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公开(公告)号：US09609741B1
公开(公告)日：2017-03-28
申请号：US15272201
申请日：2016-09-21
Applicant: CANON KABUSHIKI KAISHA
Inventor： Koji Noguchi
CPC classification number: H05K1/0203 , H05K1/0206 , H05K1/0209 , H05K1/181 , H05K2201/06 , H05K2201/09227 , H05K2201/09372 , H05K2201/10015 , H05K2201/10545
Abstract: A printed wiring board has thereon an electronic component having a heat radiation pad, and an electrolytic capacitor provided for the electronic component. The printed wiring board further has thereon another electronic component having another heat radiation pad and exhibiting a higher heat value than that of the electronic component, and another electrolytic capacitor provided for the other electronic component. The heat radiation pad of the electronic component, a ground terminal of the electrolytic capacitor, the other heat radiation pad for the other electronic component, and another ground terminal of the other electrolytic capacitor are connected by using a ground conductor. In the ground conductor, a thermal resistance between the other heat radiation pad and other ground terminal is lower than the thermal resistance between the heat radiation pad and the ground terminal.
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公开(公告)号：US20150313005A1
公开(公告)日：2015-10-29
申请号：US14406913
申请日：2012-06-15
Applicant: Masashi TAKABATAKE , Kenji KASHIWAGI
Inventor： Masashi TAKABATAKE , Kenji KASHIWAGI
CPC classification number: H05K1/0213 , H05K1/025 , H05K1/0253 , H05K1/111 , H05K3/3421 , H05K2201/0776 , H05K2201/09372 , H05K2201/0969 , H05K2201/10189 , Y02P70/611
Abstract: [Object] There is suggested a printed circuit board capable of realizing impedance matching by securing joint reliability between signal pins of a surface mount connector and signal pin pads and preventing the reduction of impedance of signal pin pads while minimizing the reduction of a wirable area.[Solution] A printed circuit board equipped with a signal pin pad, which is soldered to a signal pin from a surface mount connector, and a ground layer located as a lower layer below the signal pin pad; wherein a fillet is formed around a joint area between the signal pin and the signal pin pad after soldering; wherein a cut-out portion is provided in the signal pin pad within a joint area with the signal pin; and wherein the size of the cut-out portion is set within the range of being completely covered within the joint area with the signal pin based on size tolerance of the signal pin, fabrication tolerance of the printed circuit board, and mount position tolerance of the surface mount connector.
Abstract translation: 提出了一种印刷电路板，其能够通过确保表面安装连接器的信号引脚和信号引脚焊盘之间的连接可靠性来实现阻抗匹配，并且防止信号引脚焊盘的阻抗减小，同时最小化可吸收区域的减少。 [解决方案]配备有从表面安装连接器焊接到信号引脚的信号引脚焊盘的印刷电路板和位于信号引脚焊盘下方的下层的接地层; 其中在焊接之后，在信号引脚和信号引脚焊盘之间的接合区域周围形成圆角; 其中在与所述信号引脚的接合区域内的所述信号引脚焊盘中设置切口部分; 并且其中，根据信号引脚的尺寸公差，印刷电路板的制造公差以及印刷电路板的安装位置公差，将切除部分的尺寸设定在与信号销的接合区域内完全覆盖的范围内 表面贴装连接器。
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公开(公告)号：US20130269983A1
公开(公告)日：2013-10-17
申请号：US13534217
申请日：2012-06-27
Applicant: KAI-WEN WU
Inventor： KAI-WEN WU
CPC classification number: H05K1/0253 , H01R12/53 , H01R13/6474 , H05K1/0245 , H05K1/025 , H05K1/111 , H05K1/117 , H05K3/40 , H05K2201/09372 , H05K2201/10287 , Y10T29/49004 , Y10T29/49117 , Y10T29/4913 , Y10T29/49155
Abstract: A circuit board assembly includes a circuit board, at least one pad formed on the circuit board, and at least one connection line. Each of the at least one connection line includes a connection end connected to a respective one of the at least one pad and has the same resistance value as the respective pad.
