公开(公告)号：EP2568784A2

公开(公告)日：2013-03-13

申请号：EP11194944.2

申请日：2011-12-21

Applicant: Primax Electronics Ltd

Inventor： Su, Chun-nan ,  Peng, Chun-Ching

IPC: H05K5/02

CPC classification number: H05K5/0278 ,  H01R13/6658 ,  H01R24/62 ,  H01R43/20 ,  H05K3/4015 ,  H05K2201/09754 ,  H05K2201/1028 ,  H05K2201/1056 ,  Y10T29/49139

Abstract: The present invention discloses a USB application device including a body, a circuit board, a plurality of first electrical pins and a plurality of electrical elements. The circuit board is disposed in the body. The plurality of first electrical pins are disposed on the circuit board and expended to the body such that the plurality of first electrical pins are partly exposed to the body. A space is formed between the plurality of first electrical pins and circuit board such that the plurality of electrical elements can be disposed on the space. The length of the circuit board therefore becomes shorter, and the volume of the USB application device is reduced.

Abstract translation: 本发明揭露一种USB应用装置，其包括主体，电路板，多个第一电性接脚以及多个电性元件。 电路板设置在主体中。 多个第一电引脚设置在电路板上并且扩展到主体，使得多个第一电引脚部分地暴露于主体。 在多个第一电引脚与电路板之间形成空间，使得多个电元件可以设置在该空间上。 因此电路板的长度变短，并且USB应用装置的体积减小。

公开(公告)号：EP2019009A2

公开(公告)日：2009-01-28

申请号：EP08013346.5

申请日：2008-07-24

Applicant: NISSIN KOGYO CO., LTD.

Inventor： Takayanagi, Akihide

IPC: B60T8/36 ,  G01L19/00

CPC classification number: B60T8/368 ,  F15B13/0835 ,  F15B13/0853 ,  F15B13/086 ,  H05K1/144 ,  H05K2201/042 ,  H05K2201/09754 ,  H05K2201/0999 ,  H05K2201/10287

Abstract: An electronic control unit includes a sensor circuit board (30) which is mounted with sensors (33,34) for detecting a predetermined physical quantity; a control circuit board (20) which controls an operation of an electric component on the basis of the physical quantity detected by the sensors (33,34); and a housing (40) which accommodates the sensor circuit board (30) and the control circuit board (20), wherein the sensor circuit board (30) is mounted to a stepped portion (47) formed in an inner surface of the housing (40) so that the sensor circuit board (30) and the control circuit board (20) are arranged in a layered state, and the sensor circuit board (30) is electrically connected to the control circuit board (20) by a conductive member (49) embedded in the housing (40).

Abstract translation: 电子控制单元包括安装有用于检测预定物理量的传感器（33,34）的传感器电路板（30） 控制电路板，其根据由所述传感器检测出的物理量控制电气部件的动作; 以及容纳传感器电路板（30）和控制电路板（20）的壳体（40），其中传感器电路板（30）安装到形成在壳体的内表面中的阶梯部（47） 40），使得传感器电路板（30）和控制电路板（20）以分层状态布置，并且传感器电路板（30）通过导电部件（20）电连接到控制电路板（20） 49）嵌入在壳体（40）中。

公开(公告)号：EP1741323A4

公开(公告)日：2007-06-20

申请号：EP05713705

申请日：2005-02-17

Applicant: MERRIMAC IND INC

Inventor： LAURIELLO PHILIP J

IPC: H05K3/40 ,  H05K1/03 ,  H05K3/32 ,  H05K3/36 ,  H05K3/46 ,  H05K7/06

CPC classification number: H05K3/4092 ,  H05K3/328 ,  H05K3/4611 ,  H05K2201/0129 ,  H05K2201/015 ,  H05K2201/09145 ,  H05K2201/0919 ,  H05K2201/09754 ,  H05K2201/1034 ,  Y10T29/49126

Abstract: A signal processing module (100) can be manufactured from a plurality of composite substrate layers (104-106), each substrate layer includes elements of multiple individual processing modules. Surfaces of the layers are selectively metalicized to form signal processing elements when the substrate layers (104-406) are fusion bonded in a stacked arrangement. Prior to bonding, the substrate layers are milled to form gaps located at regions between the processing modules. Prior to bonding, the leads (110) are positioned such that they extend from signal coupling points on said metalicized surfaces into the gap regions. The substrate layers (104-106) are then fusion bonded to each other such that the plurality of substrate layers (104-106) form signal processing modules (100) with leads (110) that extend from an interior of the modules into the gap areas. The individual modules (100) may then be separated by milling the substrate layers to de-panel the modules.

