Abstract:
PROBLEM TO BE SOLVED: To provide a radiation sensitive resin composition excellent in resolution, developability, heat resistance, pattern shape, margin for exposure and focus latitude, having good balance of these characteristics and suitable for use as a positive type resist. SOLUTION: The radiation sensitive resin composition contains (A) an alkali- soluble novolak resin obtained by condensing specified first phenols (2,4- dimethylphenol, 2-methyl-4-ethylphenol, etc.), specified second phenols (m-cresol, p-cresol, 2,5-dimethylphenol, etc.), and an aldehyde and (B) a quinonediazidosulfonic ester compound of a phenol compound having a structure corresponding to quaternary carbon in a position adjacent to a hydroxyl group.
Abstract:
PROBLEM TO BE SOLVED: To provide a new polysiloxane useful as a resin component for a resist material and the like, excellent in dry-etching resistance, and also excellent in basic properties as the resist such as transparency, sensibility, resolution and development to radiation. SOLUTION: The polysiloxane is composed of a structural unit (I) and/or the structural unit (II), expressed by the following general formula (1), wherein a weight-average molecular weight reduced to polystylene is 500-1,000,000. [Formula (1), each R denotes a hydrogen atom or a methyl group, independently each other, R' denotes a hydrogen atom, monovalent hydrocarbon group, monovalent hydrocarbon-halide group, halogen atom or primary to tertiary amino group, and n is an integer of 1-3].
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation sensitive resin composition having high transparency to radiation, excellent in sensitivity, resolution and pattern shape and less liable to a change in line width due to the increase and decrease of space width as a chemical amplification type resist sensitive particularly to far UV typified by ArF excimer laser beam (193 nm wavelength). SOLUTION: The radiation sensitive resin composition contains (A1) a resin containing norbornene repeating units each having a (substituted) carboxylic acid amide group typified by an N,N-dimethylnorbornene-5-carboxylic acid amide or an N,N-dimethyltetracyclo[4.4.0.12,5.17,10]dodeca-3-ene-8-carboxylic acid amide or (A2) a resin containing (substituted) (meth)acrylamide repeating units typified by N,N-dimethyl(meth)acrylamide and (B) a radiation sensitive acid generating agent.
Abstract:
PROBLEM TO BE SOLVED: To provide a vinylphenylpropionic acid derivative having an acid- decomposable substituent, and to provide a method for producing the same. SOLUTION: This derivative is, for example, a compound represented by the formula. The compound is produced, for example, by reacting t-butyl bromoacetate with tri-n-butylphosphine, reacting the produced corresponding quaternary phosphonium salt with a base, reacting the produced corresponding phosphorus ylide with 2,4,6-tris(3',5'-di-t-butyl-4'-hydroxybenzyl)methylstyrene, and then hydrolyzing the obtained corresponding quaternary phosphonium salt.
Abstract:
PROBLEM TO BE SOLVED: To provide a sulfur atom-containing polymer which contains sulfur atoms in a high density and is composed of repeating units having many aromatic rings, and to provide a method for producing the same. SOLUTION: This polymer is composed of repeating units represented by formula (1) and is obtained by the thermal polymerization of a cyclic thioaryl ester represented by formula (2). A compound selected from among quaternary onium salts and crown ether compounds is used as a polymerization catalyst.
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation sensitive resin composition having superior dry etching resistance and high transparency to radiation, excellent in basic physical properties as a resist such as sensitivity, resolution and pattern shape, excellent also in shelf stability as a composition and retaining satisfactory adhesiveness to a substrate. SOLUTION: The radiation sensitive resin composition contains (A) a resin having repeating units derived from a derivative substituted by an oxygen- containing polar group (e.g. a hydroxyl or hydroxymethyl group) or a nitrogen- containing polar group (e.g. a cyano group), e.g. bicyclo[2.2.1]hept-2-ene or tetracyclo[4.4.0.12,5.17,10]dodec-3-ene, repeating units derived from maleic anhydride and repeating units derived from an acid dissociable ester derivative of (meth)acrylic acid typified by formula 1, 2 or 3 and (B) a radiation sensitive acid generating gent.
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation sensitive resin composition having high transparency to radiation as a chemical amplification type resist, excellent in basic physical properties as a resist such as dry etching resistance, sensitivity, resolution and pattern shape, not causing development defects in microfabrication and capable of producing a semiconductor device in a high yield. SOLUTION: The radiation sensitive resin composition contains (A) an alkali- insoluble or slightly alkali-soluble acid-dissociable group-containing resin having a skeleton of formula 1 preferably as a group of formula 2-1 or 2-2 and convertible to an alkali-soluble resin when the acid-dissociable group is dissociated and (B) a radiation sensitive acid generating agent. The component A is typified by a copolymer comprising repeating units of formula 3.
Abstract:
PROBLEM TO BE SOLVED: To provide a styrene compound having a carboxy or ester group and its production method. SOLUTION: A compound represented by the formula (wherein R1 to R7 are each H, a 1-30C alkly, or phenyl; R8 is a 1-50C alkyl, cholesteryl, cholestaryl, a 1-20C polyfluoroalkyl, phenyl, or an alkylphenyl having a 1-50C alkyl; n is 1-30; and m is 0 or 1) is provided together with its production method.
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation sensitive material superior in sensitivity, developability, etching endurance, heat resistance, and adhesion to a substrate and developable with an aqueous alkaline developing solution and usable for a positive resist for manufacturing the semiconductor integrated circuit and the like by using a copolymer composed essentially of repeating units derived from specified monomers. SOLUTION: The radiation sensitive material is composed essentially of repeating units derived from the monomers each represented by formulae I and II in which each of (a) and (b) is an integer of 0-10; each of (b) and (c) is an integer of 1-10; (d) is an integer 0-10; (e) is an integer of 0-5; R1 is an H atom or a 1-5C alkyl or phenyl group; R2 is a halogen atom or a 1-5C alkyl or such alkoxy or phenyl or 2-10 dialkylamino group, and when R2 exists by >=2, each of them may be same or different.
Abstract:
PROBLEM TO BE SOLVED: To provide a resin composition for forming a cured film, which can form a cured film having excellent surface hardness and capable of fully satisfying general characteristics such as chemical resistance, heat resistance, transmittance, and dielectric constant and is excellent in storage stability.SOLUTION: The present invention is the thermosetting resin composition for forming a cured film, which contains [A] a polymer containing: a structural unit (I) containing at least one selected from the group consisting of a group represented by formula (1) and a group represented by formula (2); and a structural unit (II-1) containing a crosslinkable group (a1). In the formula (1), Rand Rare each a hydrogen atom, a C1-C4 alkyl group, or a C1-C4 fluorinated alkyl group. In the formula (2), Rand Rare each a hydrogen atom, a halogen atom, a C1-C4 alkyl group, or a C1-C4 fluorinated alkyl group. Preferably, the crosslinkable group (a1) is at least one selected from the group consisting of an oxiranyl group and an oxetanyl group.