公开(公告)号：EP1511367A3

公开(公告)日：2005-12-21

申请号：EP04254904.8

申请日：2004-08-16

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Mashino, Naohiro, c/o Shinko Electric Ind. Co. Ltd

IPC: H05K3/42 ,  H05K3/22 ,  H05K3/46

CPC classification number: H05K3/22 ,  H01L2924/0002 ,  H05K3/102 ,  H05K3/423 ,  H05K3/4602 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09745 ,  H05K2201/1025 ,  H05K2203/107 ,  H05K2203/128 ,  H01L2924/00

Abstract: A process for manufacturing a wiring board comprising a substrate (10) made of an insulation material and having first and second surfaces, first and second conductor patterns formed on the first and second surfaces, respectively, and a via conductor penetrating the substrate to electrically connect the first conductor pattern with the second conductor pattern; the process comprising the following steps of: forming the substrate (10) with a through-hole (12) penetrating thereto and defining openings at the first and second surfaces, respectively; plating the substrate with a metal so that a metal layer (16) having a predetermined thickness is formed on the respective first and second surfaces of the substrate and the through-hole (12) is substantially filled with the metal to be the via conductor; irradiating a laser beam, as a plurality of spots; around a metal-less portion of the plated metal (16), such as a dimple or seam (20), at positions corresponding to the openings of the through-hole (12), so that a part of the plated metal (16) melts to fill the metal-less portion (20) with the molten metal (16). A filler of metal (26) or metal powder may also be provided and melted in to the metal-less portion (20) by the laser beam.

Abstract translation: 一种制造布线板的方法，包括由绝缘材料制成并具有第一和第二表面的基底（10），分别形成在第一和第二表面上的第一和第二导体图案以及穿过基底的通孔导体以电连接 具有第二导体图案的第一导体图案; 该方法包括以下步骤：用穿过其的通孔（12）形成基底（10）并且分别在第一和第二表面处限定开口; 用金属电镀基板，使得在基板的相应的第一和第二表面上形成具有预定厚度的金属层（16），并且通孔（12）基本上填充有金属作为通路导体; 照射激光束作为多个点; 围绕电镀金属（16）的无金属部分，例如凹坑或接缝（20），在对应于通孔（12）的开口的位置处，使得电镀金属（16）的一部分 熔化以用熔融金属（16）填充无金属部分（20）。 金属（26）或金属粉末的填料也可以通过激光束提供并熔化到无金属部分（20）中。

公开(公告)号：EP0232127A3

公开(公告)日：1988-09-21

申请号：EP87300770

申请日：1987-01-29

Applicant: MINNESOTA MINING AND MANUFACTURING COMPANY

Inventor： HAGIWARA, YOSHICHI C/O MINNESOTA MINING AND ,  TANAKA, KENJI C/O MINNESOTA MINING AND ,  KIMURA, NAOYA C/O MINNESOTA MINING AND ,  EMORI, KENJI C/O MINNESOTA MINING AND ,  KAWAMOTO, YOSHITAKA C/O MINNESOTA MINING AND

IPC: H01R11/01 ,  H01R4/04 ,  H05K3/32 ,  H01R23/68 ,  H05K3/40

CPC classification number: H01R4/04 ,  H01R12/7076 ,  H05K3/323 ,  H05K2201/09945 ,  H05K2201/1025

Abstract: The present invention provides an anisotropic electrically-conductive film connector comprising a conductive layer (2) and an adhesive layer (1) provided on at least one surface of the conductive layer, the conductive layer having a plurality of conductive elements (3) electrically independent of each other, wherein, each of the conductive elements comprises a metal material having a substantially uniform thickness.
The present invention also provides an anisotropic electrically-conductive film connector which has a metal material which is uneven on its junction side surface.

公开(公告)号：JP2009181652A

公开(公告)日：2009-08-13

申请号：JP2008021106

申请日：2008-01-31

Applicant: Fujitsu Ltd ,  富士通株式会社

Inventor： KIDO TAKUMA ,  KOGA ATSUSHI ,  EMOTO SATORU ,  YAMAMOTO NORIO ,  OE TAKESHI

IPC: G11B21/21 ,  G11B21/26

CPC classification number: G11B5/4826 ,  G11B5/455 ,  G11B5/4853 ,  H05K3/305 ,  H05K3/326 ,  H05K3/3442 ,  H05K3/4015 ,  H05K2201/09427 ,  H05K2201/09781 ,  H05K2201/1025 ,  H05K2201/10727 ,  Y02P70/613

