-
公开(公告)号:KR1020090023076A
公开(公告)日:2009-03-04
申请号:KR1020080069152
申请日:2008-07-16
Applicant: 도쿄엘렉트론가부시키가이샤
IPC: H01L21/304 , B08B3/02 , B08B3/08
CPC classification number: H01L21/67051 , H01L21/67028 , H01L21/67034
Abstract: A liquid treatment device, the liquid processing method and the storage media are provided to prevent the strain from being generated in the processed substrate by removing the alkali component within the casing of the liquid treatment device. The liquid treatment device comprises the casing(5), the substrate supporting device(20), the process liquid supply mechanism(30), the drainage cup(12) and drain tube(13). The substrate supporting device maintains the wafer(W). The process liquid supply mechanism comprises the first chemical supply tool and dry solution feed mechanism. The first chemical supply supplies the tool hydrofluoric acid based processing liquid. The dry solution feed mechanism supplies organic solvent for drying. The controller(50) supplies the hydrofluoric acid based processing liquid and controls the dry solution feed mechanism to supply the organic solvent.
Abstract translation: 提供液体处理装置,液体处理方法和存储介质,以通过去除液体处理装置的壳体内的碱成分来防止在处理基板中产生应变。 液体处理装置包括壳体(5),基板支撑装置(20),处理液供给机构(30),排水杯(12)和排水管(13)。 基板支撑装置保持晶片(W)。 工艺液体供给机构包括第一化学品供给工具和干燥溶液进料机构。 第一种化学品供应工具为氢氟酸处理液。 干溶液进料机构提供有机溶剂进行干燥。 控制器(50)供应基于氢氟酸的处理液体并控制干溶液供给机构以供应有机溶剂。
-
公开(公告)号:KR1020080056165A
公开(公告)日:2008-06-20
申请号:KR1020087006814
申请日:2007-10-04
Applicant: 도쿄엘렉트론가부시키가이샤
IPC: H01L21/304
CPC classification number: H01L21/67051 , H01L21/68728
Abstract: Provided is a substrate treating apparatus, which holds a wafer (W) rotatably by a substrate holding portion, which subjects the wafer (W) to a rinsing treatment such that a drainage cup (51) is disposed to enclose the outer side of the wafer (W), by feeding a treating liquid to the wafer (W) while rotating the wafer (W), and which then subjects the wafer (W) to a rinsing treatment by feeding a rinsing liquid to the wafer (W) while rotating the substrate. The rinsing treatment is controlled to execute at first the step of feeding the rinsing liquid while controlling the rotating speed of the wafer (W) to that for the rinsing treatment, the step of raising the liquid level of the rinsing liquid in the drainage cup (51) by decreasing the speed of the wafer (W) or increasing the feed of the rinsing liquid, and the step of increasing the speed of the wafer (W) thereby to raise the arriving position of the rinsing liquid at the outer circumference wall of the drainage cup (51).
Abstract translation: 提供了一种基板处理装置,其通过基板保持部可旋转地保持晶片(W),所述基板保持部使晶片(W)进行漂洗处理,使得布置排液杯(51)以包围晶片的外侧 (W),同时旋转晶片(W)将处理液供给到晶片(W),然后通过在旋转晶片(W)的同时向晶片(W)供给冲洗液体来使晶片(W)进行漂洗处理 基质。 控制冲洗处理,首先执行在将晶片(W)的旋转速度控制到冲洗处理的转速的同时进行冲洗液的步骤,提高排水杯中的冲洗液体的液面的步骤( 通过降低晶片的速度(W)或增加冲洗液的供给,以及提高晶片(W)的速度的步骤,从而提高冲洗液体在外周壁处的到达位置 排水杯(51)。
-
公开(公告)号:KR1020070120032A
公开(公告)日:2007-12-21
申请号:KR1020070057770
申请日:2007-06-13
Applicant: 도쿄엘렉트론가부시키가이샤
IPC: H01L21/02 , H01L21/304
CPC classification number: H01L21/67051 , G03F7/162 , H01L21/6708 , H01L21/6715 , H01L21/68728 , H01L21/68735
Abstract: A liquid process apparatus is provided to rapidly exhaust process liquid from a drain cup by including a spiral stream forming member for inducing the process liquid in a drain cup to a drain hole. A substrate maintenance part(2) horizontally maintains a substrate, capable of rotating together with the substrate. A rotation cup(4) of an annular type surrounds the substrate maintained by the substrate maintenance part, capable of rotating together with the substrate. A rotation unit(3) rotates the rotation cup and the substrate maintenance part together. A liquid supply unit(5) supplies process liquid to the substrate. A drain cup(51) is made of an annular type corresponding to the rotation cup, receiving the process liquid exhausted from the rotation cup and having a drain hole(60) for draining the received process liquid. When the rotation cup and the substrate maintenance part are rotated, a spiral stream forming member(32a) forms a spiral stream in the drain cup and accompanies the process liquid in the drain cup with the spiral stream to induce the process liquid to the drain hole. The spiral stream forming member can be inserted into the drain cup, and the rotation of the rotation cup and substrate maintenance part is accompanied by rotation of the spiral stream forming member.
