公开(公告)号：EP0969707B1

公开(公告)日：2006-12-13

申请号：EP99201699.8

申请日：1999-05-28

Applicant: MATSUSHITA ELECTRIC WORKS, LTD.

Inventor： Yoshioka, Hirokazu ,  Yoshida, Norio ,  Tanaka, Kenichiro

IPC: H05K3/46 ,  H05K3/00

CPC classification number: H05K3/4652 ,  H05K1/116 ,  H05K3/0035 ,  H05K3/0044 ,  H05K3/0055 ,  H05K3/421 ,  H05K3/4644 ,  H05K2201/0969 ,  H05K2201/098 ,  H05K2201/09863 ,  H05K2203/025 ,  H05K2203/0554 ,  H05K2203/0796 ,  H05K2203/095 ,  H05K2203/1383 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49158 ,  Y10T29/4916 ,  Y10T29/49165

公开(公告)号：EP0971570A4

公开(公告)日：2006-01-04

申请号：EP98901002

申请日：1998-01-23

Applicant: IBIDEN CO LTD

Inventor： TAKADA MASARU ,  TSUKADA KIYOTAKA ,  KOBAYASHI HIROYUKI ,  MINOURA HISASHI ,  UKAI YOSHIKAZU ,  KONDO MITSUHIRO

IPC: B23K26/00 ,  H01L21/48 ,  H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  H05K1/18 ,  H05K3/00 ,  H05K3/34 ,  H05K3/38 ,  H05K3/40 ,  H05K3/42 ,  H05K3/46

CPC classification number: H05K3/4652 ,  H01L21/486 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15153 ,  H01L2924/1517 ,  H05K1/0203 ,  H05K1/021 ,  H05K1/0271 ,  H05K1/0366 ,  H05K1/112 ,  H05K1/116 ,  H05K1/182 ,  H05K3/0035 ,  H05K3/0061 ,  H05K3/3468 ,  H05K3/3484 ,  H05K3/385 ,  H05K3/4038 ,  H05K3/421 ,  H05K3/423 ,  H05K3/427 ,  H05K3/428 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4611 ,  H05K2201/0305 ,  H05K2201/0394 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/09518 ,  H05K2201/0969 ,  H05K2201/09781 ,  H05K2201/09845 ,  H05K2201/09854 ,  H05K2201/09863 ,  H05K2203/0315 ,  H05K2203/041 ,  H05K2203/0554 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00014

Abstract: When a printed wiring board which has inner layer conductor circuits (161 and 131) between insulating layers (101 - 103) and blind via-holes (141 and 142) made from the top surface of the insulating layer to the inner layer conductor circuits is manufactured, a hole (160) is provided beforehand in the center part of the inner layer conductor circuits (161) at the bottom of the blind via-hole (141), and a laser beam is applied from the top surface side of the insulating layer to form the blind via-holes (141 and 142). After that, metal plating films are formed on the surfaces of the inner layer conductor circuits (131 and 161) and the blind via-holes (141 and 142).

Abstract translation: 一种制造印刷电路板（210）的方法，包括由合成树脂制成的至少两个绝缘层（211,212,213），布置在绝缘层之间的内层导体电路（221-225）和多个盲孔（ 3A-3E），其由最外表面朝向内层导体电路（221-225）形成，并且通过在形成盲通孔（3A-3E）的每一部分上依次照射激光束而具有不同的深度，其特征在于，最浅盲 通过使用具有形成标准孔所需的能量强度的标准激光束（242）将通孔（3A-3E）形成为标准孔，并且将标准激光束（242）多次照射 形成具有更深深度的盲孔（3B，3D，3E）。

公开(公告)号：EP1484952A1

公开(公告)日：2004-12-08

申请号：EP03703355.2

申请日：2003-02-21

Applicant: Fujikura Ltd.