Abstract: PROBLEM TO BE SOLVED: To provide a head assembly having a head easily removable from a suspension without deforming the head and the suspension. SOLUTION: The head assembly 1 comprises a head 2 having an electrode 2a, a suspension 3 having an electrode pad 3b to which the electrode 2a of the head 2 is connected, and a detachment member 10 disposed between the head 2 and the suspension 3 bonded to the head 2. The detachment member 10 has a relay electrode pad 10a. The electrode 2a of the head 2 and the electrode pad 3b of the suspension 3 are bonded by a hot-melt adhesive 11 through the relay electrode pad 10a, thereby, the head 2 is fixed to the suspension 3. COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 要解决的问题：提供一种头部组件，其具有容易从悬架上移除的头部，而不会使头部和悬架变形。 头部组件1包括具有电极2a的头部2，具有连接头部2的电极2a的电极焊盘3b的悬架3和设置在头部2和头部2之间的分离部件10。 悬架3与头部2结合。分离构件10具有中继电极垫10a。 磁头2的电极2a和悬架3的电极焊盘3b通过热熔粘合剂11通过继电器电极焊盘10a接合，从而将磁头2固定在悬架3上。版权所有（ C）2009年，JPO＆INPIT

公开(公告)号：JP2005072235A

公开(公告)日：2005-03-17

申请号：JP2003299706

申请日：2003-08-25

Applicant: Shinko Electric Ind Co Ltd ,  新光電気工業株式会社

Inventor： MASHINO NAOHIRO

IPC: H05K3/40 ,  H05K3/00 ,  H05K3/10 ,  H05K3/22 ,  H05K3/42 ,  H05K3/46

CPC classification number: H05K3/22 ,  H01L2924/0002 ,  H05K3/102 ,  H05K3/423 ,  H05K3/4602 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09745 ,  H05K2201/1025 ,  H05K2203/107 ,  H05K2203/128 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide a method for forming a via-hole which can form directly a wiring pattern on an end face of the via-hole formed by filling a metal in a through hole formed on a substrate made of an insulating material by plating. SOLUTION: The method for forming the via-hole includes a step of forming a plating metal layer 16 of a predetermined thickness on the front surface of the substrate 10 while filling the metal in the through hole 12 formed on the substrate 10 made of the insulating material by plating, a step of irradiating a plurality of positions of the plating metal layer 16 forming the vicinity of the peripheral edge of a dimple 20 formed on the part of the plating metal layer 16 corresponding to an opening of the through hole 12 with a YAG laser in a spot manner when the via-hole penetrating the substrate 10 is formed, and a step of filling the part of the plating metal layer 16 with a molten metal which carries out melting. COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 要解决的问题：提供一种形成通孔的方法，该通孔可以形成在通孔上形成的通孔形成的通孔形成的端面上的布线图案，该通孔形成在通孔上形成，该通孔形成在由 绝缘材料通过电镀。 ＆lt; P＆gt;解决方案：用于形成通孔的方法包括在衬底10的前表面上形成预定厚度的电镀金属层16的步骤，同时将金属填充在形成在衬底10上的通孔12中 绝缘材料的形成电镀金属层16的多个位置的步骤，该电镀金属层16形成在形成于电镀金属层16的与通孔的开口对应的部分上的凹坑20的周缘附近 当形成穿透基板10的通孔时，以点状的YAG激光器12，以及对熔融金属进行熔化的电镀金属层16的一部分进行填充的步骤。 版权所有（C）2005，JPO＆NCIPI

公开(公告)号：KR1020100132823A

公开(公告)日：2010-12-20

申请号：KR1020090051605

申请日：2009-06-10

Applicant: 삼성전기주식회사

Inventor： 오흥재 ,  정태준 ,  이동규 ,  문선재 ,  최진원

IPC: H01L21/60

CPC classification number: H01L23/49811 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05026 ,  H01L2224/05144 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05568 ,  H01L2224/05611 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/1146 ,  H01L2224/1147 ,  H01L2224/11901 ,  H01L2224/13022 ,  H01L2224/1308 ,  H01L2224/13083 ,  H01L2224/13084 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/16 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/12042 ,  H05K3/243 ,  H05K3/3436 ,  H05K3/3484 ,  H05K2201/1025 ,  Y02P70/613 ,  Y10T29/49147 ,  Y10T29/49165 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2224/13099 ,  H01L2924/00

Abstract: PURPOSE: A substrate of a flip chip and a fabricating method of the same are provided to reduce necking failure in a copper post by forming a solder layer in lower part of a metal post. CONSTITUTION: A base substrate(102) includes a pad part. A solder resist layer(106) is formed on the base substrate so that the pad part is exposed to the outside. The base solder layer(114) is formed on the pad part. A metal post(116) is formed on the base solder layer.