Abstract translation: 提供一种液体处理装置,用于通过包括用于将排水杯中的处理液体引导到排水孔的螺旋流形成构件来迅速地从排水杯排出处理液。 基板维护部件(2)水平地保持能够与基板一起旋转的基板。 环形旋转杯(4)围绕由衬底维持部保持的基板,能够与衬底一起旋转。 旋转单元(3)将旋转杯和基板维护部分一起旋转。 液体供应单元(5)将处理液体供应到基底。 排水杯(51)由对应于旋转杯的环形制成,接收从旋转杯排出的处理液体并具有用于排出接收到的处理液体的排水孔(60)。 当旋转杯和基板维护部分旋转时,螺旋流形成构件(32a)在排水杯中形成螺旋流,并与排出杯中的处理液体一起用螺旋流引导处理液体到排水孔 。 螺旋流形成构件可以插入到排水杯中,并且旋转杯和基板维护部的旋转伴随着螺旋流形成构件的旋转。
-
公开(公告)号:KR101917889B1
公开(公告)日:2018-11-12
申请号:KR1020130089468
申请日:2013-07-29
Applicant: 도쿄엘렉트론가부시키가이샤
IPC: H01L21/683 , G01B11/00
CPC classification number: H01L22/30 , H01L21/67259 , H01L21/68728 , H01L21/68792 , H01L2924/0002 , H01L2924/00
Abstract: 본발명은, 기판의유지상태를판별하는장치의배치자유도및 유지상태판정의실행시기의자유도를향상시키는것을목적으로한다. 기판처리장치는, 기판유지부재에의해기판이유지되었을때에기판이존재할수 있는영역을향해검출광을조사하는투광기(61, 71)와, 투광기로부터조사된검출광을받는수광기(62, 72)를구비한다. 기판유지부재에유지된기판의주위에위치하도록설치된기판처리장치의구성부재인기판주위부재(20, 30, 31, 34, 38 등)를, 투광기로부터수광기로향하는검출광의광로(64, 74)가통과하고있다. 검출광은, 기판주위부재를투과하고, 기판을투과하지않는파장을갖고있다.
-
公开(公告)号:KR1020170143455A
公开(公告)日:2017-12-29
申请号:KR1020170078122
申请日:2017-06-20
Applicant: 도쿄엘렉트론가부시키가이샤
IPC: H01L21/67 , H01L21/02 , H01L21/683
CPC classification number: B08B13/00 , B08B3/041 , B08B3/08 , H01L21/67017 , H01L21/67051 , H01L21/67173
Abstract: 본발명은액 받이컵의컵체의돌출부를얼룩없이세정하는것을과제로한다. 제1 컵체(51)와제2 컵체(52) 중어느한쪽을승강시켜양자를근접상태로한다. 이때, 제1 돌출부(5102)의하면에형성된간극형성부(5106)와제2 돌출부(5202)의상면사이의제1 간극(G1)이, 제1 돌출부의간극형성부가없는부분과제2 돌출부의상면사이의제2 간극(G2)보다작다. 이상태로, 제2 간극에세정액을공급한다. 반경방향외향으로흐르고자하는세정액의움직임이좁은제1 간극에의해제한되기때문에, 제1 돌출부와제2 돌출부사이의공간의전역을세정액으로채울수 있어, 세정대상면을얼룩없이세정할수 있다.
