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    전자 장치의 입력 모듈 배선 구조
    61.
    发明公开
    전자 장치의 입력 모듈 배선 구조 审中-公开
    电子设备的输入模块布线结构

    公开(公告)号：KR20180008945A

    公开(公告)日：2018-01-25

    申请号：KR20160089111

    申请日：2016-07-14

    IPC: H04M1/02 ,  H05K1/11 ,  H05K1/14

    CPC classification number: G06F1/183 ,  G06F1/1601 ,  G06F3/044 ,  G06F2203/04111 ,  H05K1/0298 ,  H05K1/185 ,  H05K1/189 ,  H05K3/3447 ,  H05K3/4602 ,  H05K2201/095 ,  H05K2201/10121

    Abstract: 일실시예에따른전자장치는, 쓰루홀이형성된브래킷, 상기브래킷밑에배치되는, 제1 회로기판및 상기제1 회로기판과전기적으로연결된제2 회로기판, 및상기브래킷위에배치되는제1 모듈및 제2 모듈을포함할수 있다. 상기제1 모듈및 상기제2 모듈은, 상기쓰루홀을통과하는배선구조를통해제1 회로기판과전기적으로연결될수 있다. 이외에도명세서를통해파악되는다양한실시예가가능하다.

    Abstract translation: 一种电子装置，包括具有通孔的支架，设置在支架下方的第一电路板和第二电路板。 第二电路板与第一电路板电连接，第一模块和第二模块设置在支架上方。 第一模块和第二模块经由穿过通孔的布线结构与第一电路板电连接。

    Component Carrier Method of Manufacturing the Component Carrier and Component Carrier Arrangement
    62.
    发明公开
    Component Carrier Method of Manufacturing the Component Carrier and Component Carrier Arrangement 审中-公开

    公开(公告)号：US20240334617A1

    公开(公告)日：2024-10-03

    申请号：US18609546

    申请日：2024-03-19

    Applicant: AT&S Austria Technologie & Systemtechnik AG

    Inventor： Hans PARK ,  Jeesoo MOK

    IPC: H05K3/46 ,  H05K1/02 ,  H05K3/40

    CPC classification number: H05K3/4673 ,  H05K1/0298 ,  H05K3/4038 ,  H05K2201/095 ,  H05K2203/0147

    Abstract: A component carrier and a method of manufacturing the component carrier are presented. The component carrier includes a stack having a stack with: i) at least two electrically insulating layer structures; ii) a first electrically conductive layer structure, including a first line spacing, and at least one second electrically conductive layer structure, having a second line spacing embedded in and/or provided on one of the at least two electrically insulating layer structures, respectively; iii) at least one third electrically conductive layer structure, having a third line spacing, provided on and/or in one of the at least two electrically insulating layer structures, wherein the first line spacing and the second line spacing is larger than the third line spacing, wherein the third electrically conductive layer structure is arranged between the first electrically conductive layer structure and the second electrically conductive layer structure in the stacking direction of the stack; and iv) an electrically conductive connection that electrically connects the first electrically conductive layer structure and the second electrically conductive layer structure in the stacking direction, wherein the electrically conductive connection passes through the third electrically conductive layer structure at a connection layer structure.

    PRINTED WIRING BOARD
    63.
    发明公开
    PRINTED WIRING BOARD 审中-公开

    公开(公告)号：US20240107684A1

    公开(公告)日：2024-03-28

    申请号：US18475276

    申请日：2023-09-27

    Applicant: IBIDEN CO., LTD.

    Inventor： Jun SAKAI ,  Takuya INISHI ,  Susumu KAGOHASHI

    IPC: H05K3/46 ,  H05K1/11 ,  H05K3/16

    CPC classification number: H05K3/4608 ,  H05K1/115 ,  H05K3/16 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/095

    Abstract: A printed wiring board includes a first conductor layer, a resin insulating layer having an opening, a second conductor layer including a seed layer and an electrolytic plating layer formed on the seed layer, and a via conductor including the seed and electrolytic plating layers and connecting the first and second conductor layers. The seed layer has a first portion on the surface of the insulating layer, a second portion on an inner wall surface in the opening of the insulating layer, and a third portion on a portion of the first conductor layer exposed by the opening of the insulating layer such that the first portion is thicker than the second and third portions, and the insulating layer includes resin and inorganic particles including first particles forming the inner wall surface and second particles embedded in the insulating layer and having shapes different from shapes of the first particles.