Abstract translation: 目的：提供倒装芯片的基板及其制造方法，以通过在金属柱的下部形成焊料层来减少铜柱的颈缩失效。 构成：基底（102）包括垫部分。 在基底基板上形成阻焊层（106），使得焊盘部分暴露于外部。 基底焊料层（114）形成在焊盘部分上。 金属柱（116）形成在基底焊料层上。

公开(公告)号：KR1019910007016B1

公开(公告)日：1991-09-14

申请号：KR1019880008211

申请日：1988-07-02

Applicant: 스미토모덴키고교가부시키가이샤

Inventor： 사사메아끼라 ,  사까노우에히또유끼 ,  다께우찌히사오 ,  미야께마사야 ,  야마까와아끼라 ,  유시오야스히사 ,  아까자와히또시

IPC: H01L21/60 ,  H01L23/04

CPC classification number: H05K3/3405 ,  H01L21/4853 ,  H01L23/10 ,  H01L23/49582 ,  H01L23/49811 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12033 ,  H01L2924/12042 ,  H05K1/0306 ,  H05K3/246 ,  H05K3/3421 ,  H05K2201/0347 ,  H05K2201/1025 ,  H05K2201/1034 ,  H05K2201/10909 ,  H05K2201/10916 ,  Y10T428/12576 ,  H01L2224/45099 ,  H01L2924/00

Abstract: 내용 없음.

公开(公告)号：KR100268742B1

公开(公告)日：2000-10-16

申请号：KR1019960044051

申请日：1996-10-05

Applicant: 인터내셔널 비지네스 머신즈 코포레이션

Inventor： 크레스게죤스티븐 ,  라이트데이비드노엘

IPC: H05K3/34

CPC classification number: H05K3/4015 ,  H05K1/113 ,  H05K3/0094 ,  H05K3/4007 ,  H05K3/4614 ,  H05K2201/0376 ,  H05K2201/096 ,  H05K2201/1025 ,  H05K2203/0278 ,  H05K2203/1394 ,  Y10T29/4913 ,  Y10T29/49144

Abstract: 본 발명은 상부 표면상에 다수의 관통구멍 개구부를 구비한 고밀도 인쇄 회로 기판(PCB)에 패드를 부착하는 방법을 제공한다. 본 발명의 방법은 다수의 패드를 캐리어 시트상에 형성하되, 상기 각 패드가 상기 캐리어 시트에 근접한 구리층과 상기 구리층의 상부에 형성된 접합 금속층을 구비하도록 형성하는 단계와; 상기 PCB의 상부 표면상의 관통구멍 패턴과 정렬되도록 상기 다수의 패드를 상기 캐리어 시트상에 배치하는 단계와; 상기 접합 금속을 이용하여 상기 상부 표면상의 관통구멍에 상기 패드를 적층하는 단계와; 상기 구리층이 노출되도록 상기 관통구멍에 접합된 상기 다수의 패드로 부터 상기 캐리어 시트를 분리하는 단계를 포함한다. 패드는 디스크 형상, 기다란 형상 또는 장방형 형상과 같은 다양한 형상을 포함하며, 하나 또는 다수의 관통구멍을 덮을 수 있다. 전기 소자는 패드에 납땜될 수 있다. 본 발명의 방법은 솔더볼이 관통구멍내로 유입(wicking)되는 것을 방지하며, 그에 따라 수율 및 부품의 신뢰성을 증가시킨다. 일 실시예에 있어서, 패드 및 관통구멍은 패드의 상부 표면이 외부 유전체 표면의 상부 표면과 동일평면이 되도록 압축될 수 있다.