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64.发明申请
公开(公告)号：WO2015104072A9
公开(公告)日：2015-10-08
申请号：PCT/EP2014071994
申请日：2014-10-14
Applicant: AUTO KABEL MAN GMBH , TAZARINE WACIM , BETSCHER SIMON , GRONWALD FRANK
Inventor： TAZARINE WACIM , BETSCHER SIMON , GRONWALD FRANK
IPC: H05K1/02 , H01L23/367 , H05K1/05 , H05K1/11 , H05K1/14
CPC classification number: H05K1/145 , C23C14/042 , H01L23/142 , H01L23/367 , H01L23/3677 , H01L2924/0002 , H05K1/0206 , H05K1/0209 , H05K1/056 , H05K1/111 , H05K1/117 , H05K1/142 , H05K1/181 , H05K1/182 , H05K3/28 , H05K3/282 , H05K3/368 , H05K2201/09372 , H05K2201/09554 , H05K2201/10166 , H05K2201/10689 , H05K2203/1377 , H01L2924/00
Abstract: Disclosed is a circuit comprising a first printed circuit board (2a) and a second printed circuit board (2b). The first circuit board is provided with a metal supporting board (14) and an insulating layer (8) which electrically insulates the metal supporting board on a surface, the supporting board being without any insulating layer in at least one connection region (10a-10d). The supporting board is metal-coated (12) in the connection region, and a contact (30a) of a semiconductor (30) is electrically contacted on the metal coating of the connection region. The second circuit board is provided with a metal supporting board (2b), an insulator (16) that electrically insulates the metal supporting board (24) on a surface, and a conducting layer (18) that is applied to the insulator. The insulator and the conducting layer have a breakdown region (21) in at least one contact zone, and at least one metal contact pad (20) is arranged in the contact zone in such a way that the contact pad is peripherally disposed at a distance from the insulator and from the conducting layer. The circuit boards in the circuit are separated from one another by an air gap (28) and are mechanically interconnected by at least one power semiconductor device (30).
Abstract translation: 电路具有第一电路板（2a）和第二电路板（2b）中。 第一印刷电路板设置有一金属载体板（14）和所述电绝缘的绝缘层（8）的表面上的金属支撑板，其中所述支撑板在所述至少一个连接部分（10A-10D）从所述绝缘层的分类。 承载板是金属的涂布在连接区域（12）和在端子区域的金属涂层，半导体的接触（30A）（30）电接触。 第二电路板设置有金属载体板（2b）中，电绝缘的绝缘体（16）和沉积在所述绝缘体（18）上的导电层的表面上的金属载体板（24）。 绝缘体和导电层中的至少一个接触区域被穿孔（21）中的接触面积un为在支撑板的至少一个金属接触垫（20），被布置为使得周向间隔开的接触焊盘是绝缘体和导电层。 在电路中，该电路板由通过至少一个功率半导体（30）相互连接的空气间隙（28）和机械地间隔开。
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公开(公告)号：WO2013029041A3
公开(公告)日：2013-06-20
申请号：PCT/US2012052503
申请日：2012-08-27
Applicant: AMPHENOL CORP , PANIAGUA JOSE RICARDO
Inventor： PANIAGUA JOSE RICARDO
IPC: G06F17/50
CPC classification number: H05K1/116 , G06F17/5081 , G06F2217/82 , H05K1/0225 , H05K1/0245 , H05K1/0251 , H05K3/0005 , H05K3/0047 , H05K3/10 , H05K3/42 , H05K2201/0784 , H05K2201/09372 , H05K2201/095 , H05K2201/09718 , H05K2201/09727 , H05K2203/0207 , H05K2203/0242 , Y10T29/49165
Abstract: A printed circuit board for carrying high frequency signals. Conducting structures of the printed circuit board are shaped within breakout regions to limit impedance discontinuities in the signal paths between vias and conductive traces within the printed circuit board. Values of parameters of traces or anti-pads, for example, may be adjusted to provide a desired impedance. The specific values selected as part of designing a printed circuit board may match the impedance of the breakout region to that of the via. The parameters for which values are selected may include the trace width, thickness, spacing, length over an anti-pad or angle of exit from the breakout region.
Abstract translation: 用于传输高频信号的印刷电路板。 印刷电路板的导电结构在突出区域内成形以限制印刷电路板内的通孔和导电迹线之间的信号路径中的阻抗不连续性。 例如，可以调整迹线或防焊垫的参数值以提供期望的阻抗。 选择作为设计印刷电路板的一部分的特定值可以将突破区域的阻抗与通孔的阻抗相匹配。 其值被选择的参数可以包括迹线宽度，厚度，间隔，反焊盘上的长度或从中断区域退出的角度。
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Patent Agency Ranking66.发明申请
公开(公告)号：WO2016181628A1
公开(公告)日：2016-11-17
申请号：PCT/JP2016/002202
申请日：2016-04-26
Applicant: CANON KABUSHIKI KAISHA
Inventor： YAMAZAKI, Keita
CPC classification number: H05K1/0209 , H05K1/0203 , H05K1/0206 , H05K1/111 , H05K1/115 , H05K1/181 , H05K2201/09372 , H05K2201/09381 , H05K2201/094 , H05K2201/10553 , H05K2201/10727 , H05K2201/10969 , Y02P70/611
Abstract: A land group (120) with which a terminal group (220) of a semiconductor package (200) has been jointed, a conductor pattern which has been arranged in a mounting area (R1) where the semiconductor package (200) was mounted and which has been jointed with a heat radiation plate (212) of the semiconductor package (200), a conductor pattern (162) at least a part of which has been arranged on the outside of the mounting area (R1), and a conductor pattern (163) which connects the conductor patterns (161, 162) are formed on a printed-wiring board (100). The land group (120) includes a land (131) adjacent to the conductor pattern (163) and a land (132) which is not adjacent to the conductor pattern (163). The land (131) is formed in a shape different from that of the land (132) so as to be away from the conductor pattern (163).
