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公开(公告)号:JP2005517973A
公开(公告)日:2005-06-16
申请号:JP2003568449
申请日:2003-02-12
Applicant: ユナキス・バルツェルス・アクチェンゲゼルシャフト
Inventor: エードリンガー,ヨハネス , ツェーガー,オトマール , ハイネ−ケンプケンス,クラウス
CPC classification number: G02B5/3058 , B01D21/0012 , B01D39/2051 , B01L3/502707 , B01L3/50273 , B01L3/502753 , B01L3/502761 , B01L3/502792 , B01L2200/0647 , B01L2200/0668 , B01L2200/141 , B01L2300/0681 , B01L2300/0816 , B01L2300/0825 , B01L2300/16 , B01L2400/0406 , B01L2400/0409 , B01L2400/086 , B81B1/002 , B81B2201/047 , B81B2201/10 , B81B2203/0338 , B81C1/00119 , C23C14/04 , C23C14/046 , G02B1/118 , G02B5/1809 , G02B5/1847 , G02B5/3083 , G02B2006/12097 , Y10S428/913 , Y10T428/24612 , Y10T428/24942 , Y10T428/249953 , Y10T428/249961 , Y10T428/249975 , Y10T428/249977 , Y10T428/249979 , Y10T428/24998 , Y10T428/31678 , Y10T436/111666 , Y10T436/112499 , Y10T436/25375 , Y10T436/255
Abstract: 光学成分または解析プラットフォームは、基板、基板(3)上の微細構造の配列および隣接する微細構造の側壁によって形成されたマイクロチャンネル(15,15′)を含み、マイクロチャネルの幅は基板までの距離の関数として変化し、この幅は、少なくとも1つの距離間隔内で基板からの距離が増すと連続して減少する。 このような成分またはこのようなプラットホームを生成するための方法において、表面の微細構造の配列を有する基板は、蒸気処理でコーティングされ、コーティング機構のシャドーイング効果が微細構造の側壁の上方部分の幅を少なくとも部分的に狭めることにより、少なくとも部分的に埋込まれたマイクロチャネルを形成する。
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公开(公告)号:KR100960183B1
公开(公告)日:2010-05-27
申请号:KR1020047012035
申请日:2003-02-12
Applicant: 오를리콘 서피스 솔루션스 아크티엔게젤샤프트, 페피콘
Inventor: 에드링거,요하네스 , 하이네-켐프켄스,클라우스 , 쥬게르,오쓰마르
CPC classification number: G02B1/118 , B01D21/0012 , B01D39/2051 , B01L3/502707 , B01L3/50273 , B01L3/502753 , B01L3/502761 , B01L3/502792 , B01L2200/0647 , B01L2200/0668 , B01L2200/141 , B01L2300/0681 , B01L2300/0816 , B01L2300/0825 , B01L2300/16 , B01L2400/0406 , B01L2400/0409 , B01L2400/086 , B81B1/002 , B81B2201/047 , B81B2201/10 , B81B2203/0338 , B81C1/00119 , C23C14/04 , C23C14/046 , G02B5/1809 , G02B5/1847 , G02B5/3058 , G02B5/3083 , G02B2006/12097 , Y10S428/913 , Y10T428/24612 , Y10T428/24942 , Y10T428/249953 , Y10T428/249961 , Y10T428/249975 , Y10T428/249977 , Y10T428/249979 , Y10T428/24998 , Y10T428/31678 , Y10T436/111666 , Y10T436/112499 , Y10T436/25375 , Y10T436/255
Abstract: 광학 컴포넌트 또는 분석적 플랫폼은 기판, 기판 상의 마이크로 구조 (3)의 배열 및 인접한 마이크로 구조들의 측벽에 의해 형성된 마이크로 채널 (15, 15')을 포함하고, 마이크로 채널의 폭은 기판으로부터의 거리의 함수로써 변화하고, 상기 폭은 하나 이상의 거리-간격 내에 있는 기판으로부터의 거리가 증가함에 따라서 연속적으로 감소한다. 그러한 컴포넌트 또는 그러한 플랫폼을 제조하는 방법에 있어서 표면 마이크로 구조들의 배열을 가진 기판은 코팅 메카니즘의 쉐도우잉 (shadowing) 효과들이 마이크로 구조들의 측벽들의 상부 폭의 적어도 일부를 좁아지게 하여 적어도 부분적으로 내장된 (embedded) 마이크로 채널을 형성하게 하는 방식으로 증기 처리 내에서 코팅된다.
컴포넌트, 마이크로 채널, 마이크로 구조, 코팅-
公开(公告)号:US20240279048A1
公开(公告)日:2024-08-22
申请号:US18568850
申请日:2022-06-15
Applicant: Water Stuff & Sun GmbH
Inventor: Johan BEJHED
CPC classification number: B81B1/006 , F16K99/0015 , G05D7/005 , B81B2201/054 , B81B2201/058 , B81B2201/10 , B81B2203/0338 , B81B2207/03 , F16K2099/008
Abstract: A fluid-control device comprises a stack of wafers in which flow components are provided as micro-electro-mechanical systems—MEMS. The flow components are selected from fluid-control components and/or fluid-monitor components. The fluid-control device has a first flow component that is encircled, in a main plane of the stack of wafers, by a second flow component.
