公开(公告)号：JPH0448716A

公开(公告)日：1992-02-18

申请号：JP15561190

申请日：1990-06-15

Applicant: CANON KK

Inventor： AMAMIYA MITSUAKI ,  HARA SHINICHI ,  SAKAMOTO EIJI

IPC: H01L21/027 ,  G03F7/20

Abstract: PURPOSE:To obtain a substrate holder, in which contact heat resistance can be lowered and the accuracy of pattern transfer is improved, by providing a control means controlling the opening and closing of a blow-off quantity adjusting valve and a suction-quantity adjusting valve from the output signal of a pressure sensor. CONSTITUTION:In the substrate holder, a plurality of blow-off ports 7 and a plurality of suction ports 3 are formed to the chuck surface 6 of a susceptor l, and the pressure of a fine space formed between the rear of a substrate 51 and the chuck surface 52 of a susceptor 50 is detected by a pressure sensor 11. The pressure of the fine space is kept at a constant value or more by opening and closing a blow-off quantity adjusting valve 14 installed on its midway of a blow-off pipe g connecting a plurality of the blow-off ports and outside space or a in response to detecting pressure and a suction-quantity adjusting valve 10 mounted on its midway of a suction pipe 4 connecting a plurality of the suction ports and a vacuum source 9 by control means 15, 16, thus keeping contact heat resistance between the substrate and the susceptor at a constant value or less.

公开(公告)号：JPH0414239A

公开(公告)日：1992-01-20

申请号：JP11574190

申请日：1990-05-07

Applicant: CANON KK

Inventor： SAKAMOTO EIJI ,  EBINUMA RYUICHI ,  HARA SHINICHI ,  MARUMO KOJI

IPC: H01L21/683 ,  H01L21/68

Abstract: PURPOSE:To reduce contact thermal resistance, and improve pattern transfer precision, by arranging a plurality of protrusions of the same height and elastic members which are composed of material with rigidity smaller than that of a wafer and have a height larger than or equal to the protrusion, on the facing surface of a main structure member. CONSTITUTION:On the surface of a main structure member 1 which surface faces a wafer 5, a plurality of pin-shaped protrusions 2 having superior symmetry and the same height, and elastic member 3 which surround each of the protrusions and have the same height are arranged. A vacuum sucking hole 4 at the center is connected with a vacuum generating source. The rigidity of the elastic member 3 is smaller than that of the member 1 and that of the wafer 5, and the height of the member 3 is larger than that of the protrusion 2. In order that the back of the wafer 5 may be made to surely abut against the contact surface of the protrusion 2 at the time of sucking, the height of the elastic member 3, D+d[mm], is set within the range of formula, when the height of the protrusion is D[mm], Young's modulus of the elastic member 3 is E[Pa], and the pressure difference between the surface and the back of the wafer 5 is T[Torr].

公开(公告)号：JPH03122477A

公开(公告)日：1991-05-24

申请号：JP25884489

申请日：1989-10-05

Applicant: CANON KK

Inventor： CHIBA YUJI ,  MIZUSAWA NOBUTOSHI ,  EBINUMA RYUICHI ,  SAKAMOTO EIJI ,  UZAWA SHUNICHI ,  KARIYA TAKUO

IPC: F25D3/10 ,  G03F7/20 ,  H01L21/027 ,  H01L21/30

Abstract: PURPOSE:To enable the use of any kind of an actuator by a method wherein a housing to contain a heat generating drive source having an output shaft in a sealing manner is provided, and a sealing means is mounted to the portion, through which an output shaft is extended, of the housing. CONSTITUTION:The interior of a housing to contain a heat generating drive source in a sealing manner is managed to approximate an atmospheric pressure (760Torr) in He by means of a pressure gauge 22. Thus, dust generation and vaporization of grease and oil used for the slide part of a motor 10 is reduced because of pressure in atmosphere being high. A material of the motor 10 can be used without being limited to a material used as a vacuum part. Thus, the motor 10 can be used as an actuator in special environment without improving a good on a market. In this case, the portion, through which an output shaft is extended, of the housing is sealed with an O-ring seal 16.

