-
公开(公告)号:DE10136400B4
公开(公告)日:2006-01-05
申请号:DE10136400
申请日:2001-07-26
Applicant: INFINEON TECHNOLOGIES AG
Inventor: SELL BERNHARD , SAENGER ANNETTE , GUTSCHE MARTIN , SEIDL HARALD , MOLL PETER
IPC: C23C16/32 , C23C16/44 , C23C16/455 , C23C16/56 , H01L21/285 , H01L21/8242
Abstract: At least a partial layer of an upper capacitor electrode is formed by metal carbide, preferably by a transition metal carbide. In one embodiment, the metal carbide layer is formed by depositing an alternating sequence of metal-containing layers and carbon-containing layers on top of one another and then subjecting them to a heat treatment, in such a manner that they mix with one another. The patterning of the layer sequence can be carried out before the carbide formation step.
-
公开(公告)号:DE102004030138A1
公开(公告)日:2005-12-08
申请号:DE102004030138
申请日:2004-06-22
Applicant: INFINEON TECHNOLOGIES AG
Inventor: PRECHTL GERHARD , GUTSCHE MARTIN , KERSCH ALFRED , SPITZER ANDREAS
IPC: C23C16/448 , C23C16/455 , H01L21/314 , H01L21/316 , H01L21/768
Abstract: An arrangement for atomic layer deposition starting from precursor compounds, comprises a reactor chamber (201) with a substrate holder and a heater. A pump (205) is used to supply a vacuum in the reaction chamber, and the precursor compound container is connected to the chamber. The pump is located between the container and the reactor chamber. The arrangement has a carrier gas source, a gas chamber and a flushing gas source.
-
公开(公告)号:DE10345394A1
公开(公告)日:2005-05-19
申请号:DE10345394
申请日:2003-09-30
Applicant: INFINEON TECHNOLOGIES AG
Inventor: KREUPL FRANZ , GUTSCHE MARTIN
IPC: H01L21/02 , H01L21/314 , H01L21/316 , H01L21/8242 , B82B3/00
-
公开(公告)号:DE10344039A1
公开(公告)日:2005-04-14
申请号:DE10344039
申请日:2003-09-23
Applicant: INFINEON TECHNOLOGIES AG
Inventor: REISINGER HANS , GUTSCHE MARTIN , SEIDL HARALD , GORDON ROY
IPC: H01L21/28 , H01L27/115 , H01L29/51 , H01L29/792
Abstract: An electrically programmable non-volatile memory based on threshold-changing MOSFETs comprises a charge-storing layer made from a compound of the formula: HfO xN y. An independent claim is also included for the production of an electrically programmable non-volatile memory based on threshold-changing MOSFETs.
-
公开(公告)号:DE10336876A1
公开(公告)日:2005-03-17
申请号:DE10336876
申请日:2003-08-11
Applicant: INFINEON TECHNOLOGIES AG
Inventor: PINNOW CAY-UWE , GUTSCHE MARTIN , SYMANCZYK RALF DR , WILLER JOSEF
IPC: H01L21/28 , H01L21/336 , H01L21/8239 , H01L21/8247 , H01L27/10 , H01L27/105 , H01L27/115 , H01L29/423 , H01L29/76
Abstract: Memory cell comprises a storage layer (6) formed by a material of a gate dielectric (4) and containing nano-crystals or nano-dots. An independent claim is also included for a process for the production of a memory cell.
-
公开(公告)号:DE10248980B4
公开(公告)日:2004-11-11
申请号:DE10248980
申请日:2002-10-21
Applicant: INFINEON TECHNOLOGIES AG
Inventor: SEIDL HARALD , GUTSCHE MARTIN
IPC: C23C16/02 , C23C16/04 , C23C16/40 , C23C16/44 , C23C16/455 , H01L21/316 , H01L21/334 , H01L21/8242 , H01L21/28
Abstract: Production of structured silicon dioxide layers on process surfaces arranged perpendicular or slanted towards a substrate surface comprises preparing a substrate (4) with a relief in a process chamber, forming a starter layer (17) with leaving groups substituted by hydroxyl groups on sections of the process surfaces which extend from the substrate surface up to a determined covering depth of the relief, and applying tris(tert.-butoxy)silanol to the substrate so that a silicon dioxide layer (18) is selectively grown on the starter layer.
-
公开(公告)号:DE10216614B4
公开(公告)日:2004-06-17
申请号:DE10216614
申请日:2002-04-15
Applicant: INFINEON TECHNOLOGIES AG
Inventor: HECHT THOMAS , BIRNER ALBERT , SEIDL HARALD , SCHROEDER UWE , JAKSCHIK STEFAN , GUTSCHE MARTIN
IPC: C25D11/02 , C25D11/32 , H01L21/316 , H01L21/8242 , H01L21/318 , H01L21/3105 , H01L27/108
Abstract: Production of a thin dielectric layer (2) on a conducting substrate (1) comprises applying a thin dielectric layer on the substrate, placing in an electrochemical cell (5) filled with an electrolyte (9) and having two electrodes (6, 7), connecting the substrate with the first electrode and the second electrode with the electrolyte, and applying an electrical potential between the electrodes. The current flow between the electrolyte and substrate is controlled in an electrochemical process and is adjusted by the dielectric layer, preferably in the region of defect sites. An Independent claim is also included for an arrangement of a substrate and a dielectric layer.
-
公开(公告)号:DE10219123B4
公开(公告)日:2004-06-03
申请号:DE10219123
申请日:2002-04-29
Applicant: INFINEON TECHNOLOGIES AG
Inventor: SEIDL HARALD , GUTSCHE MARTIN , HECHT THOMAS , JAKSCHIK STEFAN , KUDELKA STEPHAN , SCHROEDER UWE , SCHMEIDE MATTHIAS
IPC: H01L21/311 , H01L21/8242 , H01L21/8239
Abstract: Process for structuring ceramic layers on semiconductor substrates comprises depositing a ceramic layer on a semiconductor substrate, sealing the deposited ceramic layer, forming impurity sites in sections, and treating the ceramic layer with an etching medium, in which the ceramic layer is removed from the substrate in the sections provided with the impurity sites.
-
公开(公告)号:DE10219123A1
公开(公告)日:2003-11-13
申请号:DE10219123
申请日:2002-04-29
Applicant: INFINEON TECHNOLOGIES AG
Inventor: SEIDL HARALD , GUTSCHE MARTIN , HECHT THOMAS , JAKSCHIK STEFAN , KUDELKA STEPHAN , SCHROEDER UWE , SCHMEIDE MATTHIAS
IPC: H01L21/311 , H01L21/8242 , H01L21/8239
Abstract: Process for structuring ceramic layers on semiconductor substrates comprises depositing a ceramic layer on a semiconductor substrate, sealing the deposited ceramic layer, forming impurity sites in sections, and treating the ceramic layer with an etching medium, in which the ceramic layer is removed from the substrate in the sections provided with the impurity sites.
-
公开(公告)号:DE10164741A1
公开(公告)日:2003-06-26
申请号:DE10164741
申请日:2001-06-12
Applicant: INFINEON TECHNOLOGIES AG
Inventor: SELL BERNHARD , SAENGER ANNETTE , GUTSCHE MARTIN , SEIDL HARALD
IPC: C23C14/58 , C23C16/56 , H01L21/20 , H01L21/302 , H01L21/3205 , H01L21/334 , H01L21/44 , H01L21/461 , H01L21/8242 , H01L29/94
-
-
-
-
-
-
-
-
-