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64.
公开(公告)号:US20180186627A1
公开(公告)日:2018-07-05
申请号:US15857461
申请日:2017-12-28
Applicant: Intel IP Corporation
Inventor: Gerald Ofner , Thorsten Meyer , Reinhard Mahnkopf , Christian Geissler , Andreas Augustin
CPC classification number: B81C1/00238 , B81B7/008 , B81B2201/0235 , B81B2201/0242 , B81B2201/025 , B81B2201/0257 , B81B2201/0264 , B81B2201/0271 , B81B2201/10 , B81B2207/012 , B81B2207/053 , B81B2207/07 , B81B2207/096 , B81C1/0023 , B81C2203/0792 , H01L2224/16225 , H01L2224/48091 , H01L2924/15311 , H01L2924/00014
Abstract: In embodiments, a package assembly may include an application-specific integrated circuit (ASIC) and a microelectromechanical system (MEMS) having an active side and an inactive side. In embodiments, the MEMS may be coupled directly to the ASIC by way of one or more interconnects. The MEMS, ASIC, and one or more interconnects may define or form a cavity such that the active portion of the MEMS is within the cavity. In some embodiments, the package assembly may include a plurality of MEMS coupled directly to the ASIC by way of a plurality of one or more interconnects. Other embodiments may be described and/or claimed.
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公开(公告)号:US10005659B2
公开(公告)日:2018-06-26
申请号:US15440962
申请日:2017-02-23
Applicant: Infineon Technologies AG
Inventor: Thomas Grille , Ursula Hedenig , Michael Roesner , Gudrun Stranzl , Martin Zgaga
CPC classification number: B81B7/0061 , B01D67/0034 , B81B2201/0257 , B81B2201/10 , B81C1/00904 , B81C2201/0132 , Y10T428/24273
Abstract: A hole plate and a MEMS microphone arrangement are disclosed. In an embodiment a hole plate includes a substrate with a first main surface, a second main surface, and a lateral surface and a perforation structure formed within the substrate, the perforation structure having a plurality of through-holes through the substrate, wherein the through-holes and the lateral surface are a result of a simultaneous dry etching step.
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公开(公告)号:US09663353B2
公开(公告)日:2017-05-30
申请号:US14403571
申请日:2013-06-28
Applicant: Intel IP Corporation
Inventor: Gerald Ofner , Thorsten Meyer , Reinhard Mahnkopf , Christian Geissler , Andreas Augustin
CPC classification number: B81C1/00238 , B81B7/008 , B81B2201/0235 , B81B2201/0242 , B81B2201/025 , B81B2201/0257 , B81B2201/0264 , B81B2201/0271 , B81B2201/10 , B81B2207/012 , B81B2207/053 , B81B2207/07 , B81B2207/096 , B81C1/0023 , B81C2203/0792 , H01L2224/16225 , H01L2224/48091 , H01L2924/15311 , H01L2924/00014
Abstract: In embodiments, a package assembly may include an application-specific integrated circuit (ASIC) and a microelectromechanical system (MEMS) having an active side and an inactive side. In embodiments, the MEMS may be coupled directly to the ASIC by way of one or more interconnects. The MEMS, ASIC, and one or more interconnects may define or form a cavity such that the active portion of the MEMS is within the cavity. In some embodiments, the package assembly may include a plurality of MEMS coupled directly to the ASIC by way of a plurality of one or more interconnects. Other embodiments may be described and/or claimed.
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公开(公告)号:US20080152892A1
公开(公告)日:2008-06-26
申请号:US12033235
申请日:2008-02-19
Applicant: Johannes Edlinger , Claus Heine-Kempkens , Othmar Zuger
Inventor: Johannes Edlinger , Claus Heine-Kempkens , Othmar Zuger
IPC: B32B3/26
CPC classification number: G02B1/118 , B01D21/0012 , B01D39/2051 , B01L3/502707 , B01L3/50273 , B01L3/502753 , B01L3/502761 , B01L3/502792 , B01L2200/0647 , B01L2200/0668 , B01L2200/141 , B01L2300/0681 , B01L2300/0816 , B01L2300/0825 , B01L2300/16 , B01L2400/0406 , B01L2400/0409 , B01L2400/086 , B81B1/002 , B81B2201/047 , B81B2201/10 , B81B2203/0338 , B81C1/00119 , C23C14/04 , C23C14/046 , G02B5/1809 , G02B5/1847 , G02B5/3058 , G02B5/3083 , G02B2006/12097 , Y10S428/913 , Y10T428/24612 , Y10T428/24942 , Y10T428/249953 , Y10T428/249961 , Y10T428/249975 , Y10T428/249977 , Y10T428/249979 , Y10T428/24998 , Y10T428/31678 , Y10T436/111666 , Y10T436/112499 , Y10T436/25375 , Y10T436/255
Abstract: Methods for filtering particles from a fluid are disclosed, wherein an array of microstructures defining respective microchannels having respective minimum widths are used to separate the fluid from particles to be filtered. The fluid flows through the minimum widths into the microchannels defined between adjacent microstructures. The particles to be filtered are prevented from passing through the respective minimum widths, resulting in filtration of those particles from the fluid. The microchannels can be provided with gradient characteristics to separate particles in the fluid according to size.