Abstract translation: 本发明克服了清洗杯架的杯体的突出部分没有斑点的问题。 第一杯体51和第二杯体52中的一个升高和降低以使它们靠得很近。 此时,形成在根据第一突起5102间隙形成部(5106)沃赫第二突起5202是衣服侧之间的第一间隙(G1),任务的第一部分的顶表面2周之间的突起,而不形成在突起部的间隙 Ag 2比间隙G2小。 结果,清洁液体被供应到第二间隙。 由于清洗液的运动,以通过一个窄的第一间隙中,第一突出部和它的两个凸起之间chaeulsu用洗涤液的空间的整个区域流动径向向外椅子是有限的,它可以均匀地清洁清洁目标表面上。
-
公开(公告)号:KR101783079B1
公开(公告)日:2017-09-28
申请号:KR1020137017509
申请日:2012-07-11
Applicant: 도쿄엘렉트론가부시키가이샤
IPC: H01L21/67 , G03F7/42 , H01L21/02 , F21Y101/02
CPC classification number: H01L21/02057 , G03F7/42 , H01L21/67051 , H01L21/6708 , H01L21/67115
Abstract: 액처리장치는, 기판(W)을수평으로유지하는기판유지부재(22)와, 기판유지부재를회전시키는회전기구(25)와, 기판유지부재에유지된기판에가열된약액을공급하는약액노즐(56a)과, 기판유지부재에유지된기판의위쪽을덮는톱 플레이트(50)와, 톱플레이트의위쪽으로부터, 톱플레이트를투과시켜정해진파장의광을기판유지부재에유지된기판에조사함으로써약액처리중에기판을가열하는적어도 1개의 LED 램프(62)를구비하고있다.
-
公开(公告)号:KR101751568B1
公开(公告)日:2017-06-27
申请号:KR1020137006440
申请日:2012-08-01
Applicant: 도쿄엘렉트론가부시키가이샤
IPC: H01L21/302 , H01L21/027
CPC classification number: H01L21/02041 , H01L21/465 , H01L21/67051 , H01L21/6719 , H01L21/68785 , H01L21/68792
Abstract: 본발명의액처리장치는, 기판(W)을수평으로유지하여회전시키는기판유지부(21)와, 기판유지부에유지된기판에대하여처리액을공급하는처리액노즐(82)과, 기판유지부에유지된기판의둘레가장자리의외측에마련되며, 처리액노즐에의해기판에공급된뒤의처리액을받기위한컵(40)과, 기판유지부에유지된기판을위쪽에서덮는상부판(32)과, 상부판을회전시키는상부판회전구동기구와, 상부판의둘레가장자리를둘러싸는환형의액받이공간(132)을갖는액받이부재(130)를구비하고있다.
-
公开(公告)号:KR1020170015415A
公开(公告)日:2017-02-08
申请号:KR1020170011934
申请日:2017-01-25
Applicant: 도쿄엘렉트론가부시키가이샤
CPC classification number: H01L21/67017 , B05B14/00 , B05C11/08 , B08B3/04 , B08B3/08 , B08B15/02 , G03F7/40 , H01L21/67051 , H01L21/6708 , H01L21/6715 , H01L21/02052
Abstract: 본발명은기판을처리액으로처리하는기판액처리장치에관한것이다. 본발명의기판액처리장치는, 기판을보지하고, 또한보지한기판을회전시키기위한기판회전기구와, 기판으로복수종류의처리액을선택적으로공급하는처리액공급기구와, 기판으로공급한후의처리액을회수하기위한회수컵과, 처리액을회수하기위하여회수컵에형성한복수의액 회수부와, 액회수부로부터회수한처리액을배출하기위하여회수컵의저부에형성한배액구와, 회수컵의배액구보다상방측에형성한배기구와, 배기구의상방을소정의간격을두고덮기위하여회수컵에고정한고정커버와, 기판으로공급한후의처리액을액 회수부로안내하기위하여고정커버의상방에서승강가능하게설치된승강컵과, 처리액의종류에따라승강컵을고정커버에대하여승강시키기위한컵 승강기구를가지고, 승강컵에는구획벽에승강가능하게삽입관통된승강로드가접속되어있고, 승강로드는컵 승강기구와접속되어있으며, 승강컵이승강할때, 배기구와고정커버와의사이의상기소정의간격은일정하게유지되어, 배기압력의변동을방지한다.