Inventor： ITO, Shouji, FUJIKURA LTD. SAKURA WORKS ,  NAKAO, Osamu, FUJIKURA LTD. SAKURA WORKS ,  HIGUCHI, Reiji, FUJIKURA LTD. SAKURA WORKS ,  OKAMOTO, Masahiro, FUJIKURA LTD. SAKURA WORKS

IPC: H05K3/46 ,  H05K1/11 ,  H05K3/40

CPC classification number: H05K3/4617 ,  H05K3/386 ,  H05K3/4069 ,  H05K3/4652 ,  H05K2201/0195 ,  H05K2201/0394 ,  H05K2201/0969 ,  H05K2201/09827 ,  H05K2201/09863 ,  H05K2203/0191 ,  H05K2203/1453 ,  Y10T29/49165 ,  Y10T428/12181 ,  Y10T428/24917

Abstract: A multilayer wiring board assembly component comprises: an insulating substrate component (the insulating resin layer 111); a conductive layer 112 formed on one surface of said insulating substrate component 111 in the form of an electrode pattern; an adhesive layer 113 formed on the other surface of said insulating substrate component 111; and a conductive resin composition 115 with which is filled a through hole passing through said insulating substrate component 111, said adhesive layer and said conductive layer in order to make interlayer interconnection. The bore diameter of the conductive layer portion 114b of the through hole 114 is smaller than the bore diameter of the insulating resin layer portion and the adhesive layer portion 114a to establish electrical connection between the conductive resin composition 115 and the conductive layer 112 by the rare surface 112a of the conductive layer 112.

Abstract translation: 一种多层电路板的安装部件包括：绝缘基片部件（在绝缘树脂层111）; 一导电层112上形成的电极图案的形成所述绝缘基板组件111的一个表面上; 形成在所述绝缘基板组件111的另一表面上的粘合层113; 和导电性树脂组合物115与所有其填充穿过所述绝缘基板组件111的通孔，所述粘合层和所述，为了使层间互连导电层。 贯通孔114的导电层部114b的孔直径大于所述绝缘树脂层的部分的孔直径和粘结层部分114A以建立由所述罕见的导电性树脂组合物115和导电层112之间的电连接更小的 导电层112 的面112a

公开(公告)号：EP1220591A2

公开(公告)日：2002-07-03

申请号：EP01130722.0

申请日：2001-12-21

Applicant: Denso Corporation

Inventor： Yazaki, Yoshitaro ,  Shiraishi, Yoshihiko ,  Kondo, Koji ,  Harada, Toshikazu ,  Yokochi, Tomohiro

IPC: H05K3/46 ,  H05K3/40

CPC classification number: H05K3/4632 ,  H05K1/095 ,  H05K3/4069 ,  H05K3/4617 ,  H05K2201/0129 ,  H05K2201/0272 ,  H05K2201/0305 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/09827 ,  H05K2201/09863 ,  H05K2203/0425 ,  H05K2203/1131 ,  Y10T428/24917

Abstract: A heated and pressed printed wiring board (100) is made by filling via-holes formed in layers of insulating film of the wiring board (100) with an interlayer conducting material. The insulating film is stacked with conductor patterns (22), and each conductor pattern (22) closes a via hole (24). The interlayer conducting material forms a solid conducting material (51, 52) in the via holes (24) after a heating a pressing procedure. The solid conducting material (51, 52) includes two types of conducting materials. The first type of conducting material (51) includes a metal, and the second type of conductive material (52) includes an alloy formed by the metal and conductor metal of the conductor patterns (22). The conductor patterns (22) are electrically connected reliably without relying on mere mechanical contact.