公开(公告)号：KR1020050022324A

公开(公告)日：2005-03-07

申请号：KR1020040065730

申请日：2004-08-20

Applicant: 신꼬오덴기 고교 가부시키가이샤

Inventor： 마시노나오히로

IPC: H05K3/40 ,  H05K3/46

CPC classification number: H05K3/22 ,  H01L2924/0002 ,  H05K3/102 ,  H05K3/423 ,  H05K3/4602 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09745 ,  H05K2201/1025 ,  H05K2203/107 ,  H05K2203/128 ,  H01L2924/00

Abstract: PURPOSE: A method for manufacturing a wiring board is provided to form a wiring pattern directly on the end surface of the via formed by filling the through hole formed at a substrate with a metal through a plating process. CONSTITUTION: A method for manufacturing a wiring board, comprises a step of forming a through hole(12) at a substrate(10) so as to define openings at the first and second surfaces of a wiring board; a step of plating the substrate with a metal such that a metal layer of a predetermined thickness is formed on the first and second surfaces of the wiring board and the through hole is substantially filled with the metal so as to form a via; and a step of irradiating a laser beam of a plurality of spots around the non-filled portion of the plated metal, including a dimple(20) or a seam, such that a certain part of the plated metal melts and the non-filled portion is filled with the molten metal.

Abstract translation: 目的：提供一种制造布线板的方法，以通过电镀工艺将金属填充在基板上形成的通孔形成在通孔的端面上直接形成布线图案。 构成：一种制造布线板的方法，包括在基板（10）上形成通孔（12）以在布线板的第一和第二表面处限定开口的步骤; 用金属电镀基板的步骤，使得在布线板和通孔的第一和第二表面上形成预定厚度的金属层基本上被金属填充以形成通孔; 以及将包含凹坑（20）或接缝的电镀金属的未填充部分周围的多个点的激光束照射的步骤，使得电镀金属的某一部分熔融，并且未填充部分 填充有熔融金属。

公开(公告)号：KR1019890002088B1

公开(公告)日：1989-06-16

申请号：KR1019820005898

申请日：1982-12-28

Applicant: 쓰리엠 컴퍼니

Inventor： 로버트에스.레이렉 ,  제임스지.베르그

IPC: H01R4/04

CPC classification number: H05K3/323 ,  H01L2924/0002 ,  H01R4/04 ,  H05K3/361 ,  H05K2201/09945 ,  H05K2201/1025 ,  H05K2203/1189 ,  H01L2924/00

Abstract: An insulating connector sheet adapted to make bonded electrical connections to a substrate comprises a polymeric layer in which is dispersed a monolayer of discretely separated electrically conductive elements. An electrically insulating layer is disposed over the monolayer of electrically conductive elements. The insulating layer is nontacky or poorly tacky at room temp., and provides an electrical resistance through the layer to the elements of at least one meg-ohm. The sheet is readily handleable and free from conductive bonding at room temperature.

Abstract translation: 适于与基底结合的电连接的绝缘连接片包括聚合物层，其中分散有离散分离的导电元件的单层。 电绝缘层设置在单层导电元件上。 绝缘层在室温下不粘或不粘，并且通过该层向至少一兆欧姆的元件提供电阻。 片材易于处理，在室温下无导电性接合。

公开(公告)号：US09625136B2

公开(公告)日：2017-04-18

申请号：US14436261

申请日：2013-09-03

Applicant: Toshiba Lighting & Technology Corporation

Inventor： Kiyokazu Hino ,  Takahiro Kurihara

IPC: F21V23/00 ,  F21V19/00 ,  H01R43/02 ,  F21V23/06 ,  H05K3/34 ,  H01R12/58 ,  F21V29/70 ,  H05K3/30 ,  F21S8/10 ,  F21Y101/00 ,  F21Y105/00 ,  F21Y115/30 ,  F21Y115/15

CPC classification number: F21V23/002 ,  F21S43/195 ,  F21S43/37 ,  F21S45/50 ,  F21V19/0025 ,  F21V19/003 ,  F21V19/005 ,  F21V19/0055 ,  F21V23/06 ,  F21V29/70 ,  F21Y2101/00 ,  F21Y2105/00 ,  F21Y2115/10 ,  F21Y2115/15 ,  F21Y2115/30 ,  H01R12/58 ,  H01R43/0256 ,  H05K3/306 ,  H05K3/3447 ,  H05K2201/10106 ,  H05K2201/1025 ,  H05K2201/1031 ,  H05K2201/10401 ,  Y02P70/611

Abstract: A light emitting device according to the present embodiment includes a substrate on which a wiring portion is provided; a light emitting element which is provided on the substrate and is electrically connected to the wiring portion; a feeding portion to which an electric power is supplied from the outside; a first connection portion which is provided on the substrate and is electrically connected to the wiring portion; a second connection portion which is joined to the first connection portion through soldering and includes a first opening portion into which the feeding portion is inserted; and a soldering portion which is provided between the first opening portion and the feeding portion.