Abstract translation: 提供了一种基板液体处理装置,其中处理溶液和气氛可以在收集杯内彼此分离。 基板液体处理装置包括:基板旋转单元; 处理液供应单元; 收集杯,其被配置为收集处理溶液; 在收集杯处形成的液体收集区域; 形成在收集杯的底部的液体排出口; 形成在排液口上方的排气口; 固定盖,其被构造成在其间具有空间覆盖所述排气口的上部; 提升杯,其设置在所述固定盖的上方并且被构造成将所述处理溶液引导到所述液体收集区域中; 以及杯升降单元,其配置为根据处理溶液的种类上下移动升降杯。
-
公开(公告)号:KR101678270B1
公开(公告)日:2016-11-21
申请号:KR1020137029481
申请日:2012-10-23
Applicant: 도쿄엘렉트론가부시키가이샤
CPC classification number: H01L21/67051 , B05B3/18 , B05B15/80 , B05C9/06 , B05C11/1039 , B05C11/1044 , B05D1/02 , B08B3/04 , B60B17/00 , B60B17/0068 , B60B2900/325 , B61H5/00 , G01B11/306 , G01B21/20 , H01L21/02057 , H01L21/6715
Abstract: 기판처리장치는, 기판(W)을수평으로유지하여회전시키는기판유지부(21)와, 기판에대하여제1 처리액및 제2 처리액을각각공급하는제1 처리액공급노즐및 제2 처리액공급노즐과, 상단이기판보다상측에위치하도록마련되며, 기판에공급된후의처리액을받기위한액받이컵(40, 42, 44)과, 액받이컵의주위에배치되고, 그상단이상기액받이컵(40, 42, 44)의상측에있는상승위치와, 상기상승위치보다하측에위치하는하강위치사이에서승강가능한, 상부에상부개구(50n)가형성된통형의제1 통형외컵(50A)과, 그외측의제2 통형외컵(50B)을구비하고있다. 사용되는처리액에따라, 사용하는통형외컵(50A, 50B)을선택한다.
-
公开(公告)号:KR101521322B1
公开(公告)日:2015-05-18
申请号:KR1020110119560
申请日:2011-11-16
Applicant: 도쿄엘렉트론가부시키가이샤
IPC: H01L21/302 , H01L21/3063
CPC classification number: H01L21/67051 , H01L21/68707 , H01L21/68728 , H01L21/68785 , H01L21/68792
Abstract: 본발명은약액분사용의분사부재로부터웨이퍼의하면에분사된약액이린스처리용유체를분사하는분사부재에부착되는것을방지할수 있거나, 또는저감할수 있는액처리장치를제공하는것을목적으로한다. 액처리장치는기판의주연부를유지하는유지부재를가지며, 기판을수평으로유지하는기판유지부(22, 30)와, 기판유지부를회전시키는회전구동부(39)와, 기판유지부에유지된기판하면의아래쪽에위치하도록설치되고, 상기기판유지부에의해유지된기판의하면에약액을토출하기위한복수의제1 토출구(61)가형성된제1 부분(60A)과, 기판유지부에의해유지된기판의하면에린스처리용유체를토출하기위한복수의제2 토출구(62)가형성된제2 부분(60B)을갖는노즐(60)을포함하고, 노즐의제1 부분은기판유지부에의해유지된기판의중앙부에대향하는위치로부터기판의주연부에대향하는위치사이에서연장되어있으며, 노즐의제2 부분은기판유지부에의해유지된기판의중앙부에대향하는위치로부터기판의주연부에대향하는위치사이에서연장되고, 제1 부분과상기제2 부분은 V자를이루도록배치된다.
Abstract translation: 本发明的目的在于提供一种液体处理装置,其能够防止或减少喷射到晶片上的化学液体从用于使用药液的喷射构件粘附到用于喷射冲洗液的喷射构件。 该液体处理装置包括:用于水平保持基板的基板保持部(22,30);保持基板周边的保持部;用于使基板保持部旋转的旋转驱动部(39) 设置在基板保持部下方的第一部分60A,用于保持由基板保持部保持的基板,并具有用于排出药液的多个第一排出口61; 和形成有多个第二排出口(62)的第二部分(60B),用于排出根据本发明的第一方面的用于漂洗处理的流体,其中喷嘴的第一部分 并且,喷嘴的第二部分从与被基板保持部保持的基板的中心相反的位置延伸到与基板的周缘相反的位置 并且第一部分和第二部分延伸以形成V形槽, 它被设置成。
-
-
-
-
-
-
-
-
-