Abstract translation: 信号处理模块（100）可以由多个复合衬底层（104-106）制造，每个衬底层包括多个单独处理模块的元件。 当衬底层（104-406）以层叠布置熔接时，层的表面被选择性地金属化以形成信号处理元件。 在结合之前，研磨衬底层以形成位于处理模块之间区域的间隙。 在键合之前，引线（110）被定位成使得它们从所述金属化表面上的信号耦合点延伸到间隙区域中。 然后将衬底层（104-106）彼此熔接，使得多个衬底层（104-106）形成具有引线（110）的信号处理模块（100），引线（110）从模块的内部延伸到间隙 区域。 然后可以通过研磨衬底层来分离各个模块（100）以去除模块的面板。

公开(公告)号：EP1447280B1

公开(公告)日：2006-11-02

申请号：EP04003522.2

申请日：2004-02-17

Applicant: DENSO CORPORATION

Inventor： Kato, Keiichi ,  Morishima, Tamotsu

IPC: B60R16/00

CPC classification number: B60R16/0239 ,  H05K1/141 ,  H05K3/103 ,  H05K3/284 ,  H05K3/3447 ,  H05K2201/09754 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2201/10287 ,  H05K2203/1316

公开(公告)号：EP1603158A1

公开(公告)日：2005-12-07

申请号：EP04717227.5

申请日：2004-03-04

Applicant: THE FURUKAWA ELECTRIC CO., LTD.

Inventor： SHIRAI, Takehiro, The Furukawa Electric Co., Ltd. ,  IWASE, Masayuki, The Furukawa Electric Co., Ltd.

IPC: H01L23/50

CPC classification number: G02B6/4201 ,  G02B6/3885 ,  G02B6/4277 ,  G02B6/428 ,  G02B6/4292 ,  H01L23/24 ,  H01L23/49861 ,  H01L24/48 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0219 ,  H05K1/056 ,  H05K3/06 ,  H05K3/44 ,  H05K2201/09509 ,  H05K2201/09554 ,  H05K2201/09754 ,  H05K2201/10121 ,  H05K2203/0323 ,  Y10T29/49121 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A printed wiring board (10) includes a plurality of conductor plates (10a) spaced apart from one another including at least one conductor plate that is used as a lead for electrical connection with an external circuit; an insulating layer (10b) formed on or astride the conductor plates or on and astride the conductor plates; and a plurality of wiring patterns (10d) formed on the insulating layer. At least one of the conductor plates is electrically connected with at least one of the wiring patterns via a via-hole (11a), a method of manufacturing the printed wiring board, and a lead frame package and an optical module that use the printed wiring board.

Abstract translation: 印刷电路板（10）包括彼此间隔开的多个导体板（10a），包括至少一个用作与外部电路电连接的引线的导体板; 绝缘层（10b），其形成在导体板上或跨越导体板上或跨越导体板; 以及形成在所述绝缘层上的多个布线图案（10d）。 导体板中的至少一个通过通孔（11a）至少一个布线图案，制造印刷线路板的方法和引线框架封装以及使用印刷布线的光学模块电连接 板。

公开(公告)号：EP1447280A3

公开(公告)日：2005-08-10

申请号：EP04003522.2

申请日：2004-02-17

Applicant: DENSO CORPORATION

Inventor： Kato, Keiichi ,  Morishima, Tamotsu

IPC: B60R16/00

CPC classification number: B60R16/0239 ,  H05K1/141 ,  H05K3/103 ,  H05K3/284 ,  H05K3/3447 ,  H05K2201/09754 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2201/10287 ,  H05K2203/1316

Abstract: In a vehicle electronic control unit, a power device (21) and a circuit component (22-25), which structure a circuit in which current flows when the power device (21) is driven, and a printed board (31) are disposed within an aluminum case (30) as a housing. Both the power device (21) and the circuit component (22-25) are disposed within a resin mold unit (40) in a state where both the power device (21) and the circuit component (22-25) are wired so that a loop circuit is structured as a current path. Both the power device (21) and the circuit component (22-25) are mounted on the printed board (31) by using a connection terminal (41) which protrude from the resin mold unit (40). According to the vehicle electronic control unit, noise and efficiency of the circuit can be improved because a loop of large current can be reduced.

公开(公告)号：EP0164674A3

公开(公告)日：1987-01-07

申请号：EP85106835

申请日：1985-06-03

Applicant: Advanced Technology Laboratories, Inc.