Abstract translation: 已经连接有半导体封装（200）的端子组（220）的接地组（120），布置在安装有半导体封装（200）的安装区域（R1）中的导体图案，其中 已经与半导体封装（200）的散热板（212）接合，至少一部分布置在安装区域（R1）的外部的导体图案（162）和导体图案 连接导体图案（161,162）的印刷电路板（163）163形成在印刷电路板（100）上。 陆地组（120）包括与导体图案（163）相邻的平台（131）和与导体图案（163）不相邻的平台（132）。 该脊（131）形成为不同于脊（132）的形状，从而远离导体图案（163）。
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公开(公告)号：WO2013186927A1
公开(公告)日：2013-12-19
申请号：PCT/JP2012/065406
申请日：2012-06-15
IPC: H05K3/34
CPC classification number: H05K1/0213 , H05K1/025 , H05K1/0253 , H05K1/111 , H05K3/3421 , H05K2201/0776 , H05K2201/09372 , H05K2201/0969 , H05K2201/10189 , Y02P70/611
Abstract: 【課題】面付けコネクタの信号ピンと信号ピン用パッドとの間の接続信頼性を確保しつつ、配線可能領域の減少を可能な限り小さく抑えながら、信号ピン用パッドのインピーダンスが低下することを抑制してインピーダンス整合を行い得るプリント基板を提案する。 【解決手段】面付けコネクタからの信号ピンとはんだ接続される信号ピン用パッドと、信号ピン用パッドの下層に配置されるグランド層とを備えたプリント基板において、信号ピンと信号ピン用パッドとの接続領域周囲には、はんだ接続された後にフィレットが形成され、信号ピン用パッドには、信号ピンとの接続領域内にくり抜き部分が設けられ、くり抜き部分の寸法は、信号ピンの寸法公差、プリント基板の製造公差及び面付けコネクタの搭載位置公差に基づいて、信号ピンとの接続領域内に完全に覆われる範囲内に設定されることを特徴とする。
Abstract translation: [问题]提出一种印刷电路板，其确保表面安装连接器的信号引脚与信号引脚焊盘之间的连接可靠性，并且同时能够通过抑制信号引脚的阻抗降低来执行阻抗匹配 垫，同时抑制可以接线的区域的减少。 [解决方案]该印刷电路板设有信号针焊盘，焊盘焊接到从表面安装连接器延伸的信号引脚，以及布置在信号引脚焊盘的下层上的接地层。 印刷电路板的特征在于：在进行焊接之后形成圆角，所述圆角形成在信号针脚和信号针脚焊盘彼此接合的区域周围; 每个信号针焊盘具有设置在接合到每个信号引脚的区域中的切口部分; 并且基于信号引脚的尺寸公差，印刷电路板的制造公差和表面安装连接器的安装位置公差，将切口部分的尺寸设置在完全覆盖在与 信号引脚。
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公开(公告)号：EP3095307B1
公开(公告)日：2018-11-28
申请号：EP14783877.5
申请日：2014-10-14
Applicant: Auto-Kabel Management GmbH
Inventor： TAZARINE, Wacim , BETSCHER, Simon , GRONWALD, Frank
IPC: H05K1/02 , H05K1/05 , H01L23/367 , H05K1/11 , H05K1/14
CPC classification number: H05K1/145 , C23C14/042 , H01L23/142 , H01L23/367 , H01L23/3677 , H01L2924/0002 , H05K1/0206 , H05K1/0209 , H05K1/056 , H05K1/111 , H05K1/117 , H05K1/142 , H05K1/181 , H05K1/182 , H05K3/28 , H05K3/282 , H05K3/368 , H05K2201/09372 , H05K2201/09554 , H05K2201/10166 , H05K2201/10689 , H05K2203/1377 , H01L2924/00
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69.发明公开LEITERPLATTE, SCHALTUNG UND VERFAHREN ZUR HERSTELLUNG EINER SCHALTUNG 审中-公开LEITERPLATTE，SCHALTUNG UND VERFAHREN ZUR HERSTELLUNG EINER SCHALTUNG
公开(公告)号：EP3095307A1
公开(公告)日：2016-11-23
申请号：EP14783877.5
申请日：2014-10-14
Applicant: Auto-Kabel Management GmbH
Inventor： TAZARINE, Wacim , BETSCHER, Simon , GRONWALD, Frank
IPC: H05K1/02 , H05K1/05 , H01L23/367 , H05K1/11 , H05K1/14
CPC classification number: H05K1/145 , C23C14/042 , H01L23/142 , H01L23/367 , H01L23/3677 , H01L2924/0002 , H05K1/0206 , H05K1/0209 , H05K1/056 , H05K1/111 , H05K1/117 , H05K1/142 , H05K1/181 , H05K1/182 , H05K3/28 , H05K3/282 , H05K3/368 , H05K2201/09372 , H05K2201/09554 , H05K2201/10166 , H05K2201/10689 , H05K2203/1377 , H01L2924/00