公开(公告)号：JPH03118500A

公开(公告)日：1991-05-21

申请号：JP25529089

申请日：1989-10-02

Applicant: CANON KK

Inventor： SAKAMOTO EIJI ,  EBINUMA RYUICHI ,  AMAMIYA MITSUAKI ,  UZAWA SHUNICHI ,  UDA KOJI

IPC: G21K5/00 ,  G03F1/22 ,  G03F7/20 ,  H01L21/027 ,  H01L21/30 ,  H05K7/20

Abstract: PURPOSE:To find out water leakage in a sealed vessel in early stage and to prevent deterioration of its function by providing a mean to detect water content of a gas in the sealed vessel which is prepared for an X-ray exposure. CONSTITUTION:A helium gas is supplied into a sealed vessel 1 from a gas feed pipe 15 and the vessel is controlled in its inner pressure to be around 10Torr by a pressure gause 11, a pressure controller 12 and a flow control valve 13, and subsequently its humidity is 0%. To an object 5 for a temperature control, temperature controlling water is circulated through a temperature controlling water circulation device 3. During an ordinary condition, valves 6 and 7 are in an open condition and a valve 8 is in a closed condition. In case that water leakage occurs in the vessel 1, the water immediately evaporates and a humidity in the vessel 1 rises, as a saturation water vapor pressure at a room temperature is around 20Torr. As a detecting sensor 2 for water content is provided to the vessel 1, the rising humidity by the water leakage is detected and water supply to the object 5 for temperature control is shut out.

公开(公告)号：JPH0362920A

公开(公告)日：1991-03-19

申请号：JP19795789

申请日：1989-08-01

Applicant: CANON KK

Inventor： AMAMIYA MITSUAKI ,  SAKAMOTO EIJI ,  UDA KOJI ,  OZAWA KUNITAKA ,  IWAMOTO KAZUNORI ,  UZAWA SHUNICHI ,  MARUMO KOJI

IPC: H01L21/30 ,  G03F7/20 ,  H01L21/00 ,  H01L21/027 ,  H01L21/687

Abstract: PURPOSE:To prevent vibration due to flow of constant temperature water and to alleviate burden with respect to temperature control of the constant temperature water at the same time at a wafer mounting stage by regulating the flow rate of a temperature regulating medium flowing through a circulating flow path with a flow rate regulating valve, and controlling the temperature of a wafer without vibration. CONSTITUTION:As information for controlling the temperature of a wafer, the temperature of the wafer is measured with a detecting element 9. A signal indicating the result of measurement is sent into a Peltier-element controlling part 18 from a temperature measuring part 16. When the signal is received, the Peltier-element controlling part 18 actuates a Peltier element 7 through a Peltier-element driving part 17 so that the temperature of the wafer 4 becomes the temperature determined by a CPU 20 e.g. 23+ or -0.01 deg.C all the time. Meanwhile, constant temperature water whose temperature is controlled at, e.g. 23.1+ or -0.1 deg.C is sent from a constant temperature circulating device 13. The water is introduced into a flow path 8 through a flow-rate controlling valve 12 and an introducing port 11, and heat at the rear surface of the element 7 is removed. The water is drained through a draining port 10 and circulated and returned into the constant-temperature circulating device 13 again. Therefore, wafer processing wherein the temperature control and vibrationproofing are achieved at the same time can be performed.

公开(公告)号：JPH0294514A

公开(公告)日：1990-04-05

申请号：JP24625788

申请日：1988-09-30

Applicant: CANON KK

Inventor： SAKAMOTO EIJI ,  HARA SHINICHI ,  UZAWA SHUNICHI

IPC: G03F1/76 ,  G03F7/20 ,  H01L21/027

Abstract: PURPOSE:To match the thermal expansion of an original sheet and that of a substrate, and to improve the accuracy of alignment at the time of exposure by composing the support frame of the original sheet, in which a pattern to be transferred is drawn, and the main structural member of a substrate holding means which holds the substrate of materials having approximately the same thermal expansion coefficients. CONSTITUTION:Heat generated in a mask 1 is passed through a mask and absorbed to a wafer 4 and a wafer chuck 5, and absorbed to a temperature control medium flowing in the wafer chuck 5. The temperature of the wafer 4 is elevated at that time, but the wafer 4 is held to the wafer chuck 5 at fixed holding power, and holding power is made larger than shearing stress generated between the wafer 4 and the wafer chuck 5 by the thermal strain of the wafer 4, thus making the thermal strain of the wafer 4 subordinate to that of the wafer chuck 5. The materials of the mask frame 3 and the main structural member of the wafer chuck 5 are equalized. Accordingly, these members are constituted of the materials having the same thermal expansion coefficients, thus improving the accuracy of superposition of the mask and the wafer.