    Circuit board, preparation method thereof, and electronic device
    65.
    发明授权
    Circuit board, preparation method thereof, and electronic device 有权

    公开(公告)号：US11770902B2

    公开(公告)日：2023-09-26

    申请号：US17498767

    申请日：2021-10-12

    Applicant: WUXI SHENNAN CIRCUITS CO., LTD.

    Inventor： Yunfeng Jiao ,  Lei You ,  Zhicheng Yang ,  Lihua Zhang ,  Hua Miao

    IPC: H05K1/02 ,  H05K3/32 ,  H05K1/05

    CPC classification number: H05K3/32 ,  H05K1/0296 ,  H05K1/05 ,  H05K2201/03 ,  H05K2201/095

    Abstract: A circuit board, a preparation method thereof, and an electronic device are provided. The circuit board includes: a substrate, defining a first through-hole; a metal block, embedded in the first through-hole and fixedly connected to the substrate; a conductive line layer, arranged on at least one side surface of the substrate; wherein the conductive line layer partially covers an opening of the first through-hole on a corresponding side surface of the substrate; and a conductive channel, penetrating the conductive line layer and the metal block in turn. The conductive channel comprises a second through-hole and a conductive medium plated on a wall of the second through-hole; an end of the conductive medium is connected to the conductive line layer, and another end of the conductive medium is connected to the metal block.

    CIRCUIT BOARD STRUCTURE
    66.
    发明公开
    CIRCUIT BOARD STRUCTURE 审中-公开

    公开(公告)号：US20230262880A1

    公开(公告)日：2023-08-17

    申请号：US18162713

    申请日：2023-02-01

    Applicant: Unimicron Technology Corp.

    Inventor： Chih-Chiang Lu ,  Jun-Rui Huang ,  Ming-Hao Wu ,  Tung-Chang Lin

    IPC: H05K1/02 ,  H05K1/11

    CPC classification number: H05K1/025 ,  H05K1/112 ,  H05K1/0216 ,  H05K2201/095

    Abstract: Provided is a circuit board structure including a substrate, a loop-wrapping ground layer, an insulating structure, a first build-up layer, a top wiring layer, a bottom wiring layer, a first conductive via, and a plurality of second conductive vias. The aforementioned structure defines a signal transmitting structure. An equivalent circuit of the signal transmitting structure at least includes a first equivalent circuit, a second equivalent circuit, a third equivalent circuit and a fourth equivalent circuit, which correspond to different uniform transmitting sections respectively. The first equivalent circuit, the second equivalent circuit, the third equivalent circuit and the fourth equivalent circuit are connected in series with each other according to an ABCD transmission matrix series connection principle.

    PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
    67.
    发明申请
    PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD 审中-公开

    公开(公告)号：US20190246496A1

    公开(公告)日：2019-08-08

    申请号：US16269194

    申请日：2019-02-06

    Applicant: IBIDEN CO., LTD.

    Inventor： Youhong WU

    IPC: H05K1/02 ,  H01L23/00 ,  H05K3/46

    CPC classification number: H05K1/0298 ,  H01L24/11 ,  H01L24/14 ,  H05K3/4644 ,  H05K2201/095

    Abstract: A printed wiring board includes a base insulating layer, a conductor layer including first and second pads, a solder resist layer covering the conductor layer and having first opening exposing the first pad and second opening exposing the second pad, a first bump including base plating layer in the first opening and top plating layer on the first base layer, and a second bump including base plating layer in the second opening and top plating layer on the base layer. The second opening has smaller diameter than the first opening, and the second bump has smaller diameter than the first bump. The first base layer has flat upper surface or first recess having depth of 20 μm or less in upper central portion. The second base layer has flat upper surface, raised portion in upper central portion, or second recess shallower than the first recess in the upper central portion.

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