Abstract: Disclosed is a circuit comprising a first printed circuit board (2a) and a second printed circuit board (2b). The first circuit board is provided with a metal supporting board (14) and an insulating layer (8) which electrically insulates the metal supporting board on a surface, the supporting board being without any insulating layer in at least one connection region (10a-10d). The supporting board is metal-coated (12) in the connection region, and a contact (30a) of a semiconductor (30) is electrically contacted on the metal coating of the connection region. The second circuit board is provided with a metal supporting board (2b), an insulator (16) that electrically insulates the metal supporting board (24) on a surface, and a conducting layer (18) that is applied to the insulator. The insulator and the conducting layer have a breakdown region (21) in at least one contact zone, and at least one metal contact pad (20) is arranged in the contact zone in such a way that the contact pad is peripherally disposed at a distance from the insulator and from the conducting layer. The circuit boards in the circuit are separated from one another by an air gap (28) and are mechanically interconnected by at least one power semiconductor device (30).
Abstract translation: 电路具有第一印刷电路板和第二印刷电路板。 在电路中，通过气隙彼此间隔开的印刷电路板通过至少一个功率半导体机械连接在一起。
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公开(公告)号：EP2860150A1
公开(公告)日：2015-04-15
申请号：EP14188211.8
申请日：2014-10-08
Applicant: OCE-Technologies B.V.
Inventor： Huygens, Maikel A.J. , Van der Meer, René J. , Pannekoek, Reinier , Westland, Alex N.
CPC classification number: B81C99/004 , B41J2/14233 , B41J2/161 , B41J2/1632 , B41J2/1635 , B41J2002/14241 , B41J2002/14459 , B41J2002/14491 , B81B7/007 , B81B2201/052 , B81B2207/03 , B81C1/00301 , G01R31/02 , G01R31/2601 , H05K1/0268 , H05K1/111 , H05K2201/09372
Abstract: A substrate plate (10) for at least one MEMS device (12) to be mounted thereon, the MEMS device (12) having a certain footprint on the substrate plate, and the substrate plate having a pattern (14) of electrically conductive leads to be connected to electric components (28) of the MEMS device (12), said pattern (14) forming contact pads (36, 38) within the footprint of the MEMS device (12) and comprising at least one lead structure (42) that extends on the substrate plate (10) outside of the footprint of the MEMS device (12) and connects a number of said contact pads (36) to an extra contact pad (44) said lead structure (42) being a shunt bar that interconnects a plurality of contact pads (36) of the MEMS device (12) and is arranged to be removed by means of a dicing cut (48) separating the substrate plate (10) into a plurality of chip-size units (10'), characterized in that at least a major part of said extra contact pad (44) is formed within the footprint of one of the MEMS devices (12).
Abstract translation: 一种用于要安装在其上的至少一个MEMS器件（12）的衬底板（10），所述MEMS器件（12）在所述衬底板上具有一定的占地面积，并且所述衬底板具有导电引线的图案（14） 连接到MEMS器件（12）的电气部件（28），所述图案（14）在MEMS器件（12）的占用面积内形成接触焊盘（36,38），并且包括至少一个引线结构（42），所述引线结构 在所述衬底板（10）上延伸到所述MEMS器件（12）的所述覆盖区之外，并且将多个所述接触焊盘（36）连接到额外的接触焊盘（44），所述引线结构（42）是分流棒， 所述MEMS器件（12）的多个接触焊盘（36）被布置成通过将所述基板（10）分离成多个芯片尺寸单元（10'）的切割切口（48）来移除， 其特征在于，所述额外接触焊盘（44）的至少大部分形成在MEMS器件之一的覆盖区内（ 12）。
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