indicating a reference velocity, is sent to a comparison node 11. The node 11 also receives a signal W indicating a velocity which drives an AC motor. The node 11 is proper for generating a difference Wref -W, i.e., an error EW. The error signal EW is sent to a fuzzy controller 13. At the same time, the error signal EW is sent to a differential circuit 12, which is appropriate for generating a differential coefficient dEW/dt of the error signal EW. The differential coefficient deW/dt is sent to the fuzzy controller 13. A node 16 is appropriate for generating an electric power error signal EP of the fuzzy controller 13.

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