公开(公告)号：JPH0267714A

公开(公告)日：1990-03-07

申请号：JP21852088

申请日：1988-09-02

Applicant: CANON KK

Inventor： MORI TETSUZO ,  SAKAMOTO EIJI ,  HARA SHINICHI ,  UDA KOJI ,  SHIMODA ISAMU ,  UZAWA SHUNICHI

IPC: G03F7/20 ,  H01L21/027 ,  H01L21/30

Abstract: PURPOSE:To inhibit the temperature rise of a wafer at the time of exposure at an allowable temperature or lower without causing a reduction of a pattern formation accuracy due to the fluctuation of a flow by a method wherein a flow rate control means is provided on a medium passage and this flow rate control means is actuated while being controlled according to a state of exposure. CONSTITUTION:A cooling medium is sent out through a temperature control pump 9, is put in a wafer chuck 5 through an entrance 13, absorbs the heat of the chuck 5 and the water 4, and is exhausted through an exit 12. The exhausted medium is subjected to temperature control and repeats a circulation. An exposure control part 11 sends an exposure state signal to show whether a device is in exposure or not to a flow rate control part 10. The control part 10 makes a flow rate control valve 7 operate while controlling the valve 7 in two stages according to whether the device is in exposure or not. That is, at the time of exposure, a fluctuation to be given to the chuck 5 is set at a flow rate A which does not affect a pattern formation accuracy and at the time of non exposure, the fluctuation is set at a sufficient flow rate B that the temperature rise of a wafer due to the storage of an energy imparted by an exposure up to the time of non exposure does not exceed an allowable temperature range. The control part 11 further performs the control of a light source 1, the control of opening and shutting of a shutter 2 and the control of movement of a stage 6 for positioning use according to a set sequence program.

公开(公告)号：JPS62108205A

公开(公告)日：1987-05-19

申请号：JP24699885

申请日：1985-11-06

Applicant: CANON KK

Inventor： MOTOI YASUKO ,  TAKAO HIDEAKI ,  KAMIO MASARU ,  SAKAMOTO EIJI ,  MURATA TATSUO ,  SEKIMURA NOBUYUKI

IPC: G02B5/20 ,  G02B5/22 ,  H01L27/14 ,  H04N9/04

Abstract: PURPOSE:To obtain the titled filter having a deposited red coloring layer which has excellent properties of spectral characteristics thermal resistance, and solvent resistance by forming the layer contg. a red coloring matter deposited a specific coloring matter and a specific yellow coloring matter on a substrate. CONSTITUTION:The resist pattern 2 is formed on the substrate 1 to form a mask. the coloring matter layer 3 is formed by depositing the perilene tetracarboxylic acid type coloring matter and the yellow coloring matter of an isoindolinone type or the perilene tetracarboxylic acid type coloring matter and the yellow coloring matter of an anthraquinone type coloring matter using said mask. the layer 4 contg. the red coloring matter of the stripe pattern type is formed by removing the resist pattern 2 and the layer 3 thereon, dipping said substrate in a solvent which does not dissolve the coloring matter to obtain the titled filter. The titled filter may be provided with a protective layer.

公开(公告)号：JPH10239500A

公开(公告)日：1998-09-11

申请号：JP5842297

申请日：1997-02-26

Applicant: CANON KK

Inventor： HASEGAWA TAKAYUKI ,  SAKAMOTO EIJI

IPC: G21K5/00 ,  G03F7/20 ,  H01L21/027 ,  H05H13/04

Abstract: PROBLEM TO BE SOLVED: To provide an X-ray output window having a sufficient mechanical strength and thin. SOLUTION: The thickness of the beryllium foil 11 of an X-ray output window E1 for taking out an X-ray from a beam duct 2 to an exposing chamber 1 is designed on the basis of the tensile stress generated in the center of the beryllium foil 11 when deflected by the pressure difference between the beam duct 2 and the exposing chamber 1. In order to prevent a larger tensile stress from being generated in the contact part of a flange 12 with the beryllium foil 11, a curved part 12a having a large curvature radius is provided on the inner periphery of the flange 12.

公开(公告)号：JPH08236438A

公开(公告)日：1996-09-13

申请号：JP33330595

申请日：1995-12-21

Applicant: CANON KK

Inventor： OZAWA KUNITAKA ,  SAKAMOTO EIJI ,  FUKAGAWA YOUZOU ,  TAKAHASHI KAZUHIRO

IPC: G03F7/20 ,  H01L21/027

Abstract: PURPOSE: To reduce the uneven exposure of an object to a light flux from a pulse oscillating type exposing device by making the width from the starting point to a point at which the light intensity increasing rate of the luminous flux is changed in the first place or the width from a point at which the light intensity increasing rate is changed in the second place to a point where the light intensity becomes the highest equal to or larger than the relative moving amount of the object against an illuminated area at every pulse. CONSTITUTION: At exposing, a wafer 11 to a luminous flux 104 on a slit, the wafer 11 is moved perpendicularly to the optical path of the flux 104 which has acquired pattern information when the flux 104 passes through a reticle and, as an illuminated area 105 moves on the surface of the wafer 11, the wafer 11 is exposed to the flux 104. Along the light intensity curve shown in the figure, the width Wa from a first point P1 at the starting point to a second point P2 at which the light intensity increasing rate of the flux 104 is changed in the first place or the width Wb from a third point P3 at which the increasing rate is changed in the second place to a fourth point P4 at which the light intensity becomes the highest is made equal to or wider than the relative moving amount of the object 11 to be illuminated against the illuminated area 105 at every pulse.