Abstract translation: 公开了用于从流体中过滤颗粒的方法,其中使用限定具有相应最小宽度的相应微通道的微结构阵列来将流体与要过滤的颗粒分离。 流体流过最小宽度进入相邻微结构之间限定的微通道。 要防止过滤的颗粒通过相应的最小宽度,导致这些颗粒从流体中过滤。 微通道可以具有梯度特性以根据尺寸分离流体中的颗粒。
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公开(公告)号:US20050208211A1
公开(公告)日:2005-09-22
申请号:US11104186
申请日:2005-04-12
Applicant: Johannes Edlinger , Claus Heine-Kemkens , Othmar Zuger
Inventor: Johannes Edlinger , Claus Heine-Kemkens , Othmar Zuger
IPC: B01D21/00 , B01D39/20 , B01L3/00 , B81B1/00 , C23C14/04 , G02B5/18 , G02B5/30 , G02B6/12 , B05D5/06
CPC classification number: G02B1/118 , B01D21/0012 , B01D39/2051 , B01L3/502707 , B01L3/50273 , B01L3/502753 , B01L3/502761 , B01L3/502792 , B01L2200/0647 , B01L2200/0668 , B01L2200/141 , B01L2300/0681 , B01L2300/0816 , B01L2300/0825 , B01L2300/16 , B01L2400/0406 , B01L2400/0409 , B01L2400/086 , B81B1/002 , B81B2201/047 , B81B2201/10 , B81B2203/0338 , B81C1/00119 , C23C14/04 , C23C14/046 , G02B5/1809 , G02B5/1847 , G02B5/3058 , G02B5/3083 , G02B2006/12097 , Y10S428/913 , Y10T428/24612 , Y10T428/24942 , Y10T428/249953 , Y10T428/249961 , Y10T428/249975 , Y10T428/249977 , Y10T428/249979 , Y10T428/24998 , Y10T428/31678 , Y10T436/111666 , Y10T436/112499 , Y10T436/25375 , Y10T436/255
Abstract: An optical component or an analytical platform includes a substrate, an array of microstructures on the substrate and microchannels formed by side walls of adjacent microstructures, a width of the microchannels varies as a function of distance to the substrate, the width continuously decreasing with increasing distance from the substrate within at least one distance-interval. In a method for producing such a component or such a platform a substrate with an array of surface microstructures is coated in a vapor treatment in such a way that shadowing effects of the coating mechanism narrow at least partially a width of the upper parts of side walls of the microstructures thereby forming at least partially embedded microchannels.
Abstract translation: 光学部件或分析平台包括基板,基板上的微结构阵列和由相邻微结构的侧壁形成的微通道,微通道的宽度随着距衬底的距离而变化,宽度随着距离的增加而连续减小 在至少一个距离间隔内的衬底。 在用于制造这种部件或这种平台的方法中,具有表面微结构阵列的基板以蒸气处理方式被涂覆,使得涂覆机构的遮蔽效应至少部分地缩小了侧壁上部的宽度 从而形成至少部分嵌入的微通道。
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公开(公告)号:US06780786B2
公开(公告)日:2004-08-24
申请号:US09994280
申请日:2001-11-26
Applicant: George M. Dougherty
Inventor: George M. Dougherty
IPC: H01L2131
CPC classification number: B81C1/00158 , B01D67/0072 , B01D71/02 , B01D2323/10 , B01D2325/02 , B01D2325/04 , B81B2201/10 , B81C2201/0115 , B81C2201/017 , H01L21/28525 , H01L29/16
Abstract: A membrane structure comprising a silicon film having a grain structure including grains defining pores therebetween.
Abstract translation: 一种膜结构,其包括具有晶粒结构的硅膜,所述晶粒结构包括在其间限定孔的颗
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公开(公告)号:US20030100136A1
公开(公告)日:2003-05-29
申请号:US09994280
申请日:2001-11-26
Inventor: George M. Dougherty
IPC: H01L021/00 , H01L021/44 , H01L029/82
CPC classification number: B81C1/00158 , B01D67/0072 , B01D71/02 , B01D2323/10 , B01D2325/02 , B01D2325/04 , B81B2201/10 , B81C2201/0115 , B81C2201/017 , H01L21/28525 , H01L29/16
Abstract: A membrane structure comprising a silicon film having a grain structure including grains defining pores therebetween.
Abstract translation: 一种膜结构,其包括具有晶粒结构的硅膜,所述晶粒结构包括在其间限定孔的颗
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