Abstract translation: 通过用层间导电材料填充布线板（100）的绝缘膜形成的通孔来制造加热压制印刷线路板（100）。 绝缘膜与导体图案（22）堆叠，并且每个导体图案（22）封闭通孔（24）。 层压导电材料在加压压制程序之后在通孔（24）中形成固体导电材料（51,52）。 固体导电材料（51,52）包括两种类型的导电材料。 第一类导电材料（51）包括金属，第二类导电材料（52）包括由导体图案（22）的金属和导体金属形成的合金。 导体图案（22）可靠地电连接，而不依赖于机械接触。

公开(公告)号：EP0804865A1

公开(公告)日：1997-11-05

申请号：EP96900386.0

申请日：1996-01-18

Applicant: Coates Brothers PLC

Inventor： COCKETT, Michael, Anthony ,  THATCHER, Wrenford, John ,  COURTNEY, Robert, William

IPC: H05K3 ,  H05K1

CPC classification number: H05K3/386 ,  H05K1/095 ,  H05K3/0023 ,  H05K3/102 ,  H05K3/107 ,  H05K3/1258 ,  H05K2201/0272 ,  H05K2201/09863 ,  H05K2203/0425 ,  H05K2203/0568

Abstract: A method of forming a conductive path (11) of an electrical circuit board (1) comprises applying an adhesive (7) to a substrate (3) and applying a conductive ink (25) over the adhesive (7) in a pattern corresponding to the desired conductive path (11). A photoimageable layer (9) can be applied over the adhesive (7) or substrate and subjected to a photoimaging and developing process. This forms a track (13) in the photoimageable layer (9), corresponding to the desired conductive path (11). The conductive ink (25) is introduced into the track (13) prior to heating. The heating affects curing of the adhesive (7) and bonding of the conductive ink (25) to the adhesive layer (7) simultaneously with reflow or sintering of a metallic component (27) of the ink. The ink (25) comprises a metallic component (27) and a flux but is substantially free of any resin or any reactive monomer or polymer.

公开(公告)号：US10076044B2

公开(公告)日：2018-09-11

申请号：US15027756

申请日：2014-09-24

Applicant: HITACHI CHEMICAL COMPANY, LTD.

Inventor： Nobuyuki Yoshida

IPC: H05K3/42 ,  H05K3/00 ,  H05K3/46

CPC classification number: H05K3/423 ,  H05K3/0026 ,  H05K3/0035 ,  H05K3/421 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/09863 ,  H05K2201/2072 ,  H05K2203/1184 ,  H05K2203/1476 ,  H05K2203/1492

Abstract: The present invention is a method for manufacturing a multilayer wiring board having (1) a step of providing with a hole for a via hole from a metal foil for an upper layer wiring pattern to an inner layer wiring pattern by using a conformal method or a direct laser method, and (2) a step of forming a via hole by forming electrolytic filling plating layers in the hole for a via hole, wherein the formation of the electrolytic filling plating layers in the step (2) is carried out by repeating change in electric current density of temporarily decreasing the electric current density of electrolytic filling plating in the middle of the electrolytic filling plating and then increasing it again, two or more times before the electrolytic filling plating layers block an opening of the hole for a via hole.

公开(公告)号：US20140295697A1

公开(公告)日：2014-10-02

申请号：US14227574

申请日：2014-03-27

Applicant: Molex Incorporated

Inventor： Toshihiro NIITSU ,  Motohisa Haga

IPC: H01R12/52

CPC classification number: H01R12/523 ,  H01R12/79 ,  H05K1/117 ,  H05K3/326 ,  H05K3/365 ,  H05K3/368 ,  H05K3/403 ,  H05K2201/0367 ,  H05K2201/09163 ,  H05K2201/0919 ,  H05K2201/09863 ,  H05K2201/10303 ,  H05K2201/10386

Abstract: A connector for a multilayered board to connect a flat cable to a middle layer of a multilayered board while minimizing the impact due to variations in the dimensional precision and strength of multilayered boards and/or preventing deformation of the multilayered board and improving contact stability. The connector includes a board-side connecting portion and a cable-side connecting portion. The board-side connecting portion includes a column-shaped terminal, and the cable-side connecting portion includes flat terminals. The column-shaped terminal protrudes from the middle layer of the multilayered board in the thickness direction. The flat terminals include resilient contact portions, contacting a side surface portion of the column-shaped terminal from the width direction of the insertion slot in response to insertion of the cable-side connecting portion into the insertion slot.