Inventor： Frey, Gregg W.

IPC: H01B01/22

CPC classification number: H05K3/4007 ,  C08K7/18 ,  C09J5/02 ,  H01B1/22 ,  H05K3/244 ,  H05K3/323 ,  H05K3/388 ,  H05K2201/0317 ,  H05K2201/0367 ,  H05K2201/0373 ,  H05K2201/09754 ,  H05K2201/10234 ,  H05K2201/10977 ,  C08L63/00

Abstract: The present invention is a method and structure which produces extremely thin, electrically conductive epoxy bonds (24) between two substrates (12, 14). Copper microspheres (26), having an average diameter of about 2 microns are bound in an epoxy layer (28) which bonds two substrates (12, 14) together. The microspheres (26) make electrical contact between the substrates (12, 14) while providing inter- sphere gaps which are filled with the epoxy which actually bonds the substrates (12, 14) together.

公开(公告)号：US12004288B2

公开(公告)日：2024-06-04

申请号：US17184793

申请日：2021-02-25

Applicant: Teradyne, Inc.

Inventor： Andrew Westwood

IPC: G01R31/00 ,  G01R1/04 ,  G01R31/28 ,  H01P3/08 ,  H05K1/02

CPC classification number: H05K1/0222 ,  G01R1/0433 ,  G01R1/0466 ,  G01R1/0483 ,  G01R31/2886 ,  H01P3/08 ,  H05K1/0251 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/14 ,  H05K2201/09609 ,  H05K2201/09754 ,  H05K2201/09809

Abstract: An example printed circuit board (PCB) includes a substrate having layers of a dielectric material, where the layers of dielectric material include a first layer and a second layer; a conductive trace that is between the first layer and the second layer and that is parallel to the first layer and the second layer along at least part of a length of the conductive trace; and a conductive via that extends at least part-way through the layers of dielectric material and that connects electrically to the conductive trace, where the conductive via is configured also to connect electrically to a signal input to receive or to transmit a signal that has a center frequency span.

公开(公告)号：US11812557B2

公开(公告)日：2023-11-07

申请号：US17273249

申请日：2019-09-04

Applicant: Pilkington Group Limited

Inventor： Stephen Roland Day

IPC: H05K1/18 ,  H05K1/14 ,  H05K3/00 ,  H05K3/28

CPC classification number: H05K1/187 ,  H05K1/147 ,  H05K3/0097 ,  H05K3/284 ,  H05K2201/09754 ,  H05K2201/10106 ,  H05K2201/10151

Abstract: A method of making an electrical device is described. The method comprises the steps: (i) providing a layer of interlayer material having a first major surface and a second opposing major surface; (ii) positioning at least a first electrically operable component on the first major surface of the first layer of interlayer material, the first electrically operable component being mounted on a first circuit board; and (iii) providing a layer of adhesive material, preferably as a liquid, to cover at least a portion of the first major surface of the layer of interlayer material and at least a portion of the first electrically operable component and/or at least a portion of the first circuit board such that following step (iii) the first electrically operable component is fixed on the layer of interlayer material by at least a portion of the layer of adhesive material.

公开(公告)号：US20180098431A1

公开(公告)日：2018-04-05

申请号：US15689206

申请日：2017-08-29

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jin Yong PARK ,  Jeong Geun KIM ,  Si Young PARK

IPC: H05K1/18 ,  H01R4/58 ,  H05K1/11 ,  H05K3/34

CPC classification number: H05K1/184 ,  H01R4/58 ,  H01R12/52 ,  H01R12/57 ,  H01R12/58 ,  H01R12/73 ,  H05K1/0213 ,  H05K1/115 ,  H05K1/145 ,  H05K3/341 ,  H05K3/3457 ,  H05K7/142 ,  H05K2201/09072 ,  H05K2201/09754 ,  H05K2201/0999 ,  H05K2201/10189 ,  H05K2201/1028 ,  H05K2201/10295 ,  H05K2201/10303 ,  H05K2201/10409

Abstract: In accordance with an aspect of the present disclosure, a contact structure for an electronic device may include a printed circuit board (PCB) including at least one hole vertically formed through the PCB, a housing (e.g., a mechanical part) on which the PCB is seated, and a contact element, at least part of which is brought into contact with the housing disposed on a side of the hole of the PCB and below the same. The contact element may include a contact part soldered on a peripheral portion around the hole, and a protrusion passing through the hole and making contact with the housing disposed below the PCB.