Abstract translation: 一种用于多层板的连接器，用于将扁平电缆连接到多层板的中间层，同时最小化由于多层板的尺寸精度和强度的变化引起的冲击和/或防止多层板的变形并提高接触稳定性。 连接器包括板侧连接部和电缆侧连接部。 板侧连接部包括柱状端子，电缆侧连接部包括扁平端子。 柱状端子在厚度方向从多层板的中间层突出。 扁平端子包括弹性接触部分，其响应于电缆侧连接部分插入到插槽中而从插入槽的宽度方向接触到柱状端子的侧表面部分。

公开(公告)号：US20120125680A1

公开(公告)日：2012-05-24

申请号：US13357663

申请日：2012-01-25

Applicant: Naohiro Hirose ,  Kouta Noda ,  Hiroshi Segawa ,  Honjin En ,  Kiyotaka Tsukada ,  Naoto Ishida ,  Kouji Asano ,  Atsushi Shouda

Inventor： Naohiro Hirose ,  Kouta Noda ,  Hiroshi Segawa ,  Honjin En ,  Kiyotaka Tsukada ,  Naoto Ishida ,  Kouji Asano ,  Atsushi Shouda

IPC: H05K1/02 ,  C25D5/02 ,  B23K1/20 ,  B23K31/02 ,  H05K3/46 ,  C25D7/00

CPC classification number: H05K3/4652 ,  B23K26/389 ,  H01L2224/16225 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K1/0201 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/0055 ,  H05K3/0094 ,  H05K3/108 ,  H05K3/28 ,  H05K3/381 ,  H05K3/383 ,  H05K3/384 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4623 ,  H05K3/4661 ,  H05K2201/0195 ,  H05K2201/0352 ,  H05K2201/0358 ,  H05K2201/062 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09827 ,  H05K2201/09863 ,  H05K2201/09881 ,  H05K2203/0307 ,  H05K2203/0353 ,  H05K2203/0554 ,  H05K2203/0773 ,  H05K2203/107 ,  H05K2203/121 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: An opening is formed in resin 20 by a laser beam so that a via hole is formed. At this time, copper foil 22, the thickness of which is reduced (to 3 μm) by performing etching to lower the thermal conductivity is used as a conformal mask. Therefore, an opening 20a can be formed in the resin 20 if the number of irradiation of pulse-shape laser beam is reduced. Therefore, occurrence of undercut of the resin 20 which forms an interlayer insulating resin layer can be prevented. Thus, the reliability of the connection of the via holes can be prevented. Thus, the reliability of the connection of the via holes can be improved.

Abstract translation: 通过激光束在树脂20中形成开口，从而形成通孔。 此时，通过进行蚀刻来降低导热率的铜箔22的厚度（3μm）被用作保形掩模。 因此，如果脉冲形激光束的照射次数减少，则可以在树脂20中形成开口20a。 因此，可以防止形成层间绝缘树脂层的树脂20的底切的发生。 因此，可以防止通孔的连接的可靠性。 因此，可以提高通孔连接的可靠性。

公开(公告)号：US20080189943A1

公开(公告)日：2008-08-14

申请号：US12098582

申请日：2008-04-07

Applicant: Naohiro HIROSE ,  Kouta Noda ,  Hiroshi Segawa ,  Honjin En ,  Kiyotaka Tsukada ,  Naoto Ishida ,  Kouji Asano ,  Atsushi Shouda

Inventor： Naohiro HIROSE ,  Kouta Noda ,  Hiroshi Segawa ,  Honjin En ,  Kiyotaka Tsukada ,  Naoto Ishida ,  Kouji Asano ,  Atsushi Shouda

IPC: H05K3/42 ,  H01L21/306

CPC classification number: H05K3/4652 ,  B23K26/389 ,  H01L2224/16225 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K1/0201 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/0055 ,  H05K3/0094 ,  H05K3/108 ,  H05K3/28 ,  H05K3/381 ,  H05K3/383 ,  H05K3/384 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4623 ,  H05K3/4661 ,  H05K2201/0195 ,  H05K2201/0352 ,  H05K2201/0358 ,  H05K2201/062 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09827 ,  H05K2201/09863 ,  H05K2201/09881 ,  H05K2203/0307 ,  H05K2203/0353 ,  H05K2203/0554 ,  H05K2203/0773 ,  H05K2203/107 ,  H05K2203/121 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: An opening is formed in resin 20 by a laser beam so that a via hole is formed. At this time, copper foil 22, the thickness of which is reduced (to 3 μm) by performing etching to lower the thermal conductivity is used as a conformal mask. Therefore, an opening 20a can be formed in the resin 20 if the number of irradiation of pulse-shape laser beam is reduced. Therefore, occurrence of undercut of the resin 20 which forms an interlayer insulating resin layer can be prevented. Thus, the reliability of the connection of the via holes can be improved.

Abstract translation: 通过激光束在树脂20中形成开口，从而形成通孔。 此时，通过进行蚀刻来降低导热率的铜箔22的厚度（3μm）被用作保形掩模。 因此，如果脉冲形激光束的照射次数减少，则可以在树脂20中形成开口部20a。 因此，可以防止形成层间绝缘树脂层的树脂20的底切的发生。 因此，可以提高通孔连接的可靠性。

公开(公告)号：US20080173473A1

公开(公告)日：2008-07-24

申请号：US11875486

申请日：2007-10-19

Applicant: Naohiro HIROSE ,  Kouta Noda ,  Hiroshi Segawa ,  Honjin En ,  Kiyotaka Tsukada ,  Naoto Ishida ,  Kouji Asano ,  Atsushi Shouda

Inventor： Naohiro HIROSE ,  Kouta Noda ,  Hiroshi Segawa ,  Honjin En ,  Kiyotaka Tsukada ,  Naoto Ishida ,  Kouji Asano ,  Atsushi Shouda

IPC: H01R12/04

CPC classification number: H05K3/4652 ,  B23K26/389 ,  H01L2224/16225 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K1/0201 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/0055 ,  H05K3/0094 ,  H05K3/108 ,  H05K3/28 ,  H05K3/381 ,  H05K3/383 ,  H05K3/384 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4623 ,  H05K3/4661 ,  H05K2201/0195 ,  H05K2201/0352 ,  H05K2201/0358 ,  H05K2201/062 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09827 ,  H05K2201/09863 ,  H05K2201/09881 ,  H05K2203/0307 ,  H05K2203/0353 ,  H05K2203/0554 ,  H05K2203/0773 ,  H05K2203/107 ,  H05K2203/121 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: An opening is formed in resin 20 by a laser beam so that a via hole is formed. At this time, copper foil 22, the thickness of which is reduced (to 3 μm) by performing etching to lower the thermal conductivity is used as a conformal mask. Therefore, an opening 20a can be formed in the resin 20 if the number of irradiation of pulse-shape laser beam is reduced. Therefore, occurrence of undercut of the resin 20 which forms an interlayer insulating resin layer can be prevented. Thus, the reliability of the connection of the via holes can be improved.

Abstract translation: 通过激光束在树脂20中形成开口，从而形成通孔。 此时，通过进行蚀刻来降低导热率的铜箔22的厚度（3μm）被用作保形掩模。 因此，如果脉冲形激光束的照射次数减少，则可以在树脂20中形成开口部20a。 因此，可以防止形成层间绝缘树脂层的树脂20的底切的发生。 因此，可以提高通孔